<p>➀ Objective Analysis' Jim Handy analyzes the growth trajectory of the chiplet market, highlighting its current state and future potential; </p><p>➁ The article discusses how chiplets address semiconductor scaling challenges through modular designs and heterogenous integration, enabling cost-effective solutions for advanced nodes; </p><p>➂ Key focus areas include 3D IC packaging advancements, ecosystem collaboration, and market adoption across AI, HPC, and consumer electronics.</p>