➀ Marvell Technology introduces a 64Gbit/s bi-directional die-to-die interconnect for xPUs on 2nm and 3nm processes;
➁ The interface achieves over 30Tbit/s/mm bandwidth density, exceeding UCIe by 3x, with adaptive power management reducing consumption by up to 75%;
➂ Features include redundant lanes, automatic repair, and a complete stack spanning application bridge, link layers, and physical interconnect.
