➀ Alphawave Semi taped out a 64Gbps UCIe D2D IP subsystem on TSMC's 3nm technology, doubling bandwidth density and enabling chiplet-based architectures for AI and datacenters;
➁ The solution supports Co-Packaged Optics (CPO) and offers 8x higher bandwidth density than conventional interfaces, with advanced reliability features like per-lane health monitoring;
➂ Collaboration with TSMC highlights a focus on high-performance, energy-efficient computing, strengthening Alphawave's AI platform for scalable systems.