<p>➀ Chiplets enable modular integration of multiple silicon dies, improving compute performance and reducing manufacturing costs for complex SoCs and processors; </p><p>➁ They support heterogeneous design flexibility by combining different process nodes and materials to optimize power, performance, and area; </p><p>➂ Chiplet architectures address semiconductor scaling challenges while meeting demands for AI, HPC, and advanced packaging solutions.</p>
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