<p>➀ Indium Corporation introduced WS-910, a water-soluble flip-chip flux designed for next-gen semiconductor packaging to address complex assembly challenges;</p><p>➁ The flux enables residue-free cleaning with room-temperature deionized water and maintains stability for large dies during reflow processes;</p><p>➂ It supports Pb-free applications, high-Sn solders, and high-I/O designs, offering compatibility with various ultrafiltration systems.</p>