04/10/2025, 05:36 AM UTC
下一代人工智能基础设施中的数字信号处理器DSPs For Next-Generation AI Infrastructure
➀ 博通推出了两款新的200G/通道DSP PHY设计，Sian3和Sian2M，以满足不断增长的人工智能和机器学习集群连接需求。
➁ Sian3基于3nm技术，为基于单模光纤的800G和1.6T模块提供了最低功耗，相比其前代产品，在功率使用上减少了20%以上。
➂ Sian2M针对人工智能集群的短距离多模光纤链接进行了优化，集成了VCSEL驱动器，并利用博通的200G VCSEL技术，提升了性能和效率。
➀ Broadcom has introduced two new 200G/lane DSP PHY designs, Sian3 and Sian2M, to address the growing demand for AI and machine learning cluster connectivity.
➁ Sian3, built on 3nm technology, offers the lowest power consumption for SMF-based 800G and 1.6T modules, improving on its predecessor by reducing power usage by over 20%.
➂ Sian2M is optimized for short-reach MMF links in AI clusters, featuring an integrated VCSEL driver and leveraging Broadcom's 200G VCSEL technology for enhanced performance and efficiency.
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