➀ The article discusses the potential of diamond semiconductors to revolutionize power electronics due to their unmatched thermal conductivity and wide bandgap.
➁ Researchers at Saga University have developed the first diamond n-channel MOSFET, demonstrating high field-effect mobility and stability at high temperatures.
➂ Companies like Adamant Namiki Precision Jewel Co, Ltd, Saga University, Element Six, and Cree are leading the way in diamond semiconductor research and commercialization.
➀ Engineered substrate technology is driving the semiconductor industry from traditional planar scaling to innovative materials and 3D integration.
➁ Companies like Soitec, Intel, and Samsung are leading the adoption of this technology.
➂ Foundries are increasingly recognizing the strategic importance of engineered substrates like Fully Depleted SOI (FD-SOI) for their benefits in cost and performance.
The article discusses the development of cost-effective silicon carbide (SiC) power electronics through research projects like ThinSiCPower. It highlights the advantages of SiC over traditional silicon, emphasizing the need for reducing costs and improving thermal-mechanical stability. The project focuses on creating thin SiC chips and cost-effective substrates without the need for sawing and grinding, aiming to accelerate the market penetration of efficient SiC power electronics.
➀ The development history of semiconductor materials, from the first generation to the third generation;
➁ The unique physical properties of silicon carbide (SiC) and gallium nitride (GaN), such as wide bandgap, high breakdown field, high electron mobility, and excellent thermal conductivity;
➂ The market landscape of SiC and GaN, including market size, key players, and application areas.
➀ Multiple SiC-related projects in China have made new progress, including the commencement and production of new projects.
➁ Fastest has accelerated the progress of its SiC electro-control project, aiming to produce 2.5 million sets of synchronizers and 100,000 sets of motor electro-control systems annually.
➂ Tianyi Semiconductor is conducting pilot studies on SiC crystal rod processes.
➃ The project for producing Moissanite and SiC materials in Gongcheng, Guilin, has commenced.
➄ Daye Carbon is set to produce ultra-fine and ultra-pure graphite powder and other products for semiconductor chips and SiC chips.
➅ YiYuan Semiconductor's SiC project is expected to be completed and put into production next year.
➀ Wolfspeed's second 8-inch SiC factory, the Chatham Materials Factory, is set to be completed and launched.
➁ The factory is expected to be fully taken over by Wolfspeed by March 2024 and will begin production in June 2024.
➂ The factory, covering 220 million square feet, is currently undergoing final construction work, and Wolfspeed is testing SiC ingot production.
➀ Infineon expands its SiC collaboration in the automotive sector with Forvia Hella's next-generation 800V DC/DC charging solution.
➁ Mitsubishi Electric joins the EU's 'FLAGCHIP' project to develop new SiC power module technology for wind power generation systems.
➂ SiChuangzhi Technology's SiC modules enter commercial storage applications, improving efficiency.
➃ BMW and Porsche to release new SiC vehicles with significant energy savings and improved performance.
➄ Chinese Academy of Sciences' self-developed SiC devices pass aviation verification for space applications.
➅ Southern Grid and Fraunhofer iSE accelerate the development and application of SiC in power grid facilities.
➀ Xilinx Integration and Guangqi Aion have signed a strategic cooperation agreement to establish a joint laboratory for automotive semiconductor technology research and development.
➁ XiZhi Technology has achieved a delivery milestone of over 20,000 units of its 800V platform high-end electric drive SiC-DCM power modules.
➂ Jingchi Machinery has successfully passed customer verification for its 8-inch SiC resistive crystal growth furnace.
➀ SunPower Electric announced the production of the 2 millionth unit, marking a significant milestone in the electric vehicle control and power supply field;
➁ The newly produced hybrid dual-control HEM38 product is based on the mature TPAK parallel power module and is equipped with a SiC step-up module, achieving an efficiency of up to 99.9%;
➂ The SiC motor controller has been successfully integrated into Geely's new hybrid model, the Starship 7 EM-i;
➃ The Starship 7 EM-i is Geely's first plug-in hybrid electric vehicle (PHEV) based on the GEA new energy exclusive architecture;
➄ Several leading car manufacturers such as BYD, Toyota, Hongqi, Chery, and Kia have also introduced hybrid models with SiC-based DHT systems.
➀ Five new SiC-related projects have been announced with an investment exceeding 200 billion yuan;
➁ Tarq Semiconductors and HCL's Vama Sundari Investments are investing 27.65 billion yuan in two semiconductor manufacturing factories in Yeadon, India;
➂ Shanghai Fuanyuan Technology Co., Ltd. is investing 115 million yuan in a SiC module packaging equipment R&D and production project;
➃ Huaxin邦 is investing in a SiC chip advanced packaging process line in Haikou, Hainan Province;
➄ Powerex has received 2 million yuan in subsidies from the U.S. Chips and Science Act to expand SiC module production lines;
➅ Heraeus has opened a ceramic substrate factory in Changshu, Jiangsu Province.
➀ Four SiC-related projects in China and abroad are making progress in construction.
➁ Jining's semiconductor packaging and testing base project phase two has started construction.
➂ Vishay's Newport 8-inch wafer factory has begun the first phase of construction with an initial investment of 4.65 billion RMB.
➃ Yinxinwei's IGBT/SiC power module manufacturing plant has opened, with a monthly capacity of up to 200,000 units.
➄ Jinchai Machine's semiconductor material equipment R&D and production project has been put into operation.
