02/27/2025, 09:17 AM UTC
薄片芯片和坚固基板——高效硅碳化物功率电子的关键技术Thin Chips and Robust Substrates – Key Technologies for Cost-Effective Silicon Carbide Power Electronics
本文讨论了通过像ThinSiCPower这样的研究项目来开发成本效益高的硅碳化物（SiC）功率电子。它强调了SiC相对于传统硅的优势，着重于降低成本和改善热机械稳定性的需求。该项目专注于在不需锯切和研磨的情况下制造薄硅碳化物芯片和成本效益高的基板，旨在加速高效硅碳化物功率电子的市场渗透。
The article discusses the development of cost-effective silicon carbide (SiC) power electronics through research projects like ThinSiCPower. It highlights the advantages of SiC over traditional silicon, emphasizing the need for reducing costs and improving thermal-mechanical stability. The project focuses on creating thin SiC chips and cost-effective substrates without the need for sawing and grinding, aiming to accelerate the market penetration of efficient SiC power electronics.
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