➀ The UK government announced a £10 million semiconductor innovation funding program, claiming it will drive technological advancements across industries;

➁ The budget is widely criticized as inadequate, with TSMC's equivalent capital expenditure for just three hours dwarfing the entire UK initiative;

➂ Industry experts and commentators ridicule the initiative's disconnect from reality, highlighting bureaucratic inefficiencies and lack of strategic alignment with semiconductor sector needs.

➀ Alphawave Semi taped out a 64Gbps UCIe D2D IP subsystem on TSMC's 3nm technology, doubling bandwidth density and enabling chiplet-based architectures for AI and datacenters;

➁ The solution supports Co-Packaged Optics (CPO) and offers 8x higher bandwidth density than conventional interfaces, with advanced reliability features like per-lane health monitoring;

➂ Collaboration with TSMC highlights a focus on high-performance, energy-efficient computing, strengthening Alphawave's AI platform for scalable systems.

➀ Global semiconductor equipment spending surged 23% YoY in Q2 2025, reaching $33.07B, with China ($11.36B), Taiwan ($8.77B), and South Korea leading regional investments.

➁ North America’s spending declined due to wafer fab delays (Intel, Micron, Samsung) amid administration policy shifts, while TSMC drove Taiwan’s 125% growth through aggressive CapEx.

➂ 2025 global CapEx is projected at $160B (+3% YoY), but 2026 forecasts vary; concerns grow over U.S. CHIPS Act implementation under Trump’s equity-focused strategy.

➀ TSMC has secured 15 customers for its 2nm process (N2) with wafer prices at $30,000 each, including 10 dedicated to high-performance computing (HPC);

➁ Apple reserved half of TSMC's 2nm capacity by booking all initial output at the Baoshan fab, while other clients like Nvidia, Intel, and Google will use the Kaohsiung fab;

➂ TSMC’s 2nm production is projected to reach 45-50k wafers per month in Q4 2025, generating $1.8-3 billion in revenue, with plans to expand to 200k wpm by 2028.

➀ Apple has reportedly secured a majority of TSMC's 2nm chip production capacity to gain an early advantage;

➁ TSMC's N2 is the only 2nm-class fab available to fabless customers, with Apple getting priority treatment;

➂ The northern fab in Hsinchu Baoshan is reportedly fully dedicated to Apple's new chips, while the southern fab in Kaohsiung handles other customers.

➀ TSMC increased EUV-driven wafer production by 30x since 2019 and reduced tool power consumption by 24% through system-level optimizations;

➁ The company developed proprietary EUV pellicles with 4x lifespan and 80x lower defects, planning to retrofit a 200mm fab for mass production;

➂ TSMC enhanced photomask accuracy, planarization, and energy efficiency techniques to solidify its dominance in advanced semiconductor manufacturing.

➀ NVIDIA reportedly becomes TSMC's first A16 node customer for its Feynman AI GPUs, breaking Apple's decade-long tradition of adopting TSMC's leading-edge processes with iPhones;

➁ A16, TSMC's 1.6nm-class process, integrates GAA transistors and backside power delivery, offering 8-10% speed gain and improved power efficiency, tailored for AI/HPC applications;

➂ NVIDIA's strategic move to skip N2 for A16 could secure a full-node advantage over AMD and Intel, positioning Feynman GPUs as pioneering AI chips with cutting-edge architecture by 2028.

➀ MediaTek and TSMC collaborate on a new SoC using 2nm process technology to enhance smartphone performance and energy efficiency;

➁ TSMC's N2P 2nm process offers 18% higher performance, 36% reduced power consumption, and 1.2× logic density improvement;

➂ Targeting smartphones, automotive, and data centers, mass production is expected by late 2026.

➀ MediaTek has developed its first 2nm chip using TSMC's nanosheet transistor technology, with mass production set for late 2026;

➁ The 2nm process achieves 18% performance gain, 36% power reduction, and 1.2x logic density improvement over 3nm technology;

➂ This collaboration strengthens MediaTek's leadership in AI, 5G/6G, and smart devices while shaping next-gen automotive and HPC solutions

➁ TSMC partnered with local beekeepers to produce ‘Ji Mi’ honey, utilizing restored ecosystems around its fabs;

➂ The company's environmental efforts include 90% water recycling and 97% waste reuse rates, aligning with sustainability goals;

➃ Native species like fireflies and silver goby returned, signaling restored ecological balance near TSMC facilities.

➀ Global foundry revenue hit a record $41.7B in 2Q25, up 14.6% QoQ, driven by China's consumer subsidies and early inventory buildup;

➁ TSMC dominated with 70% market share as capacity utilization and wafer shipments surged;

➂ TrendForce highlights stronger H2 demand from new smartphone/PC launches and AI server deployments.

➀ TSMC doubled its Arizona internship program to over 200 students, targeting talent for its advanced 4nm and future 2nm fabs;

➀ The U.S. government's $6.6B CHIPS Act supports TSMC’s third Arizona fab, aiming to create 6,000 jobs and onshore advanced chip production;

➂ Partnerships with ASU, Amkor’s $2B packaging facility, and state-funded apprenticeships strengthen the U.S. semiconductor ecosystem.

➀ TSMC released its 2024 Sustainability Report, committing to net zero by 2050 and achieving 104.2 billion kWh energy savings in 2024 (reducing 44 million tons of CO₂);

➁ Environmental initiatives include 60% renewable energy by 2030, water stewardship goals, and a supplier carbon reduction program targeting Scope 3 emissions;

➂ Social efforts feature workplace equity (40% women workforce), NT$2.44B social investments, and governance milestones with NT$2.95T revenue (69% from cutting-edge 7nm processes).

➀ TSMC dominates 2nm/3nm foundry with over 90% market share, achieving $60.5B H1 2025 revenue;

➁ 2nm HVM to start in Q4 2025 with early yield success;

➂ Global expansion includes profitable Arizona fab and 1.4nm R&D under Taiwan's tech protection laws