➀ The Ferdinand-Braun-Institut (FBH) showcases advancements in UV-C LEDs for medical disinfection and gas sensing, emphasizing efficiency and safety;

➁ Introduces miniaturized UV-C diode laser modules (UV-COLA project) for targeted disinfection in healthcare, developed with TU Chemnitz;

➂ Presents gallium arsenide (GaAs)-based photonic integrated circuits for quantum technologies, spectroscopy, and biosensing, enabled by silicon nitride PIC integration.

➀ PI introduces the A-361 air-bearing XY-rotation stage, a compact 3-axis nanopositioning platform with a 39.5 mm profile, 200 mm motion diameter, 5 mm X/Y travel, and 2° rotational motion;

➁ Utilizes frictionless air bearings and voice-coil direct drives for high stability, maintenance-free operation, and a vacuum chuck for delicate substrates like wafers;

➂ Designed for semiconductor, photonics, and µLED manufacturing applications, supporting cleanroom environments and integration with multi-axis systems for precision alignment tasks.

➀ Fraunhofer IZM and Akhetonics collaborate on developing a scalable all-optical quantum processor using light-based data processing, which promises 60x energy savings and higher bandwidth compared to electronic systems;

➁ The project employs advanced packaging technologies like glass-based interposers and photonic wire bonding, enhancing component integration efficiency by 50% and targeting miniaturization;

➂ Funded by Investitionsbank Berlin with €400,000, the SPOC initiative (2024-2026) aims to create a fully optical quantum computing platform through hybrid integration of optical materials.

➀ Lightmatter developed a 16-wavelength DWDM optical link on a single strand of standard single-mode fiber, enhancing data center bandwidth and scalability for trillion-parameter AI models;

➁ The technology overcomes challenges like wavelength-dependent propagation, thermal drift (via a digital stabilization system), and polarization sensitivity, enabling cost-effective SM fiber use;

➂ Lightmatter raised $850 million, including a $400M Series D round at a $4.4B valuation, reflecting confidence in its photonic computing innovations.

➀ PI introduced a high-bandwidth lever-hexapod with direct-driven actuators, offering faster speeds and reduced wear compared to traditional screw-driven systems;

➁ The hexapod achieves 50 nm resolution in all linear and rotational degrees of freedom, ideal for precision tasks in optics and photonics;

➂ Its compact design addresses industry needs for smaller footprints and higher throughput in industrial nanopositioning applications.

➀ The PUNCH project, led by Fraunhofer IZM and IMEC, develops photonic integrated circuits (PICs) to enable ultra-fast, low-latency data transmission, targeting applications in data centers and traffic networks;

➀ PICs combine optical signaling with electronic chips using Fan-Out Wafer Level Packaging, boosting network speeds from 200 Gb/s to 1.6 Tb/s while reducing energy consumption and costs;

➂ Supported by EU Horizon Europe funding, the project involves collaborations with NVIDIA, Ericsson, and the University of Cambridge and aims to finalize a scalable solution by 2026.

➀ Fraunhofer ILT and TNO jointly developed and launched a quantum internet node to serve as a research platform for advancing secure quantum communication and network protocols;

➁ The system leverages NV centers in diamonds and entangled photons to enable tap-proof data transmission, with photonic components like quantum frequency converters ensuring efficient long-distance communication;

➂ The node aims to establish a European test network, fostering collaboration across academia and industry to optimize photonic technologies and develop heterogeneous quantum network interfaces.

➀ Fraunhofer ILT initiated a quantum internet node developed with TNO, serving as a research platform to locally test and advance photonic components such as quantum frequency converters and single-photon sources.

➁ The quantum internet enables ultra-secure communication through entangled particles, with future applications like blind quantum computing and distributed quantum systems, though challenges remain in photon transmission stability and noise reduction.

➂ The node in Aachen is a cornerstone for Europe’s quantum network, emphasizing collaboration with industry and academia to optimize photonic technologies and establish compatibility for future quantum internet infrastructure.

➀ Fraunhofer IOF researchers advanced thin-film lithium niobate (LNOI) technology to develop photonic integrated circuits (PICs), enabling energy-efficient, high-speed optical systems for quantum computing and AI;

➁ The PhoQuant project aims to build a photonic quantum computer using LNOI-based optical components, eliminating the need for complex cooling and enabling scalable quantum internet applications;

➂ LNOI circuits achieve 100 GHz processing speeds with low-voltage control, offering high bandwidth and multi-wavelength signal processing for AI tasks, showcased at World of Quantum 2025.

➀ Fraunhofer IOF researchers developed thin-film lithium niobate (LNOI) technology to create integrated photonic circuits, enabling energy-efficient and scalable photonic systems for high-speed applications;

➁ The LNOI-based technology is applied in the PhoQuant project to build photonic quantum computers requiring no cryogenic cooling, using quantum light sources and processing in integrated circuits;

➂ The circuits also enhance AI and data processing capabilities, operating at 100 GHz speeds with low voltage, offering higher bandwidth and energy efficiency compared to conventional electronics.

➀ Imec and TNO have launched the Holst Centre Photonics Lab in the Netherlands, partially funded by PhotonDelta, to accelerate photonics R&D.

➁ The lab combines imec's expertise in tape-out validation, on-chip lasers, and system testing with TNO's strengths in free-space optics and photonic integration, fostering industry-academia collaboration.

➂ Focused on applications like LiDAR, medical diagnostics, and quantum technologies, the initiative aims to strengthen the Netherlands' leadership in integrated photonics across automotive, healthcare, and data communication sectors.

The Fraunhofer Institute for Photonics Microsystems (IPMS) is involved in an interdisciplinary research project called 'InSeKT' (Development of Intelligent Sensor Edge Technologies). This project, carried out by the Technical University of Wildau, the Leibniz Institute for Innovative Microelectronics (IHP), and the Fraunhofer IPMS, aims to integrate artificial intelligence (AI) more effectively at the 'edges' of IT networks. The project focuses on miniaturized sensor structures and the integration of electronic components, with the goal of enabling complex calculations directly at the data source, such as at the sensor itself.

Current data processing with AI often occurs through central cloud computing solutions, leading to data transfer over large distances and potential data leaks. The project addresses this by promoting decentralized data processing for improved data security and real-time system capabilities.

The project covers various areas, including gas analysis using ion mobility spectrometers (IMS), data-supported evaluation of photodetectors for the near-infrared wavelength range, and the adapted use of capacitive microelectromechanical ultrasonic transducers (CMUTs) for improved imaging. The generated data will be used to train Edge-KI systems for fast and accurate data processing.

➀ Photonic computing chips, which combine light and electricity, have been proven to enhance computing performance while reducing energy consumption compared to traditional electronic chips.

➁ Two recent studies demonstrated the capabilities of integrated photonic and electronic chips in performing key AI operations like multiplication and accumulation more efficiently.

➂ A large-scale photonic accelerator and another processor showed promising results in solving complex computational tasks and executing AI models such as BERT and ResNet with high accuracy.

The Fraunhofer IZM researchers have developed a laser welding process for connecting PICs with optical fibers without adhesives, which can operate at cryogenic temperatures. This technology promises more reliable, faster, and cheaper fiber-PIC connections, revolutionizing quantum technology applications.

Low temperatures are essential for observing quantum effects, which can significantly impact quality of life. The QWeld project focuses on cryogenic quantum computing systems and the integration of PIC-based modules for secure communication and connections in quantum computing.

The technology is durable, reproducible, and can be automated, making it suitable for large-scale production of PICs for quantum systems.

The researchers at Fraunhofer IZM have developed a glue-free laser welding process for coupling photonic integrated circuits (PICs) with optical fibers, which can also be used in cryogenic environments of up to four Kelvin, equivalent to -269.15°C. This technology offers a more reliable, faster, and cheaper fiber-PIC coupling through a direct quartz-quartz connection, revolutionizing applications in quantum technology.

Low-temperature environments are essential for observing quantum effects, which can greatly improve human quality of life, such as in big data processing for personalized medicine and hospital information management. The development of cryogenic systems for quantum computing is currently being actively promoted. Quantum technological systems with implemented PIC-based modules offer a compact solution for secure communication and networking in quantum computing. Reliable fiber optic connections are, however, a fundamental requirement for such photonic quantum systems.

The focus of the QWeld research project is on realizing this connection technology for applications in cryogenic environments. Standard CMOS-manufactured PICs with a silicon dioxide (SiO2) coating are used, which is necessary for glass-glass laser welding. A vertical coupling of the fiber with the PIC, typically with a specific angle, is a special feature. The laser meets the contact point between the PIC and the fiber on both sides during welding and creates a material-bonding connection within seconds. This manufacturing process offers significant time savings.

➀ Imec has developed a proof-of-concept photonics-enabled CDM FMCW radar system that ensures coherent chirps to remote radar units.

➁ This technology could revolutionize next-generation driver assistance solutions and other high-precision sensing applications.

➂ The system utilizes a phase encoder with code-division multiplexing and optical signal distribution for low-loss transmission.

➀ X-FAB, SMART Photonics, and Epiphany Design are collaborating to develop a photonics integration platform that combines InP and SOI technologies for multi tera-bit data rates.

➁ The platform aims to address customer requirements for high-speed data rates and energy efficiency in the manufacturing of optical transceivers.

➂ The collaboration has resulted in the development of a design flow and PDK that enables the design of photonics circuits integrating InP chiplets on an SOI platform.

➀ Aeluma通过结合高性能材料和可扩展的硅制造技术，重新定义了半导体技术；

➁ Aeluma的技术在AI基础设施、国防、量子计算和下一代传感等领域产生了重大影响；

➂ Aeluma正在解决AI和高性能计算在扩展方面遇到的挑战，通过集成化合物半导体和大型衬底来实现大规模生产。