04/08/2025, 08:05 AM UTC
借助先进的激光焊接工艺，量子技术实现可靠的纤维-PIC连接Reliable Fiber-PIC Connections for Quantum Technology Thanks to Advanced Laser Welding Process
弗劳恩霍夫I ZM研究所的研究人员开发了一种无胶激光焊接工艺，用于将光子集成电路（PIC）与光纤耦合，该方法也可在高达四开尔文的低温环境中使用，相当于-269.15°C。这项技术通过石英-石英直接连接，提供了更可靠、更快、更便宜的纤维-PIC耦合，从而在量子技术领域引发了革命。
低温环境对于观察量子效应至关重要，这可以极大地改善人类生活质量，例如在大数据处理、个性化医学和医院信息管理中。目前正积极推动量子计算用低温系统的发展。具有实施PIC模块的量子技术系统提供了量子计算中安全通信和网络连接的紧凑解决方案。然而，可靠的光纤连接是此类光子量子系统的基础要求。
QWeld研究项目的重点是实现这种连接技术在低温环境中的应用。使用标准CMOS制造的PIC，但需要二氧化硅（SiO2）涂层，这是玻璃-玻 璃激光焊接所必需的。光纤与PIC的垂直耦合，通常具有特定的角度，是一个特殊特征。在焊接过程中，激光在PIC和光纤的接触点两侧相遇，并在几秒钟内形成材料结合连接。这种制造工艺提供了显著的时间节省。
The researchers at Fraunhofer IZM have developed a glue-free laser welding process for coupling photonic integrated circuits (PICs) with optical fibers, which can also be used in cryogenic environments of up to four Kelvin, equivalent to -269.15°C. This technology offers a more reliable, faster, and cheaper fiber-PIC coupling through a direct quartz-quartz connection, revolutionizing applications in quantum technology.
Low-temperature environments are essential for observing quantum effects, which can greatly improve human quality of life, such as in big data processing for personalized medicine and hospital information management. The development of cryogenic systems for quantum computing is currently being actively promoted. Quantum technological systems with implemented PIC-based modules offer a compact solution for secure communication and networking in quantum computing. Reliable fiber optic connections are, however, a fundamental requirement for such photonic quantum systems.
The focus of the QWeld research project is on realizing this connection technology for applications in cryogenic environments. Standard CMOS-manufactured PICs with a silicon dioxide (SiO2) coating are used, which is necessary for glass-glass laser welding. A vertical coupling of the fiber with the PIC, typically with a specific angle, is a special feature. The laser meets the contact point between the PIC and the fiber on both sides during welding and creates a material-bonding connection within seconds. This manufacturing process offers significant time savings.
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