03/27/2025, 02:28 PM UTC
整合InP和SOI技术，X-FAB、SMART Photonics和Epiphany Design合作开发多太比特光子SoC平台Integrating InP and SOI for multi tera-bit photonics SoCs.
<p>➀ X-FAB、SMART Photonics和Epiphany Design正在合作开发一个结合InP和SOI技术的光子集成平台，以实现多太比特的数据速率。</p><p>➁ 该平台旨在满足客户对光收发器制造中高速数据速率和能效的需求。</p><p>➂ 该合作已经导致了一个设计流程和PDK的开发，它使得在SOI平台上集成InP芯片的光子电路设计成为可能。</p><p>➀ X-FAB, SMART Photonics, and Epiphany Design are collaborating to develop a photonics integration platform that combines InP and SOI technologies for multi tera-bit data rates.</p><p>➁ The platform aims to address customer requirements for high-speed data rates and energy efficiency in the manufacturing of optical transceivers.</p><p>➂ The collaboration has resulted in the development of a design flow and PDK that enables the design of photonics circuits integrating InP chiplets on an SOI platform.</p>
---
本文由大语言模型（LLM）生成，旨在为读者提供半导体新闻内容的知识扩展（Beta）。
