➀ Fraunhofer IZM and partners developed a modular quantum cascade laser (QCL) system on a glass board, enabling compact and precise multispectral infrared (MIR) spectroscopy for applications in medical, environmental, and industrial fields.

➁ The system integrates up to three QCLs with programmable nanosecond pulses, temperature-stabilized cavities, embedded drivers, and optical components, allowing operation in harsh environments and miniaturizing traditionally bulky analytical devices.

➂ Funded by the Berlin IBB and EU’s EFRE program, the project builds on prior thin-glass platform research, aiming to democratize advanced spectroscopy technology for SMEs through cost-effective, scalable R&D solutions.

➀ The PUNCH project, led by Fraunhofer IZM and IMEC, develops photonic integrated circuits (PICs) to enable ultra-fast, low-latency data transmission, targeting applications in data centers and traffic networks;

➀ PICs combine optical signaling with electronic chips using Fan-Out Wafer Level Packaging, boosting network speeds from 200 Gb/s to 1.6 Tb/s while reducing energy consumption and costs;

➂ Supported by EU Horizon Europe funding, the project involves collaborations with NVIDIA, Ericsson, and the University of Cambridge and aims to finalize a scalable solution by 2026.

➀ The PUNCH project, coordinated by IMEC and led by Fraunhofer IZM, aims to develop optical switches to accelerate data networks, achieving 8x faster transmission than conventional methods for applications in data centers and traffic networks;

➁ Researchers integrate photonic integrated circuits (PICs) with electronic chips using heterogenous Fan-Out Wafer Level Packaging (FOWLP), boosting network speeds to 1.6 Tb/s and improving scalability for mass production;

➂ The technology promises reduced latency, lower energy consumption, and guaranteed service quality, with potential use cases in automotive communication and video streaming.

➀ Dr. Lutz Stobbe received the 2025 Fraunhofer IZM Research Prize for pioneering research in sustainable ICT, focusing on lifecycle environmental assessment models for digital infrastructure like data centers and network technologies;

➁ His methods combine quantitative data analysis with modular chip design and circular economy principles to identify ecological hotspots and drive eco-friendly microelectronics;

➂ As a cross-disciplinary leader, he bridges technical research and stakeholder communication, advocating for repairability and recyclability in future digital systems.

➀ Dr. Lutz Stobbe received the 2025 Fraunhofer IZM Research Award for pioneering work on ecological life cycle assessments of ICT infrastructure, focusing on data centers and network technologies;

➁ His research provides granular data on energy, materials, and production processes, enabling eco-design improvements like modular chip manufacturing;

➂ Stobbe advocates for circular economy principles in microelectronics, emphasizing reusability and recyclability while bridging technical analysis with stakeholder communication.

➀ The COMS©Blue system, developed by Fraunhofer IZM and partners, combines near-UV light and pulsed magnetic fields to treat surgical wound infections, reducing reliance on antibiotics;

➁ The compact device employs advanced thermal management for LEDs to prevent overheating and integrates real-time software for monitoring bacterial load and treatment progress;

➂ Funded by Eurostars, this innovation aims to accelerate healing, lower hospitalization costs, and combat antibiotic-resistant bacteria.

➀ Fraunhofer IZM marks its 20th anniversary as a member of IVAM, highlighting its role in advancing microtechnology and fostering international collaboration;

➁ The institute pioneered early focus groups like 'Wearables and Smart Textiles' and now supports the new 'Sensors' group with Detect Network, addressing applications in healthcare and environmental monitoring;

➂ Through participation in IVAM events and joint projects, Fraunhofer IZM strengthens ties between academia and industry, driving innovations in system integration and microelectronics.

➀ Fraunhofer IZM marks 20 years of membership in IVAM, driving advancements in micro- and nanotechnology while fostering international research and industry collaboration;

➁ The institute spearheaded pioneering focus groups like "Wearables and Smart Textiles" and recently co-founded a new "Sensor Technology" group with IVAM-Detect Network, targeting applications in medical tech and Industry 4.0;

➂ Through events like the IVAM Hightech Summit and COMPAMED-Forum, Fraunhofer IZM shares innovations, strengthens partnerships, and collaborates on R&D projects with academia and industry.

➀ SPAIA is founded to address the decline in insect populations and their critical role in biodiversity and ecosystem health.

➁ The team is working on a scalable global insect data network, combining low-cost hardware and AI software.

➂ SPAIA's technology aims to provide real-time insights into insect activity and biomass intelligence for sustainable environmental management.

➀ The decline of insect biomass in Germany is a serious environmental indicator;

➁ Collette Wasielewski and Tom Cox founded SPAIA to address this issue;

➂ SPAIA is developing an open-source system for global insect data collection and access.

The Fraunhofer IZM, in collaboration with international partners, is working on a new injection molding process as part of the EU Horizon project MULTIMOLD. This process aims to produce environmentally friendly electronics products with maximum design freedom. The focus is on sustainability, including comprehensive life cycle assessments and optimizing resource use in the production process.

The project aims to improve the recyclability of products and reduce their ecological footprint, particularly by developing new methods for separating and reusing the individual layers of the components. The process is currently under development and is being continuously optimized for sustainable production without compromising the performance of electronic products.