➀ EMI通过其美国子公司Capitol Records Ltd. 正在努力收购美国电子产品市场的大部分份额;
➁ 64年前,《电子时报》1961年3月15日的版面上开始讲述这个故事;
➂ Capitol通过收购两家独立电子公司——纽约的霍夫曼电子管公司和洛杉矶的Voi-Shan电子部,成立了名为Electric and Musical Industries (United States) Inc. 的新子公司。
➀ EMI通过其美国子公司Capitol Records Ltd. 正在努力收购美国电子产品市场的大部分份额;
➁ 64年前,《电子时报》1961年3月15日的版面上开始讲述这个故事;
➂ Capitol通过收购两家独立电子公司——纽约的霍夫曼电子管公司和洛杉矶的Voi-Shan电子部,成立了名为Electric and Musical Industries (United States) Inc. 的新子公司。
➀ According to Knight Frank's 2025 Wealth Report, technology was the biggest wealth generator among billionaires in 2024, accounting for $2.6 trillion across 342 billionaires.
➁ However, the largest number of 2024 billionaires – 427 – came from the financial sector.
➂ Over the last decade, manufacturing produced the most new billionaires – 509, half of whom are in China, while technology produced the second highest number – 443, with China leading.
➀ Intel has entered risk production on 18A, a process designed to compete with TSMC's 2nm technology;
➁ Kevin O'Buckley, SVP of Foundry Services, emphasized the importance of risk production in scaling up manufacturing;
➂ The 18A process features backside power delivery, a feature not present in TSMC's 2nm process;
➃ Intel is expected to use the 18A process for its next processor generation, Panther Lake.
➀ TSMC is expected to earn $60 billion in revenues from manufacturing 2nm wafers before Intel makes any significant money from the technology.
➁ The US government's decision to distribute the $250 billion Chips and Science Act money widely is criticized.
➂ Intel's share of the act, $19 billion, seems insufficient compared to TSMC's $30-40 billion 2025 capex and expected revenues.
➀ Matthew Stephens of Impact Nano has over 20 years of experience in advanced materials commercialization.
➁ Impact Nano is a tier 2 supplier specializing in advanced materials for semiconductor manufacturing.
➂ The company addresses challenges in materials innovation, scale-up, and manufacturing sustainability.
➀ YES, a global leader in materials and interface engineering equipment solutions, has shipped the first commercial VeroTherm Formic Acid Reflow tool to a global semiconductor manufacturer from its Sulur, Coimbatore facility.
➁ This marks a significant milestone for YES and the Indian semiconductor ecosystem, as it is the first equipment produced in India for advanced semiconductor applications like HBM.
➂ The Sulur facility, which commenced operations in September 2024, is part of YES's strategic expansion plan to serve global customers more efficiently.
➀ Wevo has introduced a new series of runnier silicone potting gels for faster filling;
➁ The Wevosil series offers lower viscosity than standard products, improving air bubble elimination;
➂ The gels cure into gels rather than elastomers, providing effective protection against environmental influences.
➀ Same Sky’s Interconnect Group has introduced new USB Type-C plug models (UP20, UP31, UP32) supporting USB standards from 2.0 to 3.2 Gen 2, enabling high-speed data transfer up to 10 Gbps and power delivery up to 150W.
➁ These connectors feature a wide operating temperature range (-30°C to 125°C), multiple mounting styles, and a durable design capable of up to 10,000 mating cycles, making them suitable for industrial, automotive, and consumer applications.
➂ Pricing starts at $0.73 per unit for orders of 100 pieces, with bulk order inquiries handled directly by the company or its distribution partners.
➀ The article discusses the latest PID temperature controller E62 developed by BrainChild, which is designed for cost-effective and efficient temperature control across various industries such as manufacturing, automation, HVAC, and research.
➁ The E62 offers multiple input options including thermocouples and resistance temperature detectors, and versatile output options like Relay, 0-20mA, 0-10V, and SSR drive, making it suitable for different applications.
➂ Features like Auto-Tune functionality, parameter lock, and IP65-rated protection ensure reliability and ease of use, making it an ideal choice for temperature management in harsh environments.
➀ TSMC正在与Nvidia、Broadcom、Qualcomm和AMD讨论收购英特尔晶圆厂的合资企业;
➁ Sanan Optoelectronics和STMicroelectronics在重庆合资建立了32亿美元的碳化硅晶圆厂;
➂ 本周嵌入式世界2025展会的最新电子新闻综述;
➃ 德州仪器宣布其最新的微控制器是“世界上最小”的,尺寸为1.6 x 0.86mm;
➄ 美国总统特朗普对格罗夫之后英特尔CEO的表现持批评态度。
➀ TSMC and Intel are reportedly still working on a potential joint venture to run Intel's manufacturing capacity;
➁ The joint venture would involve leading American fabless chip designers such as AMD, Broadcom, Nvidia, and Qualcomm;
➂ The initiative is in response to a request from President Trump's administration to strengthen Intel and ensure continued American control.
➀ An AOI module named Multi Line Assist has been developed by GOEPEL electronic to assist in Through-Hole Technology (THT) assembly. This module provides automated guidance, real-time error detection, and verification for precise component placement.
➁ The module uses a 47-megapixel camera and flexible LED lighting to inspect large areas up to 660 mm x 450 mm. It can detect component presence, position, color, and read barcodes, 2D codes, and text.
➂ Multi Line Assist integrates with existing MES systems and can be used standalone or integrated into existing assembly tables. It aims to improve efficiency, accuracy, and traceability in PCB production processes.
➀ AONDevices, a leader in super-low-power, high-accuracy edge AI solutions, has announced a strategic partnership with Faraday Technology Corporation.
➁ The collaboration aims to enhance AONDevices' production capabilities for its advanced AI processors.
➂ Faraday Technology brings its comprehensive manufacturing expertise to the partnership.
➀ The US Chips Act is under threat after President Trump's speech in Congress;
➁ Trump urged Congress to scrap the Act and use leftover funds for other purposes;
➂ Trump believes tariffs are a better way to support domestic chip-making and cited TSMC's $100 billion investment in Arizona fabs as an example.
➀ Charcroft Electronics has expanded its range of load cells and strain gauges with the acquisition of Sensor Techniques.
➁ Sensor Techniques distributes load cells and strain gauges for industrial, harsh, and ATEX-rated environments.
➂ The acquisition will add decades of expertise to Charcroft's engineering team, including sensor specialist Matt Fellows.
➀ Epishine, a Swedish specialist in printed organic solar cells, is collaborating with tesa, an adhesive tape manufacturer, to develop printed electronics production processes.
➁ The aim is to integrate printed solar cells, flexible sensors, or interactive displays on adhesive substrates.
➂ Jona Bergqvist, CTO of Epishine, highlights the challenges in selecting encapsulation adhesives for organic and printed electronics.
AMD is in talks to sell its AI server assembly plants for up to $4 billion, with potential buyers including Taiwan-based companies. The facilities were acquired from ZT Systems, a leading AI server supplier, and the sale is expected to be a significant transaction in the AI server industry.
The US locations of these plants could provide advantages in avoiding tariffs and import restrictions, making them attractive to potential buyers.
AMD's decision to sell the plants is part of its strategy to focus on design expertise and compete with companies like Nvidia in the AI server market.
➀ A deal between Intel and TSMC has been proposed by the new US administration;
➁ TSMC may take over the management of some or all of Intel's manufacturing sites;
➂ Speculations include the possibility of a joint venture between TSMC and Intel with U.S. chip design companies investing.
➀ The article discusses the potential of manufacturing semiconductors in space, highlighting the advantages of low gravity and vacuum environments, which can lead to higher quality and more efficient chips.
➁ It mentions the challenges, including the high cost of launching equipment to space and the logistical difficulties of setting up and maintaining facilities in space.
➂ Despite these challenges, the potential benefits of space-based semiconductor manufacturing are significant, including reduced carbon emissions, improved chip performance, and the possibility of new technological advancements.