➀ Synopsys.ai Copilot utilizes generative AI to address semiconductor design complexity and workforce shortages, reducing documentation searches by 30% and enabling 20x faster script generation.

➁ Integration with Ansys and partnerships with Microsoft/NVIDIA enhance multi-physics simulation capabilities and cloud scalability, supporting advanced 3D IC and SoC designs.

➂ Early adopters like Intel and AMD report 35% productivity gains, while upcoming autonomous workflow tools like 3DSO.ai aim to revolutionize chip design efficiency.

➀ In-Circuit Emulation (ICE) emerged as a breakthrough in semiconductor verification, enabling 1,000x faster testing than traditional HDL simulations through FPGA-based hardware platforms;

➁ Early ICE faced limitations with rigid speed adapters and non-deterministic debugging, prompting a shift to virtual transaction-based verification by the 2000s for improved flexibility and software co-verification;

➂ Modern 3rd-gen speed adapters integrate real PHY layers, 100Gbps bandwidth, and multi-user deployment, bridging functional and system-level validation for complex SoCs.

➀ Multi-die architectures using UCIe protocol face verification challenges including inter-die communication and evolving protocol features;

➁ Siemens EDA's Questa One Avery™ VIP provides layered verification with AI-driven coverage and configurable testbenches;

➂ The solution supports compliance testing, real-time performance monitoring, and scalability from simulation to hardware prototyping.

➀ Modern IC verification complexity demands orchestrated workflow systems akin to conducting an orchestra, enabling unified management of tasks across tools and teams;

➁ Fragmented verification processes lead to inefficiencies such as manual errors and resource bottlenecks, while orchestration systems provide automation, intelligent resource allocation, and centralized monitoring;

➂ Siemens' Calibre MJS exemplifies this approach, reducing runtime by 30%-50% and improving design iteration efficiency through features like single-layout streaming and license optimization.

➀ Basilisk is a groundbreaking RISC-V SoC developed with fully open-source EDA tools, demonstrating Linux capability on industrial-grade silicon via mature 130nm BiCMOS process；

➁ The project challenges traditional IP/EDA business models, highlighting U.S. incumbents' innovation stagnation versus rapid progress in Europe and China pursuing sovereign chip ecosystems；

➂ Open-source tools like Yosys and OpenROAD achieved silicon success with 64-102MHz operation, GPU-like voltage scalability, and energy efficiency optimization, enabling next-gen 22nm FD-SOI designs

➀ Siemens and Perforce discussed their collaboration on integrating IP lifecycle management (IPLM) with semiconductor tools, emphasizing software-defined products and system-level verification;

➁ The digital twin approach and metadata interoperability across EDA tools enable traceability from requirements to verification, critical for automotive and safety-critical systems;

➂ AI-powered tools and data lakes are leveraged to optimize verification efficiency and manage design decisions across hardware-software co-development.

➀ Siemens and Perforce integrate digital twins with version control to streamline semiconductor design workflows;

➁ The partnership establishes traceable digital threads across chip design lifecycle using Siemens' virtual simulation and Perforce's data management;

➂ This collaboration addresses complex challenges in AI-driven chip architectures while targeting $1 trillion semiconductor market growth by 2030.

➀ The paper compares UVM and Python-based Cocotb for AES hardware verification, showing Cocotb's 89.55% code coverage vs. UVM's 87.49%, but raises questions about UVM's low functional coverage (47/64 cases) without clear explanations;

➁ UVM demonstrated faster simulation time (1000ns vs. Cocotb's 10,000.5ns), though experts note Cocotb's flexibility with Python libraries and simpler synchronization offer workflow advantages for early RTL development;

➂ Cadence's Paul Cunningham highlights UVM's commercial EDA tool integration and constraint solver optimizations, while Raúl Camposano observes Cocotb's growing relevance in AI-driven verification ecosystems despite the paper's methodological limitations.

➀ NVIDIA and Cadence collaborate to address critical pre-silicon power estimation challenges for AI chips through advanced emulation and DPA technology;

➁ Traditional power estimation methods face scalability and accuracy limitations with AI's billion-gate designs and complex workloads, necessitating gate-level analysis with full benchmark coverage;

➂ Cadence's new DPA App on Palladium Z3 achieves 97% post-silicon power correlation by executing billion-cycle emulations in hours, enabling precise optimization for energy-efficient AI hardware design.

➀ Semiconductor design faces high barriers due to proprietary EDA tool monopolies;

➁ Open-source EDA tools and PDKs are reducing costs and enabling innovation in education and commercial projects;

➂ Challenges persist in advanced node support and industry adoption despite security and accessibility advantages.

➀ Part 2 introduces cutting-edge EDA tools for engineers to manage increasing chip complexities;

➁ Focuses on solutions for larger chip designs, tighter process nodes, and accelerated development timelines;

➂ Emphasizes maintaining quality standards while overcoming scaling challenges in semiconductor engineering.

➀ Researchers developed an on-chip THz multiplexer using inverse design and quantum cascade lasers, operating in the 2.2–3.2 THz range;

➁ The compact device (200×200 µm) integrates III–V semiconductors and polymer waveguides, achieving three broadband channels with low crosstalk;

➂ Applications include THz communication and spectroscopy, demonstrating potential for scalable photonic integration beyond telecom wavelengths.

➀ Breker tackles the challenges of automating verification by addressing rapid spec changes and ambiguous requirements through AI-driven approaches;

➁ Their strategy combines traditional NLP-based methods for deterministic test synthesis with future LLM partnerships to enhance scalability;

➂ The approach emphasizes a 'principled' foundation to ensure reliability, leveraging decades of verification expertise in RISC-V, Arm, and SoC validation.

➀ Rise Design Automation showcased a next-gen HLS methodology at DAC, blending SystemVerilog/C++/SystemC with AI-driven tools to boost design efficiency;

➁ Their platform integrates LLM-based AI advisors for code generation and verification acceleration, achieving 100X-1,000X faster verification through high-level abstraction;

➂ The solution enables multi-language design exploration, automated testbench creation, and interoperability with EDA tools like VCS and Open ROAD, targeting area/power/performance optimization.

➀ Siemens, Arm, and the University of Southampton launched the Cre8Ventures Open Higher Education Programme, integrating Siemens' Digital Twin Marketplace, Arm's developer resources, and academic lab-to-fab capabilities;

➁ The program provides students with industrial-grade EDA tools, startup support, and commercialization pathways to bridge academia with industry;

➂ Supported by the Semiconductor Education Alliance, it aligns with the EU Chips Act’s goals to cultivate semiconductor talent and strengthen Europe’s tech sovereignty.

➀ S2C demonstrated comprehensive digital EDA solutions and strategic partnerships at RISC-V Summit China 2025, supporting IP validation to system-level verification;

➁ Live demos included BOSC's 16-core Kunminghu processor validated using S8-100Q systems and Xuantie R908 real-time processor implementation;

➂ Introduced Transaction-Based Acceleration methodology combining virtual prototyping and hardware emulation to overcome RISC-V verification challenges.

➀ Modern EDA tools demonstrate enhanced speed and efficiency;

➁ They fundamentally transform engineers' approaches to silicon design and verification;

➂ Enable accelerated deployment of complex silicon solutions into mass production

➀ Cadence's 'SoC Cockpit' automation flow addresses chiplet and SoC design challenges through standardized processes and tools;

➀ The framework integrates executable specifications, IP libraries, AI-driven verification, and multi-phase design automation (RTL to GDS II);

➂ Adoption of UCIe, Arm CSA, and AMBA C2C standards accelerates time-to-market for heterogeneous multi-die systems.

➀ Pre-silicon security verification is critical for addressing physical attacks like side-channel and fault injection, allowing vulnerability detection before costly chip production;

➁ Secure-IC's Laboryzr™ platform integrates with EDA tools to simulate threats, validate countermeasures, and ensure compliance with security certifications;

➂ The platform's future-proof features include support for post-quantum cryptography and chiplet architectures, bolstered by Cadence's upcoming acquisition for deeper EDA integration.

➀ Agentic AI's integration into semiconductor workflows accelerates design tasks but introduces risks of opaque decision-making and unintended behaviors;

➀ Security concerns arise from compromised hardware and lack of transparency tools for engineers, necessitating rigorous output validation;

➂ EDA vendors are implementing containment strategies like restricted access and predictable AI modules to mitigate risks in advanced chip designs.