➀ SCH Coating Solutions introduces ProShield ESD, a next-generation ESD flooring solution using filler-free, intrinsically conductive polymers (ICPs) for stable and uniform static dissipation;

➁ The technology replaces traditional filler-dependent methods, offering durable, maintenance-free protection with precise resistivity control and compatibility across diverse surfaces;

➂ Adopted in industries like electronics, semiconductors, and cleanrooms, it enhances safety, reduces long-term costs, and supports smart manufacturing with future-ready upgrades like EMI shielding integration.

➀ The CHIIPS podcast episode features Ras Attale discussing chip design and adapting to the UK as an immigrant from Sri Lanka;

➁ Topics include cybersecurity challenges in chip design and her involvement with Women in Techworks to empower women in electronics;

➂ Listeners are encouraged to explore the podcast series and related industry insights.

➀ Silvaco's webinar detailed GaN HEMT design using TCAD tools to model polarization effects and optimize device performance parameters;

➁ The Victory tool suite enables process simulation, machine learning-driven analytics, and SPICE model generation for vertical/lateral GaN structures;

➂ Applications span power electronics markets with validation from ST Microelectronics and Fraunhofer ISIT through digital twin methodologies.

➀ Creonic updates its Doppler Channel IP core to enhance flexibility and precision for satellite communication simulations;

➁ The expanded model supports L, S, C, and X satellite frequency bands with wider sampling ranges;

➂ Designed to address evolving requirements in next-gen satellite systems and communication standards.

➀ ASIC North partners with GlobalFoundries to offer design services and production support across the semiconductor lifecycle;

➁ The collaboration aims to expand the global reach of GF's specialized semiconductor technologies;

➂ Focus on delivering end-to-end solutions for diverse applications through this strategic alliance.

➀ Min Pulse Width (MPW) checks are critical for preventing logic errors and metastability in sub-5nm designs, requiring robust Static Timing Analysis (STA) that accounts for waveform degradation, crosstalk, and process variations.

➁ Duty cycle degradation in clock networks, influenced by RC filtering, asymmetric rise/fall delays, and PVT effects, must be mitigated through precise clock tree synthesis and jitter modeling during timing signoff.

➂ Proactive strategies to fix MPW violations include optimizing clock network integrity, adjusting PLL placement, and implementing early MPW checks during the synthesis phase to avoid costly silicon re-spins.

➀ Bronco AI develops AI-driven agents for design verification (DV) debugging, automating failure analysis across waveforms, logs, RTL/UVM, and specifications to reduce manual effort for engineers；

➁ The company specifically targets the critical bottleneck of DV debugging in chip development, alleviating overloaded experts and enabling teams to accelerate time-to-market；

➂ Unlike competitors focused on general AI tasks, Bronco prioritizes complex DV debug scenarios, leveraging generative AI to operate at multiple abstraction levels while ensuring on-premise data security.

➀ DesignSpark PCB is a free, professional-grade tool enabling seamless circuit design to PCB layout, catering to engineers, educators, and hobbyists alike;

➁ The latest version (DesignSpark PCB 13) offers enhanced precision with features like centered component origins and improved graphics;

➂ Its intuitive interface, unlimited design capabilities, and integration with RS Components' library simplify PCB creation without cost barriers.

➀ Synopsys demonstrated AI-driven end-to-end solutions for chip development at the AI Infra Summit 2025, addressing energy efficiency, design acceleration, and verification demands.

➁ AI-guided EDA tools reduce chip design time by up to 40% and optimize power consumption via techniques like ML-based synthesis and 3D chiplet integration.

➂ Hardware-assisted verification platforms (ZeBu, HAPS) enable quadrillion-cycle testing for complex datacenter chips, supported by collaborations with NVIDIA, AMD, and cloud providers.

➀ The paper proposes a neurosymbolic approach (NSG) combining neural networks with symbolic static analysis to improve automated Java code generation, achieving 86% syntax correctness and 40% code similarity without relying on large language models;

➀ Cadence experts highlight how NSG integrates compiler-like symbol tables during training, addressing weaknesses of LLMs in generating semantically valid code;

➁ The method shows promise for semiconductor verification by enforcing strict language rules in EDA tools, outperforming GPT-3 and CodeGPT in code accuracy.

➀ CircuitMaker is a free PCB design tool offering professional features like 16-layer support, 3D visualization, and collaborative cloud-based workflows, powered by Altium's engine;

➁ The 2.3.0 update introduced KiCAD/P-CAD import, Nexar API component search, and integration with Autodesk Fusion 360 via Altium CoDesigner;

➂ While praised for accessibility and community focus, it lacks local file storage and has limited compatibility with non-Altium formats.

➀ AI应用的概念验证需转向可扩展解决方案以实现产品化成功；

➁ 验证（DV）调试的主要挑战是故障分类而非极端案例问题，错误分配导致时间浪费；

➂ Bronco AI通过自动化回归结果分析与任务分配，结合工程师经验构建“思维层”提升调试效率。

➀ LibrePCB is a free, open-source EDA tool integrating schematic design, PCB layout, and manufacturing file export, tailored for makers, students, and small teams;

➁ Key features include a modular library system, real-time design rule checks, cross-platform compatibility, and direct manufacturing integration, with version 1.3.0 offering enhanced KiCad compatibility and HTML BOM exports;

➂ Fully licensed under GNU GPLv3 with no hidden costs, it prioritizes accessibility and community-driven development, with major UI and functionality upgrades planned for LibrePCB 2.0.

➀ Arteris announced that NanoXplore licensed its FlexGen NoC IP to develop radiation-hardened FPGA SoCs for space applications, addressing reliability and performance challenges;

➁ The FlexGen IP enables scalable and high-efficiency system-on-chip designs, critical for spacecraft and satellites requiring radiation tolerance;

➂ This collaboration strengthens Arteris' presence in aerospace semiconductors and supports NanoXplore's expansion of space-grade computing solutions.

➀ Siemens Digital Industries Software launched Tessent AnalogTest, an automated DFT solution that reduces analog circuit testing time from months to days by generating digital test patterns and minimal-impact DFT circuitry;

➁ The software achieves >90% defect coverage verification within hours using cost-effective digital ATE, replacing expensive mixed-signal testers, and aligns with IEEE P2427/P1687.2 standards for functional safety and parametric testing;

➂ Early partners are already utilizing the solution, with general availability planned for December 2025, promising accelerated time-to-market and up to 100x faster tests compared to traditional methods.

➀ Altium Designer provides a unified PCB design platform integrating schematic design, 3D layout, SPICE simulation, and manufacturing file generation;

➁ The software offers academic licenses for students but requires paid subscriptions for professional/commercial use;

➂ Unique features include cloud collaboration via Altium 365, multi-board support, and Windows-exclusive operation.

➀ Microelectronics focuses on designing and fabricating miniature electronic components and integrated circuits (ICs) enabling modern systems like AI accelerators, EVs, and IoT devices;

➁ Key processes include photolithography, materials innovation (Si, GaN, SiC), and trends like heterogeneous integration and advanced packaging to overcome Moore's Law limitations;

➂ Industry challenges include rising fab costs, supply-chain resilience, and talent gaps, with future advancements expected in chiplet ecosystems and wide-bandgap semiconductor scaling.

➀ Physical AI focuses on enabling intelligent systems to interact with dynamic real-world environments through advanced sensors, multi-physics principles, and simulation tools;

➁ Physics-based simulation is critical for testing sensor performance under diverse conditions and generating high-fidelity synthetic data for AI training;

➂ Traditional linear engineering processes are insufficient, requiring integrated multi-domain collaboration (hardware, software, sensors) and EDA-powered solutions to meet modern development demands.

➀ Siemens introduces Tessent AnalogTest, a novel EDA tool automating analog testing in SoCs using digital scan-based methods and evolving IEEE standards (P2427, P1687.2).

➀ The solution reduces analog defect simulation times from days to minutes, integrates IJTAG for test access, and achieves 10X-100X faster test times while maintaining coverage comparable to traditional methods.

➁ By supporting ISO 26262 functional safety metrics and standardized defect modeling, the technology particularly benefits automotive applications needing high-reliability verification.

➀ The article announces the finalists for the 2025 Elektra Awards across multiple categories, including Automotive/Hi-Rel Semiconductor, Consumer Semiconductor, Medical, and Power Systems;

➁ Notable companies featured in the shortlist include Microchip Technology, Nordic Semiconductor, NXP Semiconductors, Siemens EDA, and Navitas Semiconductor, highlighting advancements in GaN technology and EDA tools;

➂ Additional segments recognize educational support, manufacturing excellence, and rising stars, with the BrightSparks winners to be revealed at the event.