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August 12
- Alif elaborates on single architecture for generative edge AI
➀ Alif Semiconductor launched second-generation Ensemble E4, E6, and E8 devices using Arm Cortex cores and the Ethos-U85 NPU for transformer-based AI at the edge;
➁ The unified architecture features low power consumption (1.3μA in standby) and supports multi-core processing with scalable performance for applications like wearables and robotics;
➂ Integrated security measures include hardware root-of-trust and cryptographic accelerators, targeting smart home, healthcare, and industrial markets.
- Micron gives market hope
➀ Micron reports a surge in memory market performance, with HBM revenue growing nearly 50% sequentially and DRAM revenue hitting a record in Q3;
➁ The company projects Q4 revenues of $11.2 billion, driven by improved pricing and strong demand, especially in data center and client SSDs;
➂ Gross margins rise to 44.5% as Micron solidifies its position as a top supplier in key memory segments, while leadership debates whether growth reflects inventory restocking or a sustained market recovery.
- WSTS forecasts 15.4% growth for 2025
➀ WSTS reports H1 2025 semiconductor market growth of 18.9% YoY, reaching €346 billion, driven by data center demand and early AI Edge applications;
➁ 2025 full-year forecast revised upward to €728 billion (15.4% growth), with logic and memory sectors expected to grow 29% and 17%, respectively;
➂ Geographically, the Americas and Asia Pacific lead expansion, Europe strengthens, while Japan faces a slight decline; 2026 growth projected at 9.9% to €800 billion.
- Kyocera’s hermaphroditic connectors
➀ Kyocera launches 9288-000 Series hermaphroditic wire-to-wire and wire-to-board connectors for lighting and industrial applications, featuring simplified BOM management;
➁ The connectors use tool-free poke-home contact technology, orange/white PBT insulators, and phosphor bronze contacts for reliable 6-7A/600V performance;
➂ Rated for -40°C to +125°C with UL/RoHS certifications, supporting 2-4 contacts and 16-18AWG wires in tape-and-reel or bulk packaging.
- Eurospace Talks
➀ A 1960 article highlights the formation of a European preparatory commission to structure a space program;
➁ The commission aimed to explore rocket development, global geophysical collaboration, and a potential space research institute modeled after CERN;
➂ Discussions included utilizing European and international launch sites, as noted by Prof. Sir Harrie Massey.
August 11
- $400bn Up Against The Wall
➀ China and the US invested $150 billion and $250 billion respectively over a decade in semiconductor subsidies, yet failed to develop leading-edge process technology due to mismanagement;
➁ China allocated funds to inexperienced firms, while US subsidies supported capacity expansions that companies would have pursued independently;
➂ Intel, after receiving $8 billion in US subsidies and facing repeated delays in advanced process development, sparked political backlash, with its CEO pressured to resign.
- White House peddling export licences
➀ The U.S. White House allows NVIDIA and AMD to export AI chips to China under a licensing agreement requiring 15% of revenue to be paid to the U.S. government, expected to generate $2 billion in 2025;
➁ NVIDIA plans to sell over $15 billion of its H20 chip (a downgraded product for compliance) to China, while AMD aims for $800 million in M1308 chip sales, amid debates over export restrictions and technology competitiveness;
➂ NVIDIA emphasized the need for flexible export controls to maintain U.S. leadership in AI, with potential expansion of the licensing model to semiconductor manufacturing equipment.
- NASA asks for proposals for moon nuclear power plant
➀ NASA seeks industry proposals for a 100 kW lunar nuclear reactor by 2030, estimated at $3 billion, to provide stable power during the moon's two-week nights where solar energy is impractical;
➁ The reactor aims to support life-support systems, scientific instruments, and industrial activities, with cooling challenges addressed by large radiators (100–200m²) to dissipate heat in the moon's airless environment;
➂ China and Russia plan a joint lunar nuclear plant by 2035, while NASA and the UK Space Agency previously funded Rolls-Royce and other firms for reactor design studies.
- TSMC July revenues up 25.8% forecasts 30% growth for the year
➀ TSMC reported July 2025 revenues of $10.9 billion, marking a 25.8% year-on-year increase and 22.5% month-on-month growth;
➁ Cumulative January-July revenue reached $70.1 billion, up 37.6% YoY, with full-year growth projected at 30%;
➂ The company maintained strong margins at 58.6% gross margin and 49.6% operating margin, signaling robust profitability.
- Q2 tablet shipments up 13.1%
➀ Global tablet shipments reached 38.3 million units in Q2 2025, marking a 13.1% year-over-year growth, driven by product refreshes, education initiatives, and subsidies in China.
➁ Apple led the market with 12.7 million units shipped (33.1% share), followed by Samsung (7.2 million units, 18.7% share), while Lenovo (3.1 million units), Amazon (3.1 million units), and Xiaomi (2.8 million units) ranked third to fifth with significant growth rates of 25%, 205%, and 42% year-over-year, respectively.
➂ Amazon’s resurgence in the top five was notable, with a 205% surge due to aggressive pricing and seasonal promotions.
- Blue Canyon unveils larger Saturn-400 satellite bus
➀ Blue Canyon Technologies发布了新一代卫星平台Saturn-400，载荷容量提升至600公斤，支持四点分离系统，并可通过太阳能阵列实现高达2千瓦的可扩展功率；
➁ 该卫星首次提供内置姿态控制系统（控制力矩陀螺仪），同时支持三种反作用轮选项，增强敏捷性和稳定性；
➂ 作为RTX旗下公司，Blue Canyon已成功发射83颗小型卫星，其模块化软件和灵活设计帮助客户降低任务风险与成本。
August 8
- Arduino Nano R4 ready out of the box for breadboarding
➀ Arduino released the Nano R4 with headers, featuring a Renesas RA4M1 microcontroller (Arm Cortex-M4), designed for smart home and compact prototyping projects;
➁ The board offers 21 digital I/O pins, dual I2C ports, and pre-soldered headers for easy breadboarding, alongside compatibility with Arduino UNO R4;
➂ Priced at $13.30, it supports modular expansion via Qwiic/Stemma QT connectors and is already sold out due to high demand.
- When Things Were Not Looking Good For EUV
➀ In 2007, IMEC's Rudy Lauwereins stated that EUV was not mature enough for 32nm and likely 22nm semiconductor nodes, favoring immersion and double patterning techniques instead;
➁ Double patterning faced challenges like doubled mask costs and wafer throughput time, while device leakage issues at 22nm geometries highlighted scaling limits;
➂ IMEC proposed 3D-SIP (3D system-in-package) as a solution to sustain Moore’s Law momentum amid lithography and scaling barriers.
- Dev kits for military interconnect are based on VITA technology
➀ Samtec launches military/aerospace development and evaluation kits based on VITA standards for design validation from prototype to production;
➀ Kits include FMC, FMC+, and FireFly solutions supporting up to 140Gbps bandwidth and 25/28Gbps testing, compatible with FPGA systems;
➂ Products meet MIL-Spec certifications and undergo rigorous environmental testing for harsh applications, including space-grade connectors for satellites.
- Low-noise LDO for PLLs and ADCs
➀ Diodes launched the AP7372, a low-noise LDO regulator designed for sensitive applications like ADCs, DACs, VCOs, and PLLs, offering up to 90dB PSRR and 8μVrms output noise;
➁ The regulator supports adjustable output voltages (1.2–20V), operates across 2.7–20V input, and features protections against short-circuit, over-current, and over-temperature;
➂ Targeted for test/measurement, industrial automation, and medical devices, it uses a compact 1.2x1mm BGA package and requires minimal external components, such as 2.2μF ceramic capacitors.
- First female Astronomer Royal appointed by UK Government
➀ Professor Michele Dougherty from Imperial College London becomes the UK’s first female Astronomer Royal, a historic role advising the Monarch on astronomical matters;
➁ She emphasizes promoting public engagement with astronomy and its relevance to everyday life, while retaining her positions at STFC and the Institute of Physics;
➂ The position was previously held by cosmologist Lord Rees, who is now retiring from the role.
- Most Read – RP2350 dev board, Weebit Nano, Intel credit rating
➀ The US announces 100% tariffs on imported chips, exempting companies like TSMC, Intel, and Apple that invest in domestic manufacturing;
➁ OpenAI achieves a $300 billion valuation after raising $8.3 billion, with investor demand far exceeding allocations;
➂ Intel's credit rating is downgraded due to weak profitability, while Weebit Nano prepares to tape out a ReRAM chip and Adafruit releases a Raspberry Pi RP2350 dev board for display applications.
- Lip-Bu Tan writes to Intel employees
➀ Intel CEO Lip-Bu Tan reaffirms his commitment to U.S. leadership and Intel’s transformative role amid political pressure;
➁ Tan denies allegations about past roles at Walden International and Cadence, emphasizing adherence to ethical standards;
➂ Reports reveal internal board disagreements on strategies like foundry spin-offs, fab investments, and AI acquisitions, despite public statements of support.
- ORNL DC circuit-breaker reduces cost and expands capacity
➀ ORNL researchers developed a semiconductor-based medium-voltage DC circuit breaker using thyristors, achieving 100x faster operation than mechanical switches;
➁ The innovation addresses safety risks of DC grids by preventing arcing and enabling multi-directional power flow, reducing energy loss by avoiding AC/DC conversion;
➂ Prototype tests demonstrated rapid 1,400V current interruption in under 50μs, with plans to scale up to 10,000V for future high-capacity applications like AI data centers.
- Cyient Semi hooks up with GloFo
➀ Cyient Semiconductors partners with GlobalFoundries as an authorized reseller of semiconductor manufacturing services, expanding access to advanced process technologies;
➁ The collaboration offers fabless companies end-to-end support including fabrication, design consultation, and testing to accelerate innovation in automotive, industrial, and medical sectors;
➂ The agreement strengthens GloFo's channel strategy and enhances Cyient's role in the global semiconductor supply chain.
August 7
- Intelligent manufacturing is driving the next industrial revolution
➀ Industry 4.0 integrates IoT, AI, and robotics to enable flexible factories with software-controlled production, real-time analytics, and sustainability;
➁ Software-configurable hardware reduces costs by dynamically adapting sensors and I/O systems without physical modifications, enhancing operational efficiency;
➂ The smart manufacturing market is projected to grow from $210.2bn in 2024 to $348.2bn by 2030, driven by demand for scalability and adaptability in industries like automotive and process control.
- Fable: The Lousy Golfer
➀ The article narrates a fable about a lousy golfer who builds a successful computer company;
➁ Despite his poor golf skills, the protagonist achieves remarkable success in the tech industry;
➂ The moral emphasizes that one cannot excel at everything, highlighting the value of focusing on strengths.
- 100A powdered iron automotive inductors stable at +180°C
➀ Vishay introduces IHDM-1107BBEV-2A/-3A powdered iron inductors for automotive applications, offering 30% higher current handling than ferrite solutions at 125°C;
➁ The inductors feature ultra-low DC resistance (down to 220μΩ), edge-wound conductors, and three customization options (bare copper/SMT/press fit), qualified to AEC-Q200;
➂ Designed for 48V-12V bidirectional converters and automotive systems, they maintain stable performance across temperatures up to 180°C with soft saturation characteristics.
- Wireless connectivity: where is it really headed?
➀ Satellite and terrestrial networks are rapidly converging to achieve global seamless connectivity, driven by consumer demand for ubiquitous access;
➁ Direct-to-device (D2D) technology enables standard smartphones to connect directly to satellites without additional hardware, exemplified by Vodafone's trials with AST SpaceMobile;
➂ Challenges include latency in transparent satellite architectures, high costs of maintaining satellite constellations, and balancing technical viability with commercial sustainability.
- What caught your eye? (Open-source AI, Intel 18A, Efficient Computer, UK launch)
➀ Nvidia and OpenAI launched open-source AI reasoning models, potentially enhancing U.S. dominance in AI through accessible tools;
➁ Intel's 18A process reportedly faces low yields, raising concerns about its economic viability;
➂ Efficient Computer's reconfigurable hardware 'Electron E1' claims 10-100x power efficiency gains, with a compiler-dependent IC nearing release.
- Connecting the world through satellite innovation
➀ DVB-NIP enables direct IP-based content delivery over satellite networks, bridging connectivity gaps for remote areas and transforming satellite infrastructure into an internet extension;
➁ Integration with CDN technology enhances content distribution efficiency through multicast, reducing bandwidth costs and improving access in regions lacking terrestrial networks;
➂ Real-world applications include educational programs in Peru and disaster response systems, though challenges like infrastructure upgrades and digital rights management remain barriers to widespread adoption.
- 100% tariffs on US chip imports
➀ U.S. President Donald Trump announced a proposed 100% tariff on imported chips, exempting companies investing in domestic manufacturing;
➁ Exemptions apply to TSMC (U.S. plants), UMC (Intel collaboration), Apple ($100 billion U.S. investment), and Samsung/Hynix under a trade deal;
➂ Trump warned of retroactive tariffs if companies fail to fulfill investment pledges.
August 6
- The versatility of metamaterials in electronic design
➀ Metamaterials are artificial composites with unique properties like negative refractive index, enabling control of electromagnetic, thermal, and acoustic waves in electronic devices;
➁ Applications include thermal management in 3D ICs, flexible electronics, energy conversion, and advanced designs using AI-driven optimization;
➂ Future prospects involve programmable metamaterials for wearables, medical imaging, and smart systems, alongside challenges in scalable fabrication.
- It Keeps Getting Worse For Intel
➀ Intel's new management adopts strategies resembling private equity tactics, including workforce reductions, business unit sales, and delaying advanced process nodes without committed customers；
➁ The company outsources its marketing to Accenture using AI, signaling a departure from transformative R&D efforts and implying the board has abandoned ambitions as a leading-edge IDM/foundry；
➂ Despite restructuring, Intel faces growing losses, market share erosion, lack of AI strategy, and credit downgrades, highlighting an urgent need for bold reinvention akin to TI's past transformation.
- Arduino R4 with RA4M1 MCU now in Nano form-factor
➀ Arduino launches Nano R4, a Renesas RA4M1-based microcontroller board in Nano form-factor, following the Uno R4 release;
➁ Designed for compact applications, it features 3.3V/5V I2C interfaces (Qwiic/Stemma QT), battery-backed RTC, and an RGB LED, with options for castellated pins for custom boards;
➂ Includes a Connector Carrier add-on for expanded sensor interfaces (I2C, UART, analog/digital I/O) and a Micro SD slot with voltage-switching capability.