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August 6
- It Keeps Getting Worse For Intel
➀ Intel's new management adopts strategies resembling private equity tactics, including workforce reductions, business unit sales, and delaying advanced process nodes without committed customers；
➁ The company outsources its marketing to Accenture using AI, signaling a departure from transformative R&D efforts and implying the board has abandoned ambitions as a leading-edge IDM/foundry；
➂ Despite restructuring, Intel faces growing losses, market share erosion, lack of AI strategy, and credit downgrades, highlighting an urgent need for bold reinvention akin to TI's past transformation.
- Arduino R4 with RA4M1 MCU now in Nano form-factor
➀ Arduino launches Nano R4, a Renesas RA4M1-based microcontroller board in Nano form-factor, following the Uno R4 release;
➁ Designed for compact applications, it features 3.3V/5V I2C interfaces (Qwiic/Stemma QT), battery-backed RTC, and an RGB LED, with options for castellated pins for custom boards;
➂ Includes a Connector Carrier add-on for expanded sensor interfaces (I2C, UART, analog/digital I/O) and a Micro SD slot with voltage-switching capability.
- Astute signs Puya Semiconductor
➀ Astute Group签署协议，分销Puya Semiconductor的超低功耗非易失性存储器（NVM）和基于Arm Cortex-M0+/M4内核的MCU产品；
➁ Puya的产品适用于低功耗蓝牙模块、汽车导航系统、消费电子等领域，已为三星、OPPO等品牌供货；
➂ 合作将提升欧洲市场供应能力，加速工业、汽车及消费应用中低功耗嵌入式技术的普及。
- RP2350 dev board drives displays
➀ Adafruit launched the Fruit Jam development board designed for Raspberry Pi RP2350 microcontroller, capable of driving DVI displays (up to 640 pixels) and handling keyboards/mice via its USB Type-A/C ports;
➁ The board integrates an Espressif ESP32-C6 Wi-Fi 6 chip, 16MB flash storage, 8MB PSRAM, and supports programming environments like CircuitPython and Arduino;
➂ Additional features include an I²S audio interface, GPIO expansion headers, multi-color LEDs, and bundled mono speaker, positioning it as a compact computing platform for embedded applications.
- Skyrora, licensed to launch in UK first
➀ Skyrora became the first British company to receive a commercial launch license for its suborbital rocket, Skylark L, from the UK Civil Aviation Authority (CAA);
➁ The license permits launches from SaxaVord Spaceport in Shetland or any UK site, emphasizing safety and sovereign space capabilities;
➂ The 3D-printed Skylark L can carry 50kg payloads beyond the Kármán line, supporting microgravity research and serving as a precursor to larger orbital rockets like Skyrora XL.
- How EIS complements battery management algorithms in EVs
➀ EIS enhances Li-ion battery management in EVs by analyzing electrochemical parameters, enabling optimized safety and performance through sensor fusion and AI algorithms.
➁ EIS enables early prediction of thermal runaway, a critical safety requirement under China's GB 38031-2020 standard, reducing reliance on physical sensors and improving cell utilization.
➂ EIS dynamically adjusts fast-charging profiles based on real-time cell state, proposing implementation models like centralized or localized excitation to balance cost and efficiency.
- 18A not yielding competitively say reports
➀ Intel's 18A manufacturing process reportedly suffers from defect densities three times higher than required for profitable yields, raising concerns about its Panther Lake CPU production;
➁ Yields improved from 5% in late 2024 to 10% in mid-2025, still far below the 50% threshold needed for acceptable profit margins;
➂ Despite public confidence in a Q4 2025 launch, internal challenges may force Intel to sell Panther Lake chips at low or negative margins initially.
- TSMC fires and prosecutes employees for trying to get sensitive info
➀ TSMC dismissed two current employees and one former employee suspected of colluding to illegally obtain trade secrets related to its 2nm semiconductor manufacturing process;
➁ The company proactively detected unauthorized file access, initiated internal investigations, and filed legal actions under Taiwan’s National Security Act;
➂ Prosecutors approved detention requests, emphasizing the case’s severity as a breach of national core technology security.
- Digikey links portfolio expansion with market momentum
➀ DigiKey announced the addition of 32,000 new products in Q2 2025, expanding its total portfolio to over 16.5 million items through core business, Marketplace, and Fulfilled by DigiKey programs;
➁ The distributor added 127 new suppliers, focusing on AI development, real-time vision processing, IoT automation (e.g., humidity/temperature modules), and highlighted innovations like Adafruit's Sparkle Motion Stick and STMicroelectronics' Wi-Fi/Bluetooth modules;
➂ With 1.1 million new parts added in 2024, DigiKey linked this growth to strong customer demand and market momentum, expressing optimism for continued expansion.
- Knowles adds to safety-certified MLCCs
➀ Knowles launches new X1/Y2 safety-certified MLCCs with voltage ratings up to 500Vrms, the first Y2-class capacitors in the market at this specification;
➁ Features include compact 2720 case design with 5mm creepage distance, AEC-Q200 automotive qualification, and resilience in harsh environments (-55°C to 125°C, 85% humidity);
➂ Targets high-power AC/DC converters and industrial applications requiring robust safety compliance.
- Top Ten (+20) MEMS Companies
➀ The article highlights the top 30 MEMS companies in 2024, as analyzed by market research firm Yole.
➀ Authored by industry veteran David Manners, it leverages his decades of experience covering electronics trends.
➂ This analysis is part of a broader series exploring rankings in the semiconductor sector, including fabless companies and foundries.
- Ansys releases R2 tool suite with AI capabilities
➀ Ansys released the 2025 R2 tool suite, integrating AI+ capabilities and an Engineering Copilot across products like Mechanical, Fluent, and HFSS for faster simulations and precision in 5G/6G projects;
➁ Enhanced AI training with optiSLang and SimAI, expanded Python libraries for workflow automation, and a web-based medini Cybersecurity SE tool for threat analysis;
➂ The release follows Synopsys' acquisition of Ansys, emphasizing streamlined workflows and improved satellite communication design with AI-driven tools.
August 5
- Intel credit rating downgraded
➀ Fitch Ratings downgraded Intel's credit rating to BBB due to weak demand, profitability challenges, and high debt leverage (EBITDA ratio 5.0x in 2024);
➁ Intense competition from AMD, Broadcom, and Qualcomm in PCs and AI, coupled with execution risks in technology and foundry strategies, further impacted the rating;
➂ Despite solid liquidity ($21.2B cash reserves), Intel needs successful product launches (e.g., 18A chips) and debt reduction to recover its rating.
- Infineon expects 2025 revenues to be slightly down y-o-y
➀ Infineon reported Q2 (fiscal Q3) revenue of €3.704 billion and a profit of €668 million with an 18% margin;
➁ The company forecasts FY2025 revenue at ~€14.6 billion (slight YoY decline), with adjusted gross margin ≥40% and high-teens profit margin;
➂ Strategic focus includes acquiring Marvell’s Automotive Ethernet business, targeting AI data centers, energy infrastructure, and humanoid robots amid ongoing macroeconomic uncertainties.
- Jericho4 networks multiple datacentres
➀ Broadcom launched Jericho4, a 3nm Ethernet fabric router designed to interconnect over 1 million XPUs across distributed AI data centers, addressing power and space constraints;
➁ It offers 3.2T HyperPort technology, MACsec encryption, and lossless RoCE over 100km+, enabling high-bandwidth, secure, and efficient multi-data-center AI infrastructure;
➂ Jericho4 complies with Ultra Ethernet Consortium (UEC) standards, ensuring interoperability with ecosystem components like NICs and switches.
- Fab equipment sales to top $184bn in 2030
➀ The global Wafer Fab Equipment (WFE) market is projected to reach $184 billion by 2030, driven by 4.6% CAGR for equipment and 4.8% for services, with the 'Big Five' (ASML, Applied Materials, etc.) holding 70% market share in 2024;
➁ China accounts for 40% of global chipmaker demand but only 5% of WFE manufacturing, facing challenges in subsystem bottlenecks and geopolitical constraints despite strong state support for self-sufficiency;
➂ Patterning dominates WFE segments (26% share), while wafer bonding shows the highest growth (>10% CAGR) due to 3D integration and advanced packaging demands.
August 4
- Silicon Labs claims world first with PSA Level 4 iSE/SE-certified SoC
➀ Silicon Labs announces SiXG301 as the world's first PSA Level 4 iSE/SE-certified SoC, offering advanced hardware/software protection against attacks like laser fault injection and side-channel vulnerabilities.
➁ The 22nm SoC, designed for IoT/edge devices, supports over-a-decade field operation with OTA updates and real-time monitoring, set for Q3 2025 availability.
➂ Collaboration with Keysight Labs validated the security features, addressing emerging threats once deemed theoretical.
- OpenAI raises $8.3bn; under pressure to become for-profit
➀ OpenAI raised $8.3 billion at a $300 billion valuation, with major investors including Dragoneer, SoftBank, and Fidelity, amid high demand that left some early backers dissatisfied;
➁ The company plans to raise $40 billion in 2025, with SoftBank conditioning $30 billion on OpenAI transitioning from non-profit to for-profit, requiring approval from key partner Microsoft;
➂ Despite projected revenues of $12-13 billion annually and a $20 billion year-end target, OpenAI expects a $22 billion loss in 2025 due to high operational costs of $2.25 per revenue dollar.
- US Nano-Bio Materials Consortium issues RFP
➀ The US Nano-Bio Materials Consortium (NBMC) under SEMI has released an RFP to advance sensing, diagnostic, and augmentation technologies for defense, healthcare, and environmental applications;
➁ Proposals targeting advanced materials, edge computing, and bio-inspired sensors may receive funding up to $750,000, with emphasis on improving Technology and Manufacturing Readiness Levels (TRL/MRL);
➂ Collaborative projects with dual-use potential are prioritized, with a webinar on August 8, 2025, and white paper submissions due by August 28.
- Weebit Nano looking to tape out this year
➀ Weebit Nano, an Australian embedded NVM specialist, expects to tape out its ReRAM test chip with onsemi by end of 2025 for high-temperature automotive and industrial applications;
➁ The company collaborates with DB HiTek to qualify its ReRAM IP in a 130nm BCD process, targeting automotive, AI, and power management markets;
➂ Secured its first U.S. product customer for security applications and reports A$1.4 million in customer receipts with ongoing engagements with over a dozen foundries and IDMs.
- From RRE To The Moon
➀ The article, part of David Manners' 'Memory Lane' blog series, reflects on the electronics industry's evolution and future trends;
➀ Authored by David Manners, a veteran with over 40 years of experience covering the semiconductor and electronics sectors;
➂ Includes recommended readings such as 'NEW: Silicon Transistors' and 'New Era In Devices,' highlighting advancements in semiconductor technology.
- Ed Finds Topological Semimetals
➀ Ed seeks to exploit topological semimetals technology to address the 50% annual electricity demand growth in AI datacenters;
➁ The material's conductivity improves at smaller scales, offering potential for energy-efficient chipsets;
➂ Plans include academic collaboration, strategic IP monetization, and targeting Middle Eastern/Chinese investors to capitalize on sustainable semiconductor innovation.
August 1
- 5G core network to grow 6%
➀ The global 5G Mobile Core Network (MCN) market is projected to grow at a 6% CAGR (2024-2029), driven by 5G Standalone (SA) adoption and AI-driven network capacity demands;
➀ The Multi-Access Edge Computing (MEC) market is expected to expand at 17% CAGR due to dynamic network slicing, RedCap devices, and GSMA Open Gateway APIs;
➂ AI advancements, including Agentic AI, are key to achieving L4 autonomous networking, potentially reducing operational costs for mobile operators, while 3G shutdowns spur IMS Core upgrades and 5G SA deployments expand globally.
- Infineon adds thermally optimised CoolSiC MOSFET
➀ Infineon launched the CoolSiC MOSFET 1200 V G2 in a top-side-cooled Q-DPAK package, targeting industrial applications like EV chargers and solar inverters;
➁ The new generation reduces switching losses by 25%, improves thermal resistance by over 15%, and supports operation up to 200°C junction temperature;
➂ Enhanced package design enables compact heat dissipation, minimized parasitic inductance, and compatibility with automated manufacturing for scalable solutions.
July 31
- Automotive UFS 4.1 flash memory up to 1Tbyte
❶ Kioxia introduces 128GB, 256GB, and 1TB UFS 4.1 embedded flash memory for automotive applications, supporting up to 115°C; 512GB version to follow.
❷ Compliant with AEC-Q100/104 Grade 2 standards, targeting infotainment, ADAS, telematics, and vehicle computers.
❸ Delivers 2.1x sequential read, 2.5x write, and up to 3.7x random write improvements over UFS 3.1.
- Fable: The Scientist Who Slipped Away
➀ A renowned scientist abruptly leaves Vienna, sending farewell notes to friends;
➁ He departs on the Orient Express accompanied by Napoleon Bonaparte’s great-grandniece;
➂ The fable concludes with a moral: 'Give shit the slip when you can,' emphasizing the value of avoiding unnecessary conflict.
- Photo-relay has 1.8kV output mosfets for 800V batteries
➀ Toshiba introduced the TLX9165T photoelectric relay with 1.8kV output MOSFETs, targeting 800V battery systems in electric vehicles;
➁ The device features back-to-back MOSFETs for bidirectional switching, ≤600Ω on-resistance (at 12mA/10mA), and an 8mm creepage-distance SO16 package compliant with automotive standards;
➂ It achieves 5kVrms isolation, meets AEC-Q101 and IEC 60664-1 certifications, and is designed for battery management and mechanical relay fault detection.
- Space-grade SMA connector-saver for satellite testing
➀ Cinch Connectivity Solutions launched the SQM-4733-MF-29M-02, a stainless steel space-grade SMA connector-saver supporting SMA, 3.5mm, and 2.92mm interfaces with 40GHz operation;
➁ Designed for space missions, it meets NASA out-gassing standards and is used for satellite thermo-vacuum testing, pre-flight evaluation, and multi-orbit platform development;
➂ Offers VSWR ≤1.2:1 up to 40GHz, operates in -65°C to +125°C, and is distributed via DigiKey and Mouser.
- Harwin strengthens Kontrol industrial connector range
➀ Harwin expanded its surface-mount 'Kontrol' industrial connector range by adding through-hole retention options, introducing 72 new parts designed for high-vibration environments;
➁ The new connectors offer twice the PCB retention force of SMT options, withstanding 20G vibration for 12 hours and 500 mating cycles;
➂ Featuring 1.27mm pitch, up to 40+40 pins, and 3Gbit/s data transmission, the connectors include shrouding, polarization, and location pegs for precision assembly.
- Automotive decline hits Europe component market, says DMASS
➀ European semiconductor distribution sales fell 14% YoY in Q2 2025 due to automotive sector decline, with Austria (-36.6%), France (-20%), and Germany (-17%) hit hardest, while Iberia saw a 2.4% rise.
➁ Component categories varied widely: power and programmable logic sales dropped 21%, while sensors/actuators and discrete components grew. IP&E rose 1.43%, driven by circular connectors (+122.7%) and power supplies.
➂ DMASS cites geopolitical tensions and supply chain volatility as key challenges, urging Europe to prioritize nearshoring and AI/IoT innovation to counter industrial stagnation.