➀ TSMC has chosen a 310x310mm substrate for its initial panel-level packaging (PLP) production, instead of the 510x515mm substrate initially tested.

➁ A source told Nikkei that the decision was made to start with a slightly smaller square shape rather than a larger one used in earlier trials, due to the difficulty of evenly coating the entire substrate with chemicals.

➂ The first production will take place on a pilot line in Taoyuan City in 2017.

➀ Yole Group forecasts the Panel Level Packaging (PLP) market to grow from $160 million to $600 million by 2030 with a CAGR of 27%;

➁ High-density fan-out and ultra-density platforms will dominate the market by 2030, driven by AI;

➂ Samsung Electronics leads the market in 2024, followed by ST, with PTI, SIPLP, and ASE holding less than 10% market share.

➀ Sarcina Technology has launched an innovative AI platform;

➁ The platform aims to provide cost-effective and customizable packaging solutions for AI applications;

➂ It utilizes ASE's FOCoS-CL assembly technology and includes an interposer for advanced packaging.

➀ The 75th annual IEEE Electronic Components and Technology Conference (ECTC) will take place from May 27-30, 2025, featuring a range of technical sessions, special sessions, and workshops on cutting-edge topics in electronic packaging and microelectronics.

➁ Keynote speaker Samuel Naffziger will discuss achieving efficient zettascale compute in the AI era.

➂ The conference will also feature a Heterogeneous Integration Roadmap (HIR) workshop and 16 Professional Development Courses.

➀ Intel has launched a new 'Value Pack' CPU option in South Korea, offering savings for PC DIYers and gamers.

➁ The 'Value Pack' features no-frills packaging, reducing costs while maintaining the same quality and warranty service.

➂ The price difference is approximately $7, making the Value Pack an attractive option for cost-conscious consumers.

➀ The semiconductor industry is witnessing a surge in investment and expansion of advanced packaging facilities;

➁ This surge is driven by the growing demand for high-performance computing and other applications;

➂ Key players are significantly expanding their capacity with the aim of substantial production increases by 2025.

➀ GlobalFoundries plans to establish a new advanced packaging and testing center at its New York fabrication site, investing $575 million.

➁ The center will offer advanced packaging services for GF's differentiated silicon photonics platform, as well as full turnkey services for aerospace and defense customers.

➂ The U.S. Department of Commerce will contribute up to $75 million in direct funding, and New York state will provide additional support.