04/04/2025, 05:16 AM UTC
面板级封装（PLP）市场预计2024-2030年复合年增长率27%，达6亿美元PLP set for 27% CAGR 2024-30
➀ Yole集团预测，面板级封装（PLP）市场将从目前的1.6亿美元增长到2030年的6亿美元，复合年增长率达到27%；
➁ 随着AI的推动，高密度扇出和超密度平台预计将在2030年主导市场；
➂ 2024年，三星电子领跑市场，紧随其后的是ST，PTI、SIPLP和ASE等公司市场份额均不到10%。
➀ Yole Group forecasts the Panel Level Packaging (PLP) market to grow from $160 million to $600 million by 2030 with a CAGR of 27%;
➁ High-density fan-out and ultra-density platforms will dominate the market by 2030, driven by AI;
➂ Samsung Electronics leads the market in 2024, followed by ST, with PTI, SIPLP, and ASE holding less than 10% market share.
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