02/03/2025, 09:27 AM UTC
2025年全球先进半导体封装设施扩张展望The Global Expansion of Advanced Semiconductor Packaging Facilities: A 2025 Outlook
➀ 半导体行业正经历先进封装设施投资和扩张的激增；
➁ 这一激增是由高性能计算和其他应用需求的增长驱动的；
➂ 主要企业正在显著扩大其产能，旨在到2025年实现大幅度的产量增长。
➀ The semiconductor industry is witnessing a surge in investment and expansion of advanced packaging facilities;
➁ This surge is driven by the growing demand for high-performance computing and other applications;
➂ Key players are significantly expanding their capacity with the aim of substantial production increases by 2025.
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本文由大语言模型（LLM）生成，旨在为读者提供半导体新闻内容的知识扩展（Beta）。
