09/10/2024, 05:55 PM UTC
法拉电子发布多源芯片片垂直分解协同平台Faraday Unveils Advanced Packaging Coordinated Platform for Multi-source Chiplets
➀ 法拉电子发布用于芯片片垂直分解的先进封装协同平台；➁ 平台整合了多家供应商和多源芯片片；➂ 平台提供设计、封装和生产的核心服务。➀ Faraday Technology Corporation introduces an advanced packaging coordinated platform for chiplet vertical disintegration; ➁ The platform integrates multiple vendors and multi-source chiplets; ➂ The platform offers core services of design, packaging, and production.
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