04/22/2025, 05:27 AM UTC
台积电为PLP初期运行选择更小的基板TSMC opts for smaller substrate for initial PLP runs
➀ 台积电为其首次面板级封装（PLP）生产选择了310x310mm的基板，而不是最初试验的510x515mm基板。
➁ 一位消息人士告诉日经，决定从略小的方形开始，而不是早期试验中使用的更大方形，因为均匀涂抹整个基板的化学品特别困难。
➂ 首次生产将于2017年在桃园市的试点线上进行。
➀ TSMC has chosen a 310x310mm substrate for its initial panel-level packaging (PLP) production, instead of the 510x515mm substrate initially tested.
➁ A source told Nikkei that the decision was made to start with a slightly smaller square shape rather than a larger one used in earlier trials, due to the difficulty of evenly coating the entire substrate with chemicals.
➂ The first production will take place on a pilot line in Taoyuan City in 2017.
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