➀ Vishay Intertechnology launched automotive-grade ESD protection diodes (VGSOTxx/VGSOTxxC) with peak pulse power up to 540W and ±30 kV ESD immunity;

➁ Designed for automotive, industrial systems, telecom, and consumer electronics, these diodes feature enhanced thermal resistance and comply with IEC/ISO standards;

➂ The SOT-23 packaged devices support bidirectional configurations, parallel operation for higher surge protection, and are RoHS-compliant with 12-week lead times.

➀ Plessey Semiconductors was acquired by Haylo Labs, funded by a $100 million loan from Chinese tech firm Goertek;

➁ Goertek specializes in acoustic/optical components for consumer electronics and VR/AR, with clients including Apple and Huawei;

➂ The UK government approved the deal aimed at consolidating microLED technology leadership.

➀ Japan’s five major power semiconductor companies (Mitsubishi Electric, Fuji Electric, Toshiba, Rohm, Denso) each hold less than 5% global market share, leading to collaboration challenges due to fragmented interests;

➁ Government-backed alliances (e.g., Toshiba-Rohm, Fuji-Denso) face limited success, with incompatible product lines and stalled expansion into R&D and procurement;

➂ China’s dominance in SiC wafer production and EV manufacturing (40% BEV, 50% PHEV global share) strengthens its power semiconductor capabilities, while Japan lags in automotive electrification.

➀ The back-end semiconductor equipment market is projected to exceed $9 billion by 2030, driven by a 6% CAGR, with key segments like TCB (11.6% CAGR) and hybrid bonding (21.1% CAGR) accelerating growth for HBM and chiplet packaging.

➁ Geopolitical tensions and export controls are prompting industry leaders like TSMC, Intel, SK Hynix, and Samsung to diversify supply chains and localize manufacturing, while equipment vendors such as BESI and ASMPT drive innovation.

➂ Hybrid bonding and TCB technologies are critical for 3D integration and AI/memory platforms, while China’s domestic vendors aim to expand but face ecosystem maturity hurdles beyond 2030.

➀ Part 2 introduces cutting-edge EDA tools for engineers to manage increasing chip complexities;

➁ Focuses on solutions for larger chip designs, tighter process nodes, and accelerated development timelines;

➂ Emphasizes maintaining quality standards while overcoming scaling challenges in semiconductor engineering.

➀ Alpha and Omega Semiconductor introduces a new high-current e-fuse for circuit protection;

➁ Supports up to 60 A, targeting power rails in data centers and telecom infrastructure;

➂ Provides compact and reliable overcurrent/overvoltage protection solutions.

➀ The U.S. government plans to convert $7.86 billion CHIPS Act grants into a 10% equity stake in Intel, aiming to secure taxpayer returns;

➀ Commerce Secretary emphasized domestic chip production for national security, citing Taiwan's geopolitical risks;

➂ Intel faces operational challenges, including CEO controversies and delayed Ohio factory construction, while experts warn of 'corporate statism' risks.

➀ Researchers developed an on-chip THz multiplexer using inverse design and quantum cascade lasers, operating in the 2.2–3.2 THz range;

➁ The compact device (200×200 µm) integrates III–V semiconductors and polymer waveguides, achieving three broadband channels with low crosstalk;

➂ Applications include THz communication and spectroscopy, demonstrating potential for scalable photonic integration beyond telecom wavelengths.

➀ Cirrus Logic and GlobalFoundries expand partnership to accelerate next-gen mixed-signal semiconductor development;

➁ Focus on advanced audio solutions and U.S.-based manufacturing innovation;

➂ Collaboration aims to enhance process technologies and production capacity for high-performance chips.

➀ Researchers at Texas A&M University revealed the shape-recovery and self-healing capabilities of Aromatic Thermosetting Copolyester (ATSP), a carbon-fiber composite, through cyclic loading and high-temperature testing;

➁ The material demonstrated durability across hundreds of stress cycles, with heating (up to 280°C) triggering self-healing, restoring near-full strength after two cycles and retaining 80% efficiency by the fifth cycle;

➂ X-ray imaging confirmed structural recovery despite gradual mechanical fatigue, highlighting ATSP's chemical stability and potential for automotive safety applications.

➀ The Aerospace Corporation conducted the first optical crosslink demonstration between two CubeSats in low-Earth orbit, enabling high-speed data transfer (312.5 Mbps uncorrected) using miniaturized laser technology.

➁ The breakthrough reduces power and cost for future missions, allowing CubeSats to collaborate in formations and bridge the gap between affordability and performance for commercial and government use.

➂ CEO Steve Isakowitz, set to retire in 2026, emphasized advancements in space technology under his decade-long leadership, including AI integration and expanded partnerships.

➀ SoftBank announced a $2 billion investment in Intel shares at $23 each, providing critical capital for the chipmaker.

➁ The deal aims to strengthen collaboration in U.S.-based semiconductor innovation, aligning with Intel's efforts to regain leadership in advanced manufacturing.

➂ SoftBank's move combines financial opportunity (undervalued Intel assets) and strategic goals, securing access to cutting-edge chip production for AI and Arm-related ventures.

➀ David Manners reflects on a witty 65-year-old advertisement from Electronics Weekly's December 1960 edition;

➁ The article highlights Manners' four-decade experience in covering the electronics industry and its trends;

➂ It serves as a nostalgic look back at historical tech marketing and industry evolution.

➀ Current oxygen production in space via water electrolysis faces inefficiencies in microgravity due to gas bubbles adhering to electrodes;

➁ Researchers developed a passive magnetic system using permanent magnets and magnetohydrodynamic forces to separate gas bubbles without mechanical components, increasing efficiency by 240%;

➂ The breakthrough, validated in microgravity experiments, offers a sustainable solution for future space missions, funded by DLR, ESA, and NASA.

➀ Current oxygen production in space via water electrolysis faces challenges in gas-liquid separation due to microgravity, relying on energy-intensive centrifuges;

➁ A new passive magnetic system eliminates mechanical parts, using commercial magnets to direct gas bubbles and improve electrolysis efficiency by up to 240%;

➂ Tested in microgravity environments like the ZARM drop tower, the innovation paves the way for lighter, sustainable life-support systems for long-term space missions, with plans for further testing on research rockets.

➀ Organ-on-chip systems are polymer-based microdevices mimicking human organ functions, using microchannels and live human cells to test drug responses without animal testing;

➁ A study by Emulate Inc. demonstrated 87% accuracy in predicting drug-induced liver toxicity, with machine learning tools like OPERA enhancing chemical safety predictions;

➂ Regulatory agencies like the FDA and NIH are evaluating these chips as alternatives to traditional preclinical testing methods.

➀ Hamamatsu Photonics introduces the G1682x series, compact InGaAs linear image sensors optimized for near-infrared spectrophotometry applications;

➁ Features include high sensitivity, uncooled operation at 3.3V, and selectable conversion efficiency (16nV/e⁻ to 160nV/e⁻) for flexible performance;

➂ Designed for industrial, academic, and OEM sectors, enabling real-time monitoring and simultaneous multichannel analysis across 0.9µm-2.1µm wavelengths.

➀ Queensland University of Technology researchers developed a copper-ion doping method for germanium telluride, improving thermoelectric efficiency by over 50%;

➁ The technique achieved a record figure of merit (ZT) of 2.3 through precise copper substitution in crystal lattices, enhancing waste-heat-to-electricity conversion;

➂ This breakthrough enables more efficient energy harvesting for applications like low-power electronics and industrial heat recovery.

➀ The smart glasses market grew 110% YoY in H1 2025, led by Ray-Ban Meta Smart Glasses with 73% market share, alongside new entrants like Xiaomi and TCL-RayNeo;

➁ AI glasses accounted for 78% of total shipments, driven by Meta's expansion into new regions and upcoming models from Meta, Alibaba, and others;

➂ Key developments include Qualcomm's upgraded AR 1+ Gen 1 SoC, Allwinner's budget chips, and Apple's rumored AI glasses, with a projected 60% CAGR through 2029.

➀ The 2026 IEEE ECTC, a major semiconductor packaging industry event, will be held in Orlando, FL, from May 26-29, 2026, attracting over 2,000 participants worldwide;

➁ The conference will focus on cutting-edge topics like heterogeneous integration, chiplet architectures, hybrid bonding, 5G, quantum computing, and advanced packaging technologies;

➂ Submissions are invited for unpublished, non-commercial research in areas including reliability, manufacturing, material processing, and photonics.