➀ NXP and World Advanced are constructing a 12-inch wafer factory in Singapore with an investment of 7.8 billion USD, aiming to start mass production in 2027 and reach a monthly capacity of 55,000 12-inch wafers by 2029.
➁ NXP is actively seeking to establish a supply chain in China to serve customers needing Chinese production capacity.
➂ NXP plans to move some chip front-end manufacturing to China and establish a complete Chinese supply chain.
➀ TSMC is scheduled to start producing 2nm GAA wafers in the fourth quarter of 2025 at its Fab 20 factory in Hsinchu, with a capacity of 30k wpm, followed by the Fab 22 factory in Kaohsiung, also with a capacity of 30k wpm, starting production in the first quarter of 2026.
➁ N2P production will begin at the end of 2026, but without the previously announced backside power delivery.
➂ The N2 and N2P processes will use TSMC's NanoFlex technology, allowing chip designers to mix and match units from different libraries (high-performance, low-power, area-efficient) on the same design.
➀ The 14th China International Nanotechnology Industry Expo concluded successfully, showcasing advancements in nanotechnology.
➁ PuLing Technology, a leading nanoprinting company, offers a range of products and services for various industries.
➂ Nanoprinting technology has distinct advantages over photolithography in terms of precision and cost, but challenges remain in high-precision applications.
➀ The article delves into the significance of WFE (wafer fabrication equipment) and its role in semiconductor manufacturing.
➁ It explains the importance of wet cleaning, CMP, and etching processes, and their application in semiconductor manufacturing.
➂ The text covers advanced techniques such as CVD, PVD, and ALD, discussing their uses in depositing various materials.
➃ The author highlights the challenges and opportunities in the development of semiconductor equipment, particularly focusing on the advanced EUV lithography and mask inspection technologies.
➄ The article also touches upon the importance of PR Stripper, Ashing, and oxidation processes in semiconductor manufacturing.
➀ Full-mask is a key concept in integrated circuit manufacturing, involving the use of masks in semiconductor manufacturing processes.
➁ Masks are optical tools used in photolithography for patterning the surface of silicon wafers.
➂ Full-mask covers the entire wafer during exposure and is used for mass production, offering efficiency and precision but at a higher cost.
➀ CMP technology combines chemical and mechanical actions for surface planarization;
➁ CMP plays a crucial role in semiconductor manufacturing, including initial wafer flattening, metal interconnect structure fabrication, and chip packaging;
➂ Key components of CMP equipment include polishing heads, polishing pads, and polishing slurries, each requiring precise control and optimization;
➃ CMP technology faces challenges such as nanometer-level precision, adaptation to new materials, and environmental and cost pressures;
➄ The future of CMP technology includes technological advancement, market demand growth, and a diversifying industry landscape.
➀ India's semiconductor industry has made significant progress under the government's $76 billion incentive fund for the India Semiconductor Mission (ISM) launched in December 2021.
➁ The first phase of ISM has approved five semiconductor projects, including four chip packaging factories and one chip manufacturing factory, to be operational between 2025 and 2027.
➂ Experts are urging the next phase of ISM to focus on partnerships with global semiconductor leaders, expanding the ecosystem for raw materials like chemicals and gases, and increasing efforts to train skilled talent for the growing industry.
➀ The semi-damascene technique, when combined with patternable metals like Ru, promises to achieve RC, area, cost, and power efficiency for interconnect scaling paths.
➁ The introduction of CU DUALdamascene in BEOL in 1997 marked a turning point in semiconductor history, shifting from subtractive Al patterning to wet processes like copper electroplating and CMP.
➂ Imec proposed a new metallization concept called 'semi-damascene' in 2020, which starts with direct patterning of the first local interconnect metal layer and then uses a single inlaid technique for the vias.
➀ The advancement in semiconductor manufacturing processes, such as the transition from 28nm to 12nm FinFET, is driven by the need for higher integration, processing power, and lower power consumption to meet the growing demand in AI, high-performance computing, automotive electronics, 5G communication, and the Internet of Things.
➁ FinFET technology, with its innovative 3D structure, addresses the size scaling and performance bottlenecks of planar transistors, becoming a key technology to extend Moore's Law.
➂ The course offered by E课网 aims to teach advanced FinFET layout design skills in just two weeks, providing real-world project experience and preparing students for higher salaries and career development.
➀ The article discusses the role of absorber materials in high-NA EUV lithography and their impact on imaging.
➁ The development of EUV mask technology is driven by multi-beam mask writers, with Intel and Infineon among the key players.
➂ The European Mask and Lithography Conference 2024 highlighted advancements in EUV technology, including high-NA EUV, e-beam mask patterning, AI applications, and advanced lithography resins.
➀ ASML surpasses AMAT to lead the semiconductor manufacturing equipment market in 2023;
➁ ASML's equipment shipment reached $23.7 billion in 2023, a 48% increase from 2022;
➂ TEL, affected by the downturn in the memory market, saw its shipments decline by 23% to $10.3 billion in 2023;
➃ The global semiconductor manufacturing equipment market is expected to grow by 3% in 2024, reaching $98.3 billion, with a projected increase of 15% to $112.8 billion in 2025;
➄ The US government's export controls on China may limit shipments from US, Dutch, and Japanese manufacturers.
