11/11/2024, 10:27 AM UTC
台积电2nm，重磅信息TSMC's 2nm Process Breakthrough: Key Information
<p>➀ 台积电计划于2025年第四季度在新竹的Fab 20工厂开始生产基于2nm GAA的晶圆，该工厂的产能为30k wpm，随后位于高雄的Fab 22工厂也将开始生产，产能同样为30k wpm，预计将于2026年第一季度开始生产。</p><p>➁ N2P将于2026年底开始生产，但不会有之前宣布的背面电力输送。</p><p>➂ N2和N2P都将使用台积电的NanoFlex技术，该技术允许芯片设计人员在同一块设计中混合和匹配来自不同库（高性能、低功耗、面积高效）的单元。</p><p>➀ TSMC is scheduled to start producing 2nm GAA wafers in the fourth quarter of 2025 at its Fab 20 factory in Hsinchu, with a capacity of 30k wpm, followed by the Fab 22 factory in Kaohsiung, also with a capacity of 30k wpm, starting production in the first quarter of 2026.</p><p>➁ N2P production will begin at the end of 2026, but without the previously announced backside power delivery.</p><p>➂ The N2 and N2P processes will use TSMC's NanoFlex technology, allowing chip designers to mix and match units from different libraries (high-performance, low-power, area-efficient) on the same design.</p>
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