10/13/2024, 09:05 AM UTC
半导体制造设备份额：ASML居首，日本TEL第4Semiconductor Manufacturing Equipment Market Share: ASML Leading, Japan's TEL Fourth
<p>➀ 2023年，阿斯麦超越应用材料公司（AMAT），成为半导体制造设备市场的领导者；</p><p>➁ 2023年，阿斯麦的设备出货额达到237亿美元，较2022年增长48%；</p><p>➂ 受存储器市场不景气影响，TEL的出货额在2023年减少了23%，降至103亿美元；</p><p>➃ 预计2024年全球半导体制造设备市场规模将同比增长3%，达到983亿美元，2025年将增长15%，达到1128亿美元；</p><p>➄ 美国政府对华出口管制可能限制美国、荷兰和日本制造商的出货。</p><p>➀ ASML surpasses AMAT to lead the semiconductor manufacturing equipment market in 2023;</p><p>➁ ASML's equipment shipment reached $23.7 billion in 2023, a 48% increase from 2022;</p><p>➂ TEL, affected by the downturn in the memory market, saw its shipments decline by 23% to $10.3 billion in 2023;</p><p>➃ The global semiconductor manufacturing equipment market is expected to grow by 3% in 2024, reaching $98.3 billion, with a projected increase of 15% to $112.8 billion in 2025;</p><p>➄ The US government's export controls on China may limit shipments from US, Dutch, and Japanese manufacturers.</p>
---
本文由大语言模型（LLM）生成，旨在为读者提供半导体新闻内容的知识扩展（Beta）。
