<p>➀ CMP technology combines chemical and mechanical actions for surface planarization;</p><p>➁ CMP plays a crucial role in semiconductor manufacturing, including initial wafer flattening, metal interconnect structure fabrication, and chip packaging;</p><p>➂ Key components of CMP equipment include polishing heads, polishing pads, and polishing slurries, each requiring precise control and optimization;</p><p>➃ CMP technology faces challenges such as nanometer-level precision, adaptation to new materials, and environmental and cost pressures;</p><p>➄ The future of CMP technology includes technological advancement, market demand growth, and a diversifying industry landscape.</p>