07/30/2024, 04:00 PM UTC
Alphawave Semi 首次实现3nm UCIe D2D IP硅片启动Alphawave Semi first to 3nm UCIe D2D IP silicon bring-up
1、Alphawave Semi 声称已成功实现与台积电CoWoS先进封装技术相结合的首个3nm UCIe Die-to-Die (D2D) IP硅片启动。2、该完整的PHY和控制器子系统是与台积电合作开发的，面向超大规模计算、高性能计算和人工智能等应用。3、该IP支持多种协议，并集成了实时每通道健康监测，为高性能连接解决方案设定了新标准。1. Alphawave Semi claims to have successfully brought up the first 3nm UCIe Die-to-Die (D2D) IP with TSMC's CoWoS advanced packaging technology. 2. The complete PHY and Controller subsystem was developed in collaboration with TSMC, targeting applications like hyperscaler, HPC, and AI. 3. The IP supports multiple protocols and integrates live per-lane health monitoring, setting a new benchmark in high-performance connectivity solutions.
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