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electronicsforu

07/31/2024, 02:44 PM UTC

行业首个采用TSMC CoWoS封装的UCIe IPIndustry’s First UCIe IP Featuring TSMC CoWoS Packaging

1、Alphawave Semi推出行业首个采用TSMC CoWoS先进封装技术的3nm UCIe Die-to-Die IP；2、该IP提供8 Tbps/mm的带宽密度，支持24 Gbps的设备间数据速率；3、面向超大规模、高性能计算和AI应用，该IP具有高互操作性和强大的性能。1. Alphawave Semi introduces the industry's first UCIe Die-to-Die IP at 3nm using TSMC's CoWoS advanced packaging technology; 2. The IP offers 8 Tbps/mm bandwidth density and supports 24 Gbps device-to-device data rates; 3. Aimed at hyperscale, high-performance computing, and AI applications, the IP features high interoperability and robust performance.

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