07/29/2024, 01:00 PM UTC
Alphawave Semi 推出行业首款多协议I/O连接芯片,助力高性能计算和AI基础设施Alphawave Semi Tapes Out Industry-First, Multi-Protocol I/O Connectivity Chiplet for HPC and AI Infrastructure
1、Alphawave Semi 开发了行业首款用于高性能计算(HPC)和人工智能(AI)的多协议I/O连接芯片,传输速率达1.6Tbps;2、该芯片支持多种协议,包括PCIe、CXL和以太网,提高了数据传输效率和AI模型训练能力;3、Alphawave Semi 在技术和商业因素上的双重关注,推动了芯片技术在高性能计算和AI应用中的采用和可持续性。1. Alphawave Semi has developed the industry's first multi-protocol I/O connectivity chiplet for HPC and AI, delivering 1.6Tbps throughput; 2. The chiplet supports various protocols including PCIe, CXL, and Ethernet, enhancing data transfer efficiency and AI model training; 3. Alphawave Semi's focus on both technical and business factors is driving the adoption and sustainability of chiplet technology in high-performance computing and AI applications.---
本文由大语言模型(LLM)生成,旨在为读者提供半导体新闻内容的知识扩展(Beta)。