electronicsweekly

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September 23

  • CHIIPS #17 – AI growth insights from Ed Kaste of Global Foundries

    ➀ The latest episode of the CHIIPS podcast features Ed Kaste from Global Foundries discussing AI's role in driving semiconductor industry growth, particularly at the edge;

    ➁ Kaste highlights key design challenges related to power efficiency and system integration in AI-driven semiconductor development;

    ➂ The podcast emphasizes the importance of AI as a catalyst for innovation and market expansion in the semiconductor sector.

    AIGlobalfoundriessemiconductor
  • Morse Micro raises $59m

    ➀ Australian Wi-Fi HaLow chip company Morse Micro raised $59 million in Series C funding, totaling over $193 million to date, with participation from MegaChips, NRFC, and other investors;

    ➁ The funds will accelerate international expansion, scale production of Wi-Fi HaLow chips, and support the transition to IoT 2.0 with high-throughput, long-range connectivity;

    ➂ Morse Micro announced its HaLowLink 2 evaluation platform, launched a second-gen SoC, expanded partnerships, and achieved mass production with OEMs.

    HPCIoTsemiconductor
  • TSMC has 15 customers for 2nm

    ➀ TSMC has secured 15 customers for its 2nm process (N2) with wafer prices at $30,000 each, including 10 dedicated to high-performance computing (HPC);

    ➁ Apple reserved half of TSMC's 2nm capacity by booking all initial output at the Baoshan fab, while other clients like Nvidia, Intel, and Google will use the Kaohsiung fab;

    ➂ TSMC’s 2nm production is projected to reach 45-50k wafers per month in Q4 2025, generating $1.8-3 billion in revenue, with plans to expand to 200k wpm by 2028.

    2nmHPCTSMC
  • ITRI and NPL to co-operate on R&D, personnel exchanges and standards

    ➀ Taiwan’s ITRI and the UK’s NPL signed a cooperation agreement for semiconductor measurement standards, R&D, and personnel exchanges, aiming to strengthen global standardization and Taiwan’s leadership in tech supply chains.

    ➁ The collaboration merges Taiwan’s semiconductor expertise with the UK’s strengths in foundational science and metrology to reduce technical trade barriers and advance innovation in semiconductors and advanced materials.

    ➂ Aligned with the UK’s 2025 Industrial Strategy, which prioritizes semiconductors, the partnership addresses challenges like supply chain resilience and talent shortages while fostering cross-border cooperation.

    AIHPCsemiconductor
  • EnSilica and Codasip hook up on CHERI

    ➀ EnSilica and Codasip partner to integrate CHERI cybersecurity into ASICs for automotive, defense, and aerospace applications;

    ➁ CHERI's hardware architecture mitigates memory vulnerabilities, combined with Post-Quantum Cryptography and Codasip's RISC-V CPUs meeting ISO safety standards;

    ➂ Collaboration aims to accelerate adoption of secure, application-specific ASICs in mission-critical fields.

    automotivecybersecuritysemiconductor
  • Magnetic Bubbles 8x Smaller

    ➀ In 1978, IBM scientists experimentally developed magnetic bubbles 8 times smaller than commercial garnet-based ones, promising a dramatic increase in memory density (e.g., 3 million bits to 100 million bits per square inch);

    ➀ The research by Edward Giess and Robert Kobliska analyzed garnet properties and magnetic interactions, laying groundwork for submicron bubble device design;

    ➂ IBM emphasized that smaller bubbles reduce chip costs by enabling higher data density, serving as foundational progress for future memory technologies.

    ibmmemorysemiconductor

September 22

  • Picture of the Day: New Space gallery at Science Museum

    ➀ The Science Museum in London unveiled an updated Space gallery, featuring historical artifacts like space capsules, lunar samples, and modern UK space industry innovations;

    ➁ The exhibition highlights female contributions to space exploration, including Helen Sharman, Katherine Johnson, and contemporary figures like Zoe Clark and Leicester University researchers;

    ➂ Showcases UK space technology advancements, such as CubeSats, propulsion prototypes, and Rolls Royce’s lunar nuclear power concept.

    SpaceUniversityscience
  • Nvidia and Wayve talking about a $500m investment

    ➀ Nvidia signed a letter of intent with UK self-driving startup Wayve for a potential $500m investment, building on a 7-year collaboration and existing use of NVIDIA's Drive AGX Thor technology;

    ➁ Wayve's AI foundation model combines imitation learning, reinforcement learning, and simulation to adapt to global driving environments with minimal retraining;

    ➂ The company plans London self-driving trials with Uber and has raised $1.3bn to date, with new funding potentially reaching $1.8bn.

    AINVIDIAautomotive
  • Asian diversification for notebook production

    ➀ Dell and Apple's investments in Vietnam drive supply chain clustering, attracting brands and major ODMs like Compal and Wistron to expand production capacity.

    ➁ Vietnam and Thailand are key growth hubs, with Vietnam projected to account for 13.5% of global notebook production by 2025, while Thailand's share may reach 6.7%.

    ➂ Global notebook shipments are expected to rise 2.2% year-on-year in 2025, exceeding 180 million units, driven by strong Q2 (9.5% YoY) and Q3 (7.5% QoQ) growth.

    DellLaptopSupply Chain
  • Analogue test software claims to reduce testing time from months to days

    ➀ Siemens Digital Industries Software launched Tessent AnalogTest, an automated DFT solution that reduces analog circuit testing time from months to days by generating digital test patterns and minimal-impact DFT circuitry;

    ➁ The software achieves >90% defect coverage verification within hours using cost-effective digital ATE, replacing expensive mixed-signal testers, and aligns with IEEE P2427/P1687.2 standards for functional safety and parametric testing;

    ➂ Early partners are already utilizing the solution, with general availability planned for December 2025, promising accelerated time-to-market and up to 100x faster tests compared to traditional methods.

    EDASiemenssemiconductor

September 21

  • UK energy price may stymie US datacentre investment

    ➀ The UK's high energy costs, the highest in Europe, risk undermining government efforts to attract datacentre investments from U.S. firms like Microsoft, OpenAI, and Nvidia during President Trump's State Visit;

    ➀ Key concerns center on energy price data from July–December 2024, sourced from the Department for Energy Security and Net Zero;

    ➂ The investment pledges from major tech companies may be jeopardized due to escalating operational expenses tied to energy.

    HPCNVIDIAsemiconductor

September 19

  • Most Read – Anti-dumping, ST, ADIOS Electronics, UK-US

    ➀ The UK and US announced a $42 billion 'Tech Prosperity Deal' with Nvidia deploying 120,000 GPUs to support AI and quantum computing initiatives;

    ➁ STMicroelectronics reached agreements to avoid layoffs at its Agrate site in Italy and unveiled a $60 million investment in a Panel-Level-Packaging (PLP) production line in France;

    ➂ China launched an anti-dumping probe targeting US analog ICs using 40nm and above process technologies.

    NVIDIASTMicroelectronicssemiconductor
  • AWS uses Raspberry Pi for EKS at the edge

    ➀ Amazon Web Services (AWS) demonstrates a method to implement Elastic Kubernetes Service (EKS) Hybrid Nodes using Raspberry Pi 5 for edge workloads;

    ➁ The architecture involves a cloud-based VPC with an EC2 instance acting as a VPN gateway, establishing a secure WireGuard tunnel to Raspberry Pi devices for cluster communication;

    ➂ Raspberry Pi nodes integrate with the EKS control plane via AWS Systems Manager, functioning as standard worker nodes despite running on decentralized hardware.

    AWSRaspberry PiSoftware
  • Apple talks about folding phone production in Taiwan

    ➀ Apple discussed establishing a folding iPhone test production line in Taiwan, with mass production planned in India to boost market expansion;

    ➁ Apple's anticipated entry into the folding phone market by late 2026 is projected to increase global adoption from 1.6% to over 3%, driven by its brand influence;

    ➂ Challenges include relocating Chinese engineers from India due to government recalls, while Taiwanese suppliers secure land for a pilot line requiring ~1,000 operators.

    Laptopiossemiconductor
  • Q2 WLAN market up 13.2% YoY

    ➀ The Q2 enterprise WLAN market grew 13.2% YoY to $2.6 billion, driven by Wi-Fi 6E/7 adoption, which expanded bandwidth in the 6 GHz band;

    ➁ Wi-Fi 7 accounted for 21.2% of dependent AP revenues (up from 11.8% last quarter), while regional growth varied (Americas +17%, China -6.6%);

    ➂ Cisco led with 37.8% market share, followed by HPE Aruba, Ubiquiti, Huawei, and Juniper, with HPE finalizing its Juniper acquisition in July 2025.

    AISoftwaresemiconductor
  • Teachers’ Salaries

    ➀ The OECD's Education at a Glance report highlights significant disparities in primary school teacher salaries across member countries, ranging from over $90,000 annually in Germany, Luxembourg, and the Netherlands to $55,407 in Poland;

    ➀ The average annual salary for teachers in 34 OECD countries was $57,399 in 2024, with the U.S. at $68,153, the UK at $54,550, and Scotland at $62,584;

    ➂ The data underscores global inequalities in educational compensation and reflects broader socioeconomic priorities in different regions.

September 18

  • What caught your eye? (MEMS resonators, Market recovery, Depth of field)

    ➀ SiTime launches Titan MEMS resonators for compact medical and IoT devices;

    ➁ Analysts highlight signs of semiconductor market recovery with inventory normalization;

    ➂ Chinese researchers develop infrared-visualizing pinhole camera using laser tech, while Lacuna Space expands IoT with helical antennas.

    ChinaMEMS
  • Intel Core Ultra 7 in 5in industrial PC motherboard

    ➀ Kontron launches a 140 x 148mm mini-STX industrial motherboard powered by Intel Core Ultra 7/5 processors, featuring an NPU for AI acceleration in applications like automation and digital signage;

    ➁ The board supports up to four 4K displays, includes Thunderbolt 4/USB 3.2 Gen2 interfaces, dual DDR5-5600 memory slots, and operates in 0–60°C environments;

    ➂ Compatible with Windows IoT/Linux OS, it offers flexible power input and a modular case (Smartcase S502) for deployments in retail, medical, and industrial settings.

    AIKontronindustrial
  • China objects to US chip hand-me-downs

    ➀ China's Cyberspace Administration instructs domestic tech companies to avoid purchasing Nvidia's H20 GPUs and RTX Pro 6000D AI chips, restricted under U.S. export rules;

    ➁ Despite this, China still seeks Nvidia's high-end chips, but its officials are angered by U.S. Commerce Secretary Howard Lutnick's remarks about selling only lower-tier chips to China;

    ➂ Nvidia CEO Jensen Huang expressed disappointment in U.S.-China tensions and emphasized the strategic importance of maintaining U.S. chip technology as the global standard.

    AI ChipNVIDIAsemiconductor
  • SMIC testing domestic immersion DUV machine

    ➀ SMIC is testing a domestically developed immersion DUV lithography tool by Shanghai-based Yuliangsheng, aiming for production readiness in at least two years;

    ➁ Yuliangsheng, a subsidiary of Shenzhen's Si Carrier, is also working on an EUV machine codenamed 'Mount Everest';

    ➂ China’s DUV efforts include SMEE’s 28nm-capable system and existing ASML machines purchased before U.S. export restrictions.

    ASMLSMICsemiconductor
  • Q2 smartphone production up 4% QoQ and 4.8% YoY

    ➀ Smartphone production reached 300 million units in Q2 2025, marking a 4% QoQ and 4.8% YoY growth;

    ➁ Samsung maintained its lead with 58 million units despite a 5% QoQ decline, while Apple ranked second with 46 million units, down 9% QoQ due to seasonal factors;

    ➂ Xiaomi, Oppo, Transsion, and Vivo saw significant growth driven by subsidies and expansion in emerging markets, collectively reinforcing the top six vendors' 80% market share.

    AppleSamsungsmartphone

September 17

  • Top Ten NEV Vendors

    ➀ The article highlights TrendForce's report ranking the top ten new energy vehicle (NEV) vendors, though specific company names are not disclosed;

    ➀ It is part of David Manners' ongoing market analysis series, which covers tech and automotive sectors;

    ➂ References to previous rankings (EV vendors, tablets, smartphones, PCs) suggest a focus on market trends and competitive landscapes.

    Market ShareTrendForceautomotive
  • Sponsored Content: LED diodes and other optoelectronic components Everlight

    ➀ Everlight, a Taiwanese optoelectronics leader with 40+ years of experience, offers a wide range of components including LEDs, phototransistors, photodiodes, and optocouplers;

    ➀ Products cater to industrial devices, power supplies, consumer electronics, and telecommunications, with THT/SMD LEDs (3mm–5mm), IR modules, and RGB solutions available through TME warehouses;

    ➂ Key technical highlights include LEDs with 1.15V–4.3V operating voltage, phototransistors with 890–1030nm sensitivity, and optocouplers supporting analog/digital outputs for motor control and circuit isolation.

    LEDOptoelectronics

September 16

  • Comparative energy costs between sources

    ➀ The article compares energy generation costs per MWh across various sources, highlighting gas ($30-$75/MWh for existing plants, up to $110 with construction), coal ($70-$170), and nuclear ($140-$220);

    ➁ Renewable sources like onshore wind ($40-$86) and utility-scale solar ($78) are more cost-effective, while offshore wind ($70-$157) and nuclear projects like Vogtle 3-4 ($169-$228) face higher costs;

    ➂ Single-cycle gas plants remain expensive but critical for peak demand due to quick activation capabilities.

    CoolingHPCsemiconductor
  • Engineering physical AI

    ➀ Physical AI focuses on enabling intelligent systems to interact with dynamic real-world environments through advanced sensors, multi-physics principles, and simulation tools;

    ➁ Physics-based simulation is critical for testing sensor performance under diverse conditions and generating high-fidelity synthetic data for AI training;

    ➂ Traditional linear engineering processes are insufficient, requiring integrated multi-domain collaboration (hardware, software, sensors) and EDA-powered solutions to meet modern development demands.

    AIEDAsemiconductor
  • Counting on control how robotics hinges on precision timing

    ➀ The adoption of robotics in manufacturing demands precision timing, enabled by MEMS oscillators, to achieve sub-microsecond synchronization for tasks like defect detection and collaborative operations;

    ➁ AI-driven machine vision and IoT systems rely on precise timing for real-time quality control and predictive maintenance, while MEMS technology ensures durability in harsh industrial environments;

    ➂ Functional safety in human-robot interaction and advanced applications like autonomous vehicles highlights the critical role of timing devices, with SiTime’s MEMS solutions offering robust, temperature-resistant options for industrial automation.

    AIMEMSrobotics
  • ST agrees to abandon plans for lay-offs at Agrate

    ➀ ST reaches agreement to avoid layoffs at its Agrate site in Italy, abandoning initial plans for 1,200 redundancies in the country;

    ➁ The decision follows negotiations with Italian unions and government, with no structural changes planned at other Italian sites;

    ➂ ST attributes challenges to slow EV market adoption impacting its SiC business but eyes Agrate expansion by 2027 amid improved market conditions.

    STautomotivesemiconductor
  • Mouser stocking Intel Ethernet network adapter for OCP 3.0

    ➀ Mouser is now stocking Intel's E610-IT4 Ethernet network adapter compliant with OCP 3.0 specifications, featuring quad-port configuration and support for 10GBASE-T/5G/2.5G speeds for data center and edge applications;

    ➁ The adapter integrates Intel's hardware-based traffic steering, virtualization enhancements, security features (including hardware Root of Trust), and intelligent offloads to reduce I/O bottlenecks;

    ➂ Designed in OCP NIC 3.0 SFF format with 16 PCIe lanes, it offers flexible purchasing options in individual or multi-unit packaging for server/workstation upgrades.

    Intelsemiconductor
  • Solderless connections for leading-edge ICs

    ➀ Anthony Paul Bellezza developed two solderless interconnect processes for advanced ICs, addressing challenges with traditional soldering;

    ➁ The fusion-based method uses low-temperature bonding (200-400°C) and martensitic substrates to create durable, ultra-low-resistance interconnects with environmental benefits;

    ➂ A secondary 2D graphene deposition process offers CMOS compatibility but is less durable, making it suitable for consumer electronics requiring frequent upgrades.

    3D ICChipletsemiconductor
  • UKRI invests in immersive technology for mental health care services

    ➀ UKRI, through Innovate UK, invests £3.6 million in 17 XR projects to develop scalable mental health solutions, focusing on conditions like ADHD, autism, and addiction recovery;

    ➀ Technologies include virtual reality therapy programs mimicking real-life sessions and smart glasses to assist individuals with depression in daily tasks;

    ➂ The initiative aims to integrate immersive technology into the UK's formal healthcare system, enhancing care delivery and economic growth.

    SoftwareVR