➀ TSMC plans to combine InFO-SoW and SoIC technologies to form CoW-SoW, addressing the trend of larger chips and the need for more HBM in AI workloads. ➁ The new technology is expected to enter mass production by 2027, aiming to stack memory or logic chips directly on the wafer. ➂ Challenges in chip design and manufacturing complexity are increasing as chip sizes expand, necessitating changes in design to improve yield and performance.

➀ OpenAI is developing its first in-house chip with TSMC using the A16 Angstrom process, aimed at enhancing Sora's video-generation capabilities. ➁ The chip development was initially planned with TSMC but was later canceled due to profitability concerns. ➂ The new chip could potentially boost Apple device sales as it integrates with Apple's generative AI features.

➀ TSMC's third factory in Arizona has officially started construction, confirmed by Sandra Watson, President of the Arizona Commerce Authority. ➁ The first phase of the factory is expected to begin production of 4nm chips in the first half of 2025, with the second phase targeting 3nm and 2nm production by 2028. ➂ The total investment for all three phases is estimated at $65 billion, with the state government actively supporting the project and inviting other tech companies to invest in Arizona.

➀ TechanaLye analysis shows China's semiconductor industry rapidly advancing; ➁ SMIC produces 7-nanometer chips rivaling TSMC's 5-nanometer chips; ➂ Analysis conducted by TechanaLye CEO Hiroharu Shimizu comparing Huawei's Kirin 9010 chip

➀ TSMC's A16 process, which has not yet entered mass production, has already attracted significant attention. ➁ Apple has reserved the initial capacity of TSMC's A16 process, while OpenAI, the developer of ChatGPT, has also joined in reserving the A16 capacity due to its long-term demand for self-developed AI chips. ➂ OpenAI's strategic partnership with Broadcom and Marvell for ASIC chip development is expected to be produced at TSMC's 3nm family and subsequent A16 processes.

➀ Taiwan's specialty chemical sector is expected to benefit from TSMC's expansion, with local suppliers seeing increased demand for materials. ➁ Companies like Nan Pao, Sunlux, and Jie Liu Fa have already reported strong earnings, with more expected to follow. ➂ The integration into TSMC's CoWoS advanced packaging process is set to further boost these companies' profits, with estimates showing significant EPS increases for the next two years.

➀ Analog Bits is aggressively moving to advanced nodes, with new IP developments at 3nm and 2nm. ➁ The company continues to enhance its catalog with technologies like glitch detection, power management, and high-accuracy PVT sensors. ➂ The future may see Analog Bits integrating AI for adaptive control, enhancing system performance and power efficiency.

➀ ESMC, a joint venture between TSMC, Bosch, Infineon, and NXP, has started construction on its first fab in Dresden with a €5 billion subsidy from the German government. ➁ The RAN market continues to decline, with global RAN revenues falling at a double-digit rate for the fourth consecutive quarter. ➂ AMD has acquired ZT Systems for $4.9 billion to streamline its GPU development and sales for AI systems.

➀ TSMC has advanced the trial production of its 2nm technology to July, earlier than expected. ➁ The 2nm process will use the company's first-generation nanosheet transistor technology, promising significant improvements in performance and power efficiency. ➂ Apple is set to secure all initial 2nm production capacity from TSMC.

➀ Global semiconductor manufacturing shows signs of improvement with significant IC sales growth and stable capital expenditure. ➁ AI chip and HBM demand surge creates strong tailwinds for industry expansion. ➂ TSMC's market dominance continues to grow, with its share exceeding 62% and profitability surging.

➀ TSMC held a groundbreaking ceremony for its first 12-inch fab in Europe in Dresden, Germany. ➁ Chairman Wei哲家 indicated that rising costs due to environmental protections may lead to discussions with clients about pricing. ➂ The European Commission announced a 5 billion euro subsidy to support TSMC's German fab construction and operation.

➀ TSMC has acquired a plant and equipment from Innolux Corp. for NT$17.14 billion. ➁ The facility is located in the Southern Taiwan Science Park, covering an area of 317,445 square meters. ➂ This acquisition aims to boost TSMC's AI chip packaging capacity.

➀ ESMC, a joint venture between TSMC, Bosch, Infineon, and NXP, has started construction on its first fab in Dresden, with the EU approving a €5 billion subsidy from the German government for the €10 billion project. ➁ The facility, when operational, will produce 40,000 300mm wafers monthly using TSMC's 28/22nm planar CMOS and 16/12nm FinFET technologies, creating around 2,000 direct jobs and stimulating numerous indirect jobs. ➂ The project aims to be environmentally friendly, including energy-efficient construction and water reclamation, with plans to obtain LEED certification.

➀ Weebit Nano is leading the ReRAM revolution, addressing the limitations of flash memory. ➁ TSMC and other foundries are exploring and adopting ReRAM technology. ➂ ReRAM is gaining momentum in various applications, including AI and automotive.

➀ TSMC held a groundbreaking ceremony for its German plant, marking its first manufacturing expansion into Europe. ➁ The German government has committed to subsidizing half of the construction costs, approximately 5 billion euros. ➂ The plant is expected to start production by the end of 2027, targeting a monthly output of 40,000 12-inch wafers. ➃ The primary focus of the plant will be on mature processes of 28 and 22 nanometers, mainly for automotive chips. ➄ Challenges include finding sufficient local talent and navigating Germany's strong union traditions.

➀ TSMC's Senior Vice President, Kevin Zhang, stated that as long as technological scaling continues, he is indifferent to the status of Moore's Law. ➁ Zhang emphasized that Moore's Law should not be narrowly defined by 2D scaling alone but should include advancements in 3D integration and advanced packaging. ➂ TSMC continues to improve PPA (Performance, Power, and Area) by over 30% with each node transition, highlighting the ongoing relevance of technological innovation.

➀ Intel sold its 1.18 million Arm shares for $145 million to cut costs and strengthen finances, also announcing layoffs of at least 15% of its workforce. ➁ SMIC's Q2 profit dropped 59.1% year-on-year to $164.6 million despite a 21.8% revenue increase, with a forecasted Q3 revenue growth of 13-15%. ➂ TSMC achieved its best-ever revenue in July, totaling $7.9 billion, a 45% year-on-year increase, with HPC contributing 52% of the revenue.

➀ The Chips Act investments aimed at boosting semiconductor manufacturing are experiencing delays, as reported by major news outlets. ➁ TSMC's Arizona fab projects have seen significant postponements, with the 4nm production delayed to 2025 and the 2nm production to 2028. ➂ Intel and Samsung have also faced construction and production delays in their respective fab projects.

➀ TSMC's Arizona factory, modeled after its Taiwan facilities, faces significant challenges in adapting its complex manufacturing processes to the U.S.; ➁ Cultural conflicts between Taiwanese managers and American workers have led to frustration and resignations; ➂ The factory's start date has been delayed to 2025, and it faces potential political threats; ➃ TSMC is addressing workplace cultural differences and plans to recruit skilled workers in the coming years; ➄ The company is starting from scratch in the U.S., unlike in Taiwan where it has a well-established network of engineers and suppliers.

➀ TSMC achieved its highest-ever monthly revenue in July, reaching $7.9 billion, a 23.6% increase from the previous month and a 45% increase year-over-year. ➁ High-performance computing (HPC) contributed 52% of the total revenue. ➂ For the period of January to July 2024, TSMC's revenue totaled $47 billion, marking a 30.5% increase compared to the same period in 2023.