08/16/2024, 01:10 PM UTC
芯片法案晶圆厂项目延迟Chips Act fab projects delayed
➀ 旨在促进半导体制造业的芯片法案投资正在经历延迟，多家主要新闻机构报道了这一情况。➁ 台积电在亚利桑那州的晶圆厂项目遭遇重大延期，4nm生产推迟至2025年，2nm生产推迟至2028年。➂ 英特尔和三星在其各自的晶圆厂项目中也面临建设和生产延迟。➀ The Chips Act investments aimed at boosting semiconductor manufacturing are experiencing delays, as reported by major news outlets. ➁ TSMC's Arizona fab projects have seen significant postponements, with the 4nm production delayed to 2025 and the 2nm production to 2028. ➂ Intel and Samsung have also faced construction and production delays in their respective fab projects.
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本文由大语言模型（LLM）生成，旨在为读者提供半导体新闻内容的知识扩展（Beta）。
