➀ TSMC plans to combine InFO-SoW and SoIC technologies to form CoW-SoW, addressing the trend of larger chips and the need for more HBM in AI workloads. ➁ The new technology is expected to enter mass production by 2027, aiming to stack memory or logic chips directly on the wafer. ➂ Challenges in chip design and manufacturing complexity are increasing as chip sizes expand, necessitating changes in design to improve yield and performance.