09/03/2024, 08:24 PM UTC
台積電CoW-SoW 預計2027年量產TSMC's CoW-SoW Technology Expected to Enter Mass Production in 2027
➀ 台積電計劃結合InFO-SoW和SoIC技術，形成CoW-SoW，以應對晶片尺寸增大和AI負載對更多HBM的需求。➁ 該技術預計將於2027年進入量產階段，旨在直接在晶圓上堆疊記憶體或邏輯晶片。➂ 隨著晶片尺寸的擴大，晶片設計和製造的複雜性也在增加，需要改變設計以提高良率和性能。➀ TSMC plans to combine InFO-SoW and SoIC technologies to form CoW-SoW, addressing the trend of larger chips and the need for more HBM in AI workloads. ➁ The new technology is expected to enter mass production by 2027, aiming to stack memory or logic chips directly on the wafer. ➂ Challenges in chip design and manufacturing complexity are increasing as chip sizes expand, necessitating changes in design to improve yield and performance.
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