➀ Fraunhofer IPMS and DIVE imaging systems GmbH developed the DIVE VEpioneer® optical metrology tool, reducing semiconductor manufacturing control wafer usage by 25% and cutting CO₂ emissions by 118,000 kg/month in a 28nm production scenario;

➁ The system combines spectral imaging and AI for non-destructive wafer inspection, enabling rapid defect detection (20 seconds per wafer) across multilayer structures while saving water, chemicals, and energy;

➂ Installed at Fraunhofer's cleanroom, the solution will undergo further automation upgrades and benefit from DIVE's acquisition by PVA TePla AG to enhance industrial applicability under the Green ICT initiative.

➀ Fraunhofer IPMS and DIVE developed an optical measurement system (DIVE VEpioneer®) to streamline quality control in semiconductor manufacturing, reducing control wafer usage by 25% and CO₂ emissions by 118,000 kg monthly;

➁ The system uses spectroscopy and AI for non-invasive wafer inspection, enabling faster defect detection and enhancing production efficiency;

➂ The collaboration, part of the Green ICT initiative, aims to advance sustainable semiconductor manufacturing, with further plans for automation and integration improvements.

➀ Fraunhofer IPMS has developed a TSN testbed enabling precise energy analysis and wireless Li-Fi data transmission, achieving breakthroughs for mobile industrial applications;

➁ The Li-Fi-based TSN solution reduces cabling costs and surpasses 5G in latency, supporting autonomous robots in factory automation;

➂ The modular testbed supports key TSN standards and provides industry-first benchmarks for energy efficiency in real-time networks.

➀ Fraunhofer IPMS developed a MEMS vector scanner module capable of withstanding extreme conditions for space applications, replacing bulkier galvanometer systems;

➁ The compact module features a 5mm mirror, achieving a 52°×52° scan field, 10x lower power consumption, and high durability through shock-damped suspension;

➂ Potential applications extend beyond aerospace to medical laser therapy and optical communication, with industrial partners already showing interest.

➀ Fraunhofer IPMS partners with TSN Lab to advance Time Sensitive Networking (TSN) technology development and adoption in South Korea, enhancing its presence in the Asian market;

➁ The collaboration focuses on Ethernet-based TSN IP cores for high-precision time synchronization in industries like automotive, aerospace, and telecommunications;

➂ Leveraging Fraunhofer's TSN expertise and TSN Lab's industrial experience, the partnership aims to drive real-time data communication innovations across critical sectors.

➀ Fraunhofer IPMS introduced upgraded evaluation kits for spatial light modulators (SLMs), now supporting both tilting and sinking mirror actuators, enhancing versatility in high-precision light pattern generation for lithography, medical tech, and quantum computing;

➁ The kits operate across UV to near-infrared spectra, feature kHz-level modulation frequencies, and aim to expand to deep-UV wavelengths, with nanoscale calibration enabling ultra-precise analog control;

➂ Applications span microscopy, semiconductor lithography, 3D holography, adaptive optics in astronomy, and quantum computing, showcased at Laser World of Photonics 2025.

➀ Fraunhofer IPMS introduces advanced evaluation kits for spatial light modulators (SLMs) with tilting/piston mirrors, enabling pixel-level light manipulation for lithography, medical tech, and quantum computing;

➁ The kits support UV to near-infrared spectral ranges, high modulation frequencies (kHz), and nano-scale calibration, with plans to expand to deep UV for higher precision;

➂ Applications include semiconductor microlithography, 3D holography displays, adaptive optics, and quantum computing, showcased at Laser World of Photonics 2025.

➀ NY CREATES and Fraunhofer IPMS signed a Joint Development Agreement (JDA) to advance research on 300mm wafer-based data storage technologies, focusing on ferroelectric memory devices;

➁ The collaboration aims to combine expertise in materials evaluation and process development for energy-efficient, CMOS-compatible memory solutions applicable to neuromorphic computing;

➂ This builds on a prior 2023 Memorandum of Understanding, reinforcing transatlantic cooperation to drive semiconductor innovation and economic growth.

➀ NY CREATES and Fraunhofer IPMS formalized a Joint Development Agreement (JDA) to co-develop advanced 300mm wafer-scale memory devices, focusing on ferroelectric memory technology using hafnium oxide (HfO₂);

➀ The collaboration aims to enhance energy-efficient, scalable memory solutions for neuromorphic computing applications, leveraging Fraunhofer IPMS's expertise in HfO₂-based memory and NY CREATES' Albany NanoTech Complex facilities;

➂ The partnership builds on prior agreements and aligns with U.S. initiatives like the CHIPS for America EUV Accelerator to strengthen semiconductor R&D leadership and economic growth.

➀ The article discusses the development of a high-voltage CMOS backplane for very bright OLED microdisplays.

➁ It explains how stacking OLED layers can improve brightness while maintaining lifespan and reliability.

➂ The advantages of OLED technology over microLEDs are highlighted, emphasizing maturity, efficiency, and color representation.

➀ Fraunhofer IPMS and aconnic AG have developed a new TSN-MACsec IP core for secure data transmission in 5G/6G networks.

➁ The IP core combines the advantages of TSN and MACsec, enhancing data protection and reliability.

➂ The project, RealSec5G, aims to integrate cybersecurity and data security, meeting functional safety and data security requirements.