<p>➀ Fraunhofer IPMS and DIVE imaging systems GmbH developed the DIVE VEpioneer® optical metrology tool, reducing semiconductor manufacturing control wafer usage by 25% and cutting CO₂ emissions by 118,000 kg/month in a 28nm production scenario;</p><p>➁ The system combines spectral imaging and AI for non-destructive wafer inspection, enabling rapid defect detection (20 seconds per wafer) across multilayer structures while saving water, chemicals, and energy;</p><p>➂ Installed at Fraunhofer's cleanroom, the solution will undergo further automation upgrades and benefit from DIVE's acquisition by PVA TePla AG to enhance industrial applicability under the Green ICT initiative.</p>