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May 30
- The Fallacy of Operator Fallback and the Future of Machine Learning Accelerators1、传统异构架构无法满足机器学习模型的不断演进，导致硬件加速器的需求增加。 2、Quadric的Chimera GPNPU提供了一个统一、可编程的架构，解决了传统架构的限制。 3、Chimera GPNPU可以 实现高性能的机器学习推断和实时处理
- Secure-IC Presents AI-Powered Cybersecurity1、Secure-IC推出了 AI 论powers的网络安全设计，涵盖硬件和软件两方面。 2、该系统包括入侵检测系统（IDS），采用 AI/ML 方法ology来检测和响应威胁。 3、系统可以与安全组件 Secure-IC iSE 集成，提供端到端的检测和响应解决方案。
May 29
- Mastering Copper TSV Fill Part 2 of 31、void-free填充TSV的六个阶段：feature wetting和wafer entry、-feature polarization、nucleation、fill propagation、accelerator ejection、bulk layer plating。 2、特征polarization对TSV填充的重要性。 3、nucleation对于TSV填充的影响。
- Using LLMs for Fault Localization. Innovation in Verification1、该论文讨论了使用大语言模型（LLM）进行故障定位（根因分析）的方法。 2、本文作者使用链式思维提示和函数调用两种技术来实现fault localization。 3、实验结果显示，LLM 在 Defects4J 数据库上的检测率达到 55%，且通过多次调用函数可以进一步提高检测率。
- Elevating Your SoC for Reconfigurable Computing – EFLX® eFPGA and InferX™ DSP and AI1、eFPGAflexibilityASIC 2、eFPGAIPAI 3、eFPGA
May 28
- The 2024 Design Automation Conference and Certus Semiconductor1、DAC（设计自动化会议）即将举行，Certus 半导体将出席第四次会议，展示高性能 I/O 和 ESD 产品的优势。 2、Certus 半导体继续推动创新，提供低成本、高性能的 I/O 和 ESD 解决方案。 3、Certus 半导体的产品具有广泛的应用前景，包括 FPGA 和高性能计算市场。
- AI System Connectivity for UCIe and Chiplet Interfaces Demand Escalating Bandwidth Needs1、AI 应用需要高速数据传输和低延迟的连接，以满足计算需求。 2、UCIe 和 chiplet 接口提供高带宽、低延迟、可扩展性和低能耗的解决方案。 3、Alphawave Semi 的 UCIe 解决方案提供了可靠的 Physical Layer-Electrical PHY 和 Die-to-Die Adapter，支持多种封装类型和协议标准。
May 27
- Webinar – CHERI: Fine-Grained Memory Protection to Prevent Cyber Attacks1、在网络攻击中，内存弱点是主要根源，cheri技术可以防止这些攻击。 2、cheri是一个扩展的处理器ISA，启用了坚实的内存访问机制。 3、cheri技术可以用于保护数据栈、实现compartmentalization，并且可以轻松地实施到现有的应用程序中。
May 26
- Top three challenges for global semiconductor manufacturing in 20241、地缘政治不确定性是全球半导体制造业在2024年面临的挑战之一，美国对中国高级芯片出口的限制震荡了全球半导体行业。 2、技术转变是全球半导体制造业的另一个挑战，电动汽车和人工智能驱动芯片需求的增加，将对半导体行业产生深远的影响。 3、产能获得是全球半导体制造业面临的第三个挑战，公司需要找到可靠的方式来获得芯片产能，以满足未来增长的需求。
May 24
- Ncredible Nvidia1. The article previews Nvidia's upcoming earnings release, focusing on the company's performance in the data center market and its impact on the semiconductor supply chain. 2. Nvidia's dominance in the data center market has led to significant shifts, including a transition from CPU to GPU and from components to systems, affecting competitors like Intel. 3. The article also discusses the changes in the supply chain due to the AI revolution, highlighting the shift from standard DRAM to High-Bandwidth Memory and new packaging technologies like CoWoS by TSMC.
- Ncredible Nvidia1、英伟达的指导建议表明，这个季度将更加平稳。 2、英伟达的数据中心业务是其最重要的市场，占据了高达87%的市场份额。 3、英特尔面临着严峻的挑战，包括GPU业务的转型和系统业务的转型。
May 15
- Tools for Chips and Dips an Overview of the Semiconductor Tools MarketFrom humble beginnings in military applications, the semiconductor industry has been fundamental to all societal growth, and everything that grows exponentially depends on semiconductors. It is not a gentle industry. Products over two years old are unsellable, and there is either too much supply or none. Semiconductor scarcity… Read More The post Tools for Chips and Dips an Overview of the Semiconductor Tools Market appeared first on SemiWiki.
- How Samtec Helps Achieve 224G PAM4 in the Real World224 Gbps PAM4 gets attention for applications such as data center, AI/ML, accelerated computing, instrumentation and test and measurement. The question is how real is it and what are the challenges that need to be overcome to implement reliable channels at that data rate? If you wonder about these kinds of topics for your next design,… Read More The post How Samtec Helps Achieve 224G PAM4 in the Real World appeared first on SemiWiki.
- SoC Power Islands Verification with Hardware-assisted VerificationThe ever-growing demand for longer battery life in mobile devices and energy savings in general have pushed power optimization to the top of designers’ concerns. While various techniques like multi-VT transistors and clock gating offer power savings at gate-level design, the real impact occurs at system level, where hardware… Read More The post SoC Power Islands Verification with Hardware-assisted Verification appeared first on SemiWiki.
May 14
- Anirudh Fireside Chats with Jensen and CristianoAt CadenceLIVE 2024 Anirudh Devgan (President and CEO of Cadence) hosted two fireside chats, one with Jensen Huang (President and CEO of NVIDIA) and one with Cristiano Amon (President and CEO of Qualcomm). As you would expect both discussions were engaging and enlightening. What follows are my takeaways from those chats. Anirudh … Read More The post Anirudh Fireside Chats with Jensen and Cristiano appeared first on SemiWiki.
- ARC-V portfolio plus mature software IP targets three tiersSynopsys is bridging its long-running ARC® processor IP strategy into a RISC-V architecture – Bernard Murphy introduced the news here on SemiWiki last November. We’re getting new insight from Synopsys on its ARC-V™ portfolio and how they see RISC-V IP plus their mature software development toolchain IP fitting customer needs… Read More The post ARC-V portfolio plus mature software IP targets three tiers appeared first on SemiWiki.
May 13
- Siemens EDA Makes 3D IC Design More Accessible with Early Package Assembly Verification2.5D and 3D ICs present special challenges since these designs contain multiple chiplets of different materials integrated in all three dimensions. This complexity demands full assembly verification of the entire stack, considering all the subtle electrical and physical interactions of the complete system. Identifying… Read More The post Siemens EDA Makes 3D IC Design More Accessible with Early Package Assembly Verification appeared first on SemiWiki.
May 10
- Webinar: Fine-grained Memory Protection to Prevent RISC-V Cyber AttacksMost organizations are aware of cybercrime attempts such as phishing, installing malware from dodgy websites or ransomware attacks and undertake countermeasures. However, relatively little attention has been given to memory safety vulnerabilities such as buffer overflows or over-reads. For decades, the industry has created… Read More The post Webinar: Fine-grained Memory Protection to Prevent RISC-V Cyber Attacks appeared first on SemiWiki.
- CEO Interview: Dr. Nasib Naser of ORION VLSI Technologies.Dr. Nasib Naser brings over 35 years of experience in the field. His expertise spans the entire VLSI cycle from conception to chip design, with a strong focus on verification methodologies. For his 17 years at Synopsys, Dr. Naser have held senior management positions, leading North American Verification IP, managing Central … Read More The post CEO Interview: Dr. Nasib Naser of ORION VLSI Technologies. appeared first on SemiWiki.
- Webinar: Samtec and Achronix Expand AI in the Data CenterThe performance demands of data centers continues to grow, driven to large degree by the ubiquitous use of complex AI algorithms. On April 25, Embedded Computing Design held a very informative webinar on this topic. Two experts looked at the problem from the standpoint of processor architecture and communication strategies,… Read More The post Webinar: Samtec and Achronix Expand AI in the Data Center appeared first on SemiWiki.
May 9
- Don’t Settle for Less Than Optimal – Get the Perfect Inductor Every TimeThe meaning of the word “Veloce” is “blazing fast”. It is the inspiration behind the name of the Ansys VeloceRF electromagnetic (EM) passive device synthesis platform that has been a favorite among RF and high-speed integrated circuit (IC) designers for more than 15 years. VeloceRF is a name that designers automatically connect… Read More The post Don’t Settle for Less Than Optimal – Get the Perfect Inductor Every Time appeared first on SemiWiki.
- Synopsys is Paving the Way for Success with 112G SerDes and BeyondData communication speeds continue to grow. New encoding schemes, such as PAM-4 are helping achieve faster throughput. Compared to the traditional NRZ scheme, PAM4 can send twice the signal by using four levels vs. the two used in NRZ. The diagram at the top of this post shows the how data density is increased. With progress comes… Read More The post Synopsys is Paving the Way for Success with 112G SerDes and Beyond appeared first on SemiWiki.
May 8
- Oops, We did it again! Memory Companies Investment StrategyWe are in the semiconductor market phase where everybody disagrees on what is going on. The market is up; the market is down. Mobile phones are up…. oh no, now they are down. The PC market is up—oh no, we need to wait until we can get an AI PC. The inflation is high—the consumer is not buying. For us in the industry, the 13-week financial … Read More The post Oops, We did it again! Memory Companies Investment Strategy appeared first on SemiWiki.
- An Enduring Growth Challenge for Formal VerificationA high-quality verification campaign including methods able to absolutely prove the correctness of critical design behaviors as a complement to mainstream dynamic verification? At first glance this should be a no-brainer. Formal verification offers that option and formal adoption has been growing steadily, now used in around… Read More The post An Enduring Growth Challenge for Formal Verification appeared first on SemiWiki.
- Rigid-flex PCB Design ChallengesFrom Zion Research I learned that the flexible electronics market was about $13.2B in 2021 and growing at a CAGR of 21%, so that was impressive. There are several factors that make rigid-flex circuit so attractive, like: space efficiency, reduced weight, enhanced reliability, improved signal integrity, streamlined assembly,… Read More The post Rigid-flex PCB Design Challenges appeared first on SemiWiki.
May 7
- Accelerate SoC Design: DYI, FPGA Boards & Commercial Prototyping Solutions (I)In the early days, chip designers had to rely on time-consuming simulation results or wait for the engineering sample to validate whether the design meets its intended objectives. With the increasing complexity of SoC designs, the need to accelerate software development has also risen to ensure a timely entry to market. In the… Read More The post Accelerate SoC Design: DYI, FPGA Boards & Commercial Prototyping Solutions (I) appeared first on SemiWiki.
- The latest ideas on time-sensitive networking for aerospaceTime-sensitive networking for aerospace and defense applications is receiving new attention as a new crop of standards and profiles approaches formal release, anticipated before the end of 2024. CAST, partnering with Fraunhofer IPMS, has developed a suite of configurable IP for time-sensitive networking (TSN) applications,… Read More The post The latest ideas on time-sensitive networking for aerospace appeared first on SemiWiki.
May 6
- Analog Bits Continues to Dominate Mixed Signal IP at the TSMC Technology SymposiumThe recent TSMC Technology Symposium in the Bay Area showcased the company’s leadership in areas such as solution platforms, advanced and specialty technologies, 3D enablement and manufacturing excellence. As always, the TSMC ecosystem was an important part of the story as well and that topic is the subject of this post. Analog… Read More The post Analog Bits Continues to Dominate Mixed Signal IP at the TSMC Technology Symposium appeared first on SemiWiki.
May 5
- Why NA is Not Relevant to Resolution in EUV LithographyThe latest significant development in EUV lithography technology is the arrival of High-NA systems. Theoretically, by increasing the numerical aperture, or NA, from 0.33 to 0.55, the absolute minimum half-pitch is reduced by 40%, from 10 nm to 6 nm. However, for EUV systems, we need to recognize that the EUV light (consisting … Read More The post Why NA is Not Relevant to Resolution in EUV Lithography appeared first on SemiWiki.
May 3
- Self-heating and trapping enhancements in GaN HEMT modelsHigh-fidelity models incorporating real-world, cross-domain effects are essential for accurate RF system simulation. The surging popularity of gallium nitride (GaN) technology in 5G base stations, satellite communication, defense systems, and other applications raises the bar for transistor modeling. Keysight dives… Read More The post Self-heating and trapping enhancements in GaN HEMT models appeared first on SemiWiki.