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June 19
- Weebit Nano at the 2024 Design Automation Conference1. The article discusses the limitations of current memory technologies, particularly flash, in supporting the rapid growth of AI applications. 2. It introduces ReRAM as a promising alternative, offering benefits such as lower power consumption, higher density, and suitability for embedding in AI SoCs. 3. The article highlights a session at the 2024 Design Automation Conference where Gideon Intrater from Weebit Nano will present on the potential of ReRAM in enabling low-power AI architectures.
- OPENEDGES Technology at the 2024 Design Automation Conference1. OPENEDGES Technology is set to showcase the 2.0 release of PHY Vision at the 2024 Design Automation Conference. 2. The event will feature a live demonstration of the enhanced LPDDR PHY visualization software at the Moscone Center West, San Francisco. 3. Attendees can explore the advanced features of OPENEDGES' LPDDR PHY IP, including advanced protocol availability, cross-verification with OMC, and optimized low power states.
- Perforce at the 2024 Design Automation Conference1. Perforce will showcase its latest enhancements and semiconductor solutions at the 2024 Design Automation Conference, booth #1421. 2. Attendees can participate in activities like playing PLINKO and have a chance to win prizes. 3. Perforce VP, Vishal Moondhra, will present on 'The Transformation Model for IP-Centric Design', discussing improved IP reuse and collaboration at enterprise scale.
June 18
- PrimisAI at the 2024 Design Automation Conference1. PrimisAI, known for its advanced hardware design automation, is participating in DAC 2024, showcasing its AI-driven EDA tool, RapidGPT. 2. RapidGPT is a generative AI tool designed for FPGA engineers, offering natural language interfaces and intelligent code assistance. 3. The tool features conversational capabilities, contextual suggestions, and code optimization, aiming to enhance productivity and accelerate time-to-market.
- Silicon Creations at the 2024 Design Automation Conference1. Silicon Creations, a leading silicon IP provider, is participating in the 2024 Design Automation Conference. 2. The company is celebrating surpassing 10 million wafers in production with TSMC. 3. They will highlight their portfolio of PLLs and clocking IP at DAC, with presentations at Intel Foundry and Siemens booths.
- EasyLogic at the 2024 Design Automation Conference1. EasyLogic will showcase its GTECH-based ECO optimization methodology at the 2024 Design Automation Conference. 2. The company aims to simplify the ECO flow and reduce user effort by minimizing ECO patch logics. 3. EasyLogic's innovation includes a GTECH reader and a built-in equivalence checking engine, designed to eliminate false discrepancies and enhance ECO patch optimizations.
- S2C Prototyping Solutions at the 2024 Design Automation Conference1. The 2024 Design Automation Conference (DAC) in San Francisco is set to showcase S2C's comprehensive prototyping solution at booth #1427. 2. S2C's latest prototyping logic system features a 100M ASIC Gate Capacity and enhanced I/O bandwidth, supporting up to 128 FPGAs with Player Pro-CompileTime software. 3. The solution stands out with abundant peripherals, extensive industry experience, and unmatched scalability, making it a must-see at DAC 2024.
June 17
- Keysight EDA at the 2024 Design Automation Conference1. Keysight EDA will have the largest booth at the 2024 Design Automation Conference (DAC), showcasing their Engineering Lifecycle Management (ELM), RF/uW Design and Simulation, and HPC and Workflow Automation solutions. 2. Niels Faché, VP & GM, Keysight EDA, will speak on bridging gaps in engineering software and new EDA methodologies. 3. Keysight EDA tools focus on open and interoperable design, high-frequency and high-speed capabilities, and AI-ready platforms.
- Analog Bits at the 2024 Design Automation Conference1. Analog Bits will showcase its latest low-power mixed-signal IP solutions at the 2024 Design Automation Conference (DAC). 2. The company will demonstrate new IP's in TSMC's advanced nodes, focusing on power management and energy efficiency for AI and ML chips. 3. Analog Bits will also present its automotive IP portfolio and innovative solutions like the Pinless Technology and Wide Range PLL.
June 14
- Silicon Catalyst Announces Winners of the 2024 Arm Startups Contest1. Silicon Catalyst announced the winners of the 2024 Arm Startups Contest, with Agate Sensors from Finland winning first place and Smartkosh Technologies from India as the runner-up. 2. The contest offered significant commercial and technical support, including Arm technology credits and access to Arm's design portfolio. 3. Both winners will receive additional support such as design reviews, investor pitch preparation, and opportunities to present to Silicon Catalyst Angels.
June 13
- INTERVIEW: Bluespec RISC-V soft cores in Achronix FPGAs1. Achronix与Bluespec合作，将RISC-V处理器作为软核集成到Speedster7t FPGA中。2. 双方讨论了合作的动机，包括利用Achronix的2D NoC技术进行紧密的CPU加速。3. Bluespec的RISC-V核心支持定制指令，适用于管理加速器和I/O，与Achronix的FPGA技术形成互补。
- Reduce Risk, Ensure Compliance: Hardware-Assisted Verification for Design Certification1. The article emphasizes the importance of hardware-assisted verification (HAV) in ensuring compliance and reducing risks in design certification, especially for complex systems like 6G phone designs prototyped on FPGAs. 2. It highlights the challenges faced during real-world compliance testing, such as unpredictable device interactions, and the need for rigorous testing under actual conditions. 3. The article also discusses the benefits and limitations of using hardware emulation versus FPGA prototyping in the verification process, stressing the criticality of compliance testing in different market segments.
June 12
- Automotive Autonomy’s Quiet Advance Through Radar1. Despite setbacks in autonomous vehicle development, technologies like adaptive cruise control and collision avoidance continue to advance. 2. Radar technology, particularly high-definition imaging radar (HD radar), is gaining prominence due to its all-weather operation and cost-effectiveness. 3. The radar imaging pipeline involves complex processing to detect and classify objects accurately, crucial for automotive safety.
June 11
- WEBINAR: Redefining Security – The challenges of implementing Post-Quantum Cryptography (PQC)1. The webinar discusses the historical context of cryptographic algorithms like McEliece and RSA, highlighting the shift towards Post-Quantum Cryptography (PQC) due to quantum computing threats. 2. It emphasizes the importance of PQC in maintaining long-term security against quantum adversaries. 3. Secure-IC, with its expertise in PQC, will explore the challenges of PQC implementation, including performance, security, and certification, in an upcoming webinar.
- How IROC Makes the World a Safer Place with Unique Soft Error Analysis1. The article discusses the increasing relevance of soft errors in semiconductor devices due to advanced processes and reliability-critical applications. 2. It highlights how IROC, with its tool TFIT, helps in analyzing and mitigating soft errors in various circuits, making them safer for use in critical applications like autonomous vehicles and medical devices. 3. The TFIT tool simplifies the process of soft error analysis, making it accessible to design teams and enhancing the safety and reliability of semiconductor devices.
- Driving Data Frontiers: High-Performance PCIe® and CXL® in Modern Infrastructures1. The article discusses the importance of PCIe and CXL technologies in modern computing infrastructures, highlighting their role in supporting high data transfer rates essential for AI/ML training and big data analytics. 2. It covers the recent webinar sponsored by Alphawave Semi, focusing on the challenges and advancements in optical interfaces and the need for collaborative innovation. 3. The article also explores the benefits of Linear Pluggable Optics (LPO) and energy-efficient accelerator cards in enhancing data center performance and scalability.
June 10
- TSMC Advanced Packaging Overcomes the Complexities of Multi-Die Design1. TSMC's Technology Symposium highlights the company's advanced technology and its ecosystem, focusing on advanced packaging solutions. 2. Advanced packaging has evolved from a simple finishing step to a critical part of the design process, driven by the need for heterogeneous integration of multiple dies. 3. TSMC's 3DFabric™ Technology Portfolio includes CoWoS®, InFO, and TSMC-SoIC®, which support multi-chip packaging and 3D IC stacking, enhancing system performance and functionality.
June 9
- Blank wafer suppliers are not totally blank1. The article discusses the critical role of blank wafer suppliers in the semiconductor industry, highlighting their transformation of silicon sand into high-purity monocrystalline silicon wafers. 2. It explains the importance of silicon in the semiconductor industry, noting its semiconductor properties and the stringent purity requirements for electronic-grade silicon. 3. The article also addresses the current market dynamics, including the impact of the AI revolution on silicon demand and the challenges faced by GPU manufacturers in increasing performance within the reticle limit.
June 7
- 3DIC Verification Methodologies for Advanced Semiconductor ICs1、3DIC技术具有许多挑战，如设计流和数据管理的挑战、物理验证和可靠性分析。 2、天水صن세요 3DBlox开放标准促进行业合作和互操作性。 3、Siemens EDA工具.like XSI和Calibre 3DSTACK可以实现3DIC设计的验证和分析。
June 6
- Mastering Copper TSV Fill Part 3 of 31、TSV填充通过六个阶段进行：湿润、极化、成核、充填、加速器排放和bulk层镀层。 2、充填过程中，抑制剂和加速器之间的delicate interaction决定了填充结果。 3、在充填过程中，电流密度和加速器的浓度非常重要。 4、通过优化充填条件，可以实现无void的TSV填充。 5、Bulk层镀层是TSV填充的最后一步。
- What to Do with All that Data – AI-driven Analysis Can Help1、当前芯片设计面临许多复杂性，生成大量数据，AI 可以帮助分析、理解和采取行动。 2、Synopsys.ai 数据分析网络广播系列将深入探讨如何使用 AI 解锁、连接和分析海量数据，以提高生产效率和质量。 3、该系列将分为三个部分：AI 驱动的硅器件分析、AI 驱动的设计分析和 AI 驱动的制造/工厂分析。
June 5
- What’s all the Noise in the AI Basement?1、Nvidia是AI_processing_market的領導者，擁有高度的邊際利潤。 2、AI革命正在改變半導體供應鏈，新玩家出現，競爭加劇。 3、TSMC是半導體製造的龍頭，Nvidia和Apple是TSMC的主要客戶。
- Arm Client 2024 Growing into AI Phones and AI PCs1、Arm Client 2024今年的重点是在AI手机和AI PC领域增长，扩展了mobile gaming的增长战略。 2、Arm声称70%的Android第三方ML工作负载运行在Arm CPU上，不需要专用AI加速器。 3、Arm Client LOB推出了新的软件库Kleidi CV和Kleidi AI，旨在提高应用程序性能。
- Is it time for PCB auto-routing yet?1、手动布线需要经验丰富的设计师，并且容易出错。 2、自动化布线工具可以快速连接组件，节省设计师的时间和精力。 3、sketch 路由功能可以自动完成布线任务，提高设计质量和完成率。
June 4
- Silicon Creations is Enabling the Chiplet Revolution1、硅创造公司正在推动芯片revolution，通过提供完整的IP解决方案来满足die-to-die接口的挑战。 2、UCIe标准将开放multi-protocol on-package die-to-die interconnect， Silicon Creations开发了专门的die-to-die环形PLL以解决时钟设计挑战。 3、该解决方案能够满足低功耗、小型化、低抖动和宽 调整范围的设计要求。
June 3
- The Case for U.S. CHIPS Act 21、美国CHIPS法案为leading-edge半导体制造行业提供了28亿美元的资金支持，但要达到20%的目标需要解决两个主要挑战：定义leading-edge的含糊不清和国外竞争的增长。 2、根据Moore定律，leading-edge技术不断更新，定义leading-edge的标准也在变化。 3、美国需要超越亚洲和欧洲国家在半导体制造领域的发展，并确保资金支持的有序安排，实现其在全球半导体产业的领导地位。
- Follow the Leader – Synopsys Provides Broad Support for Processor Ecosystems1、Synopsys扩展了ARC处理器产品系列，包括RISC-V处理器系列。 2、Synopsys为处理器生态系统提供holistic支持，包括实现、验证、软件开发、DevOps等。 3、Synopsys与Arm和RISC-V核心提供商等合作，提供了广泛的解决方案。
May 31
- CEO Interview: Dr. Nikos Zervas of CAST1、CAST公司提供IP核心，帮助电子系统开发者节省时间和金钱。 2、CAST公司的产品线包括处理器、压缩、接口、外围设备和安全等领域。 3、公司的目标是提供更好的IP体验，包括高质量的产品、简洁的使用、市场领先的技术支持和灵活的许可模式。 4、CAST公司解决了SoC开发者的问题，使他们可以更快地完成系统设计。 5、公司的产品应用于汽车、工业自动化、数据中心、可穿戴设备和航空航天等领域。
- How does your EDA supplier ensure software quality?1、AnaCov 是 Siemens EDA 的专有软件代码覆盖率解决方案，用于提高代码质量。 2、AnaCov 通过映射测试用例到函数和源文件，提供了高效的代码覆盖率分析方法。 3、AnaCov 的核心特点包括资源优化、用户友好界面、高级代码映射、版本化覆盖跟踪等。
- Arteris is Solving SoC Integration Challenges1、SoC 集成挑战日益增加，Arteris 提供了一个holistic 解决方案。 2、Arteris 的解决方案包括 hardware 连接、设计 assembly 和寄存器管理等。 3、该解决方案基于 IP-XACT 标准，可以提供单一的信息来源，确保设计的一致性和准确性。