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June 2
- Anglia signs Alliance for legacy memory
➀ Anglia Components partners with Alliance Memory to supply legacy and new memory products, including SRAM, DRAM, and Flash;
➁ The products serve as drop-in replacements for devices from major brands like Micron and Samsung, targeting industries such as IoT, communications, and industrial markets;
➂ The collaboration emphasizes competitive pricing, secure inventory, and addressing End-of-Life (EOL) challenges for customers.
- AccelerComm raises $15m
➀ AccelerComm secured $15 million in funding to advance its 5G satellite communication technology for Direct-to-Device (D2D) connectivity between phones and satellites;
➁ The investment round was led by IP Group, with participation from IQ Capital, Swisscom Ventures, and Bloc Ventures, aiming to accelerate product deployments;
➂ Collaborating with Lockheed Martin, the company's technology will power the first regenerative 5G NTN payload in orbit, endorsed by the UK Space Agency for expanding global mobile coverage.
- Intel and Softbank explore alternative to HBM
➀ Intel and SoftBank jointly established Saimemory to develop a stacked DRAM technology as an alternative to HBM, aiming to reduce power consumption by half;
➁ A prototype is expected within two years, with production targeted by the end of the decade, supported by $70 million in total investment, including $21 million from SoftBank;
➂ The technology originated from Intel, Japanese academia, and partners like Riken and Shinko Electric, with potential government funding and priority supply for SoftBank's AI processors (e.g., Arm and Graphcore).
- TSMC talking about building fabs in the UAE
➀ TSMC is exploring plans to build six advanced fabs in the UAE, potentially costing over $200 billion, amid U.S. security concerns over technology leaks to China;
➁ The U.S. and UAE negotiated agreements to align cybersecurity protocols, including safeguards for U.S.-origin tech, as part of a deal for a large AI datacenter in Abu Dhabi using 500,000 Nvidia chips;
➂ Political tensions persist, with U.S. officials wary of the UAE fab project’s sensitivity compared to TSMC’s $165 billion Arizona fabs.
- Scepticism for EU startup plan
➀ The EU's 'Startup and Scaleup Strategy' aims to boost Europe's startup ecosystem through reduced bureaucracy, a €10 billion fund, and cross-border support, but faces skepticism;
➁ Critics argue over-regulation of AI and tech, fragmented policies, funding limitations, and rigid startup definitions hinder innovation, prompting concerns about talent and investment leaving Europe;
➂ Europe's emphasis on tech regulation clashes with innovation needs, potentially forcing a critical choice between regulatory control and fostering technological advancement.
- 2025 PC market forecast to grow 4.1% y-o-y
➀ IDC forecasts a 4.1% year-over-year growth for the PC market in 2025, with volumes reaching 274 million units;
➁ A slight contraction is expected in 2026 due to Windows 11 migration stabilization and tougher comparisons against 2025's strong performance;
➂ SMB-driven upgrades are identified as a key growth driver in the second half of 2025.
- Ed Makes A Play For The AI Datacentre Market
➀ UK Minister Ed initiates a strategy to position the country in the AI datacentre market by fostering photonics-based interconnection startups through collaborations with universities and industry players;
➀ Plans global networking trips to tech hubs (e.g., Las Vegas, Singapore) funded by the UK government, accompanied by startup executives, to attract investors and partners, despite criticism over the lavish itinerary;
➁ Develops a comprehensive promotional campaign involving white papers, social media engagement, and CEO mentorship to transform startups into thought leaders, while positioning himself to profit personally from the AI datacentre boom.
- UKESF takes first STEP for Semiconductor: Skills, Talent and Education Programme
➀ UKESF launches £4.75 million Semiconductor STEP program, funded by the UK政府, to address critical skills shortages in the semiconductor sector through targeted education and training initiatives;
➁ The program includes four projects: Semiconductor Skills in Schools, Semiconductor Talent Award, Semiconductor Skills Development Course, and Semiconductor Skills for Physics Graduates, focusing on K-12 outreach, university scholarships, design training, and post-graduate upskilling;
➂ Aligned with the UK’s 2023 Semiconductor Strategy, the one-year initiative aims to build a sustainable talent pipeline, with potential for extended funding amid ongoing government reviews.
May 30
- Linear RF amplifier covers 3.3 – 4.2GHz
➀ Mouser Electronics now stocks Qorvo's QPA9822 linear RF amplifier, designed for 5G mMIMO systems in the 3.3-4.2GHz N77 band with 530MHz bandwidth;
➁ The device offers 38dB gain, 29dBm P3dB output power, operates at 5V, and uses a compact 3x3mm surface-mount package with integrated 50Ω matching;
➂ Despite being announced over a year ago, Qorvo has not released the full datasheet, while DigiKey recently expanded its partnership with Qorvo for RF component distribution.
- CHIIPS podcast features insights from Katalytik’s Jan Peters
➀ The latest CHIIPS podcast features Jan Peters from Katalytik discussing the importance of communication and teamwork in engineering;
➁ She shares insights on turning engineering concepts into reality and strategies to avoid manufacturing challenges;
➂ Peters, a STEM advocate and recipient of the 2024 Elektra Educational Support Award, highlights her role in fostering industry connections and supporting technical education.
- Tiny inductor-inclusive nano-power dc-dc IC
➀ Torex Semiconductor developed the XCL108, a nano-power boost DC-DC converter with an integrated inductor, requiring only 400nA quiescent current and operating from inputs as low as 650mV;
➁ It features fixed output voltages (3V to 5.5V) and high efficiency (up to 90.6%), using PWM-PFM control for optimal performance across load conditions;
➂ The ultra-compact 2.5x2x1mm package integrates critical components, enabling a total footprint of 7.7x3.1mm with external capacitors, ideal for space-constrained applications.
- Modular SiC inverter modules accompanied by reference designs
➀ Cissoid and Rhopoint Components collaborate to provide modular SiC-based intelligent power modules and inverter control platforms with reference designs for customization;
➁ Target applications include electric vehicles (cars, buses, trucks) and heavy-duty industrial equipment, aviation, and marine systems;
➂ The 1200V SiC MOSFET modules support up to 340A continuous current, operate at -40°C to 175°C, and offer open-source customization to accelerate development timelines.
- Most Read – 800Vdc data centres, CHERI-secured MCU, Foxconn bid
➀ Foxconn is reportedly bidding for Singapore-based UTAC to expand chip packaging capabilities, with a potential $3 billion deal;
➁ UK startup SCI Semiconductor raised £2.5M to develop CHERI-based secure microcontrollers, planning to expand its team in Sheffield;
➂ Nvidia partnered with Texas Instruments for 800Vdc data centers to enhance AI processor power efficiency, while Renesas abandoned SiC market plans due to Wolfspeed’s instability, and Dyson launched a slim vacuum cleaner with improved hair-cleaning features.
- Taoglas adds Thunder
➀ Taoglas launches Thunder Series, an outdoor antenna enclosure integrating industrial routers to reduce cabling and deployment costs;
➁ The solution supports 5G/4G, Wi-Fi, and Bluetooth across 600-6000MHz, leveraging co-located routers and antennas for minimized signal loss;
➂ IP67-rated directional/omnidirectional variants enable harsh-environment applications in smart cities, mining, and transportation systems.
- 2025 smartphone market to grow 0.6% y-o-y
➀ IDC forecasts 0.6% YoY growth in 2025 smartphone shipments to 1.24 billion units, citing market saturation and longer refresh cycles;
➁ China's 3% growth is driven by government subsidies benefiting Android, while Apple faces a 1.9% decline due to Huawei competition and subsidy ineligibility;
➂ The US market grows 1.9% despite trade war impacts, mitigated by carrier deals and premium device launches in late 2025.
- Q1 high end router market shows first growth since Q2 2023
➀ The Q1 2025 high-end router market achieved its first year-over-year growth since Q2 2023, rising 10% with strong performance across all segments, especially in service provider Core and Edge Routers;
➁ Huawei led the market with a 23% revenue surge, gaining 3% market share, while Juniper and Nokia grew 16% and 14% respectively, but Cisco declined despite growth in Core Router sales driven by its RON solutions;
➂ Market uncertainty remains due to potential U.S. government policies that could increase costs and hinder economic expansion.
May 29
- Fable: A Reffing Cock-Up With A Happy Ending
➀ A disputed goal in an 1889 football match between Everton and Accrington led to an engineer witnessing a referee's incorrect decision;
➁ The engineer, later a prominent civil engineer, invented a solution to prevent future disputes over goal decisions;
➂ The story emphasizes that short-term injustices can drive long-term innovations.
- i.MX 91 Cortex-A55 in 37 x 39mm system-on-module
➀ Myir launched a 37x39mm system-on-module (SoM) with NXP's i.MX 91 processor (1.4GHz Arm Cortex-A55 core), targeting applications like EV charging stations, smart homes, and industrial gateways;
➁ The module integrates 1GB LPDDR4 RAM, 8GB eMMC, and extensive interfaces (USB, Ethernet, CAN-FD, etc.), supporting Linux 6.6.36;
➂ A development board (MYD-LMX91) is available with M.2 slots, WiFi, and an optional 7-inch LCD for rapid prototyping.
- What caught your eye? (AI, EDA ban, Cheri MCU, Rosetta Stone payload)
➀ U.S. President Trump imposed a ban on the sale of EDA tools to China, impacting semiconductor industry relations;
➁ SCI Semiconductor secured £2.5 million funding for developing a secure microcontroller based on the 'Cheri' architecture, backed by Microsoft and Google, which enhances hardware security through metadata-bound memory pointers;
➂ iSpace EUROPE plans to deliver a UNESCO cultural heritage payload, the "Memory Disc V3," to the Moon via a lunar micro-rover, symbolizing a modern Rosetta Stone mission.
- Allegro adds Cortex-M4 to 90V motor driver ICs
➀ Allegro Microsystems launched standalone three-phase automotive brushless motor driver ICs with a 40MHz Arm Cortex-M4 core, supporting up to 90V rails and targeting external n-channel MOSFET control;
➁ The ICs feature 12-bit PWM, multiple ADCs, serial communication, and internal voltage regulation, available in 7x7mm QFN packages with variants for 60V/90V and different flash/I/O configurations;
➂ Debugging tools from Segger now support these ICs, and Allegro previously released non-MCU motor drivers and sensors in April 2025.
- DevBoard Watch: PocketBeagle 2 targets IoT, robotics, prototyping
➀ The PocketBeagle 2, a quad-core development board based on TI's AM6254 SoC, is introduced as an upgrade with 1.4GHz cores, a 3D GPU, and a Cortex-M4F processor;
➁ It targets applications in IoT, robotics, and prototyping;
➂ The board remains compact, following the PocketBeagle form factor for accessibility in embedded projects.
- SI forecasts 7% semi growth for 2025
➀ Q1 2025 semiconductor revenues reached $167.7 billion, up 18.8% YoY but down 2.8% QoQ, with mixed performance among major companies—NVIDIA rose 12% while STMicroelectronics and Kioxia saw >20% declines;
➁ Economic uncertainty and tariffs are dampening outlooks, though AI demand boosts NVIDIA and memory firms (e.g., SK Hynix expects 14.6% Q2 growth), while automotive and smartphone markets slow;
➂ Semiconductor Intelligence forecasts 7% 2025 growth, citing tariff risks potentially lowering TechInsights' projection from 14% to 2%, with weakness likely extending to 2026.
May 28
- 100mm single board computers get Intel Core 3
➀ Aaeon launched two compact single board computers (Up Squared TWL and Pro TWL) with Intel Twin Lake Core 3 N355/N250/N150 CPUs;
➀ The Up Squared TWL (85.6 x 90mm) supports LPDDR5 up to 16GB, 128GB eMMC, M.2 storage, and Wi-Fi; its Pro variant (101.6 x 101.6mm) adds SATA SSD, 5G/LTE, and MIPI camera interfaces;
➂ Both feature industrial-grade durability (-20 to 70°C operation), 2.5G Ethernet, multi-display outputs, and compatibility with Windows 11/Ubuntu/Yocto OS.
- 1.2kV 260A three-phase silicon carbide power module
➀ Rhopoint Components introduces the CMT-PLA3SB12340, a 1.2kV 260A three-phase SiC power module capable of delivering up to 340A at 25°C for electric vehicles;
➁ The module offers 5kV isolation, integrated gate driver power supplies, fault flags, and requires only 12V-18V input with PWM signals;
➂ Designed for automotive and industrial applications, it features compact dimensions (104 x 154 x 34mm), thermal management (0.183°C/W), and operates at -40°C to +175°C.
- Wide-range ac-dc converter works over 18-264Vac, or 18-375Vdc
➀ Recom launched a compact 15W AC-DC converter (RAC15-xxSK/WI series) with an ultra-wide input range of 18-264V AC or 18-375V DC, available in five output voltages (5V to 54V).
➁ The module achieves ~82% efficiency, delivers full 15W output above 48V AC, and operates reliably at up to 85°C ambient temperature under convection cooling, meeting reinforced isolation and Class B EMC standards.
➂ Designed for applications with variable input voltages or multi-region compatibility, it supports industrial and household uses per UL/IEC/EN 62368-1 and IEC 60335-1 certifications.
- A Daunting Prospect For Intel and Samsung
➀ TSMC’s advanced roadmap for the decade positions it as the dominant leader in leading-edge logic manufacturing, creating pressure on Intel and Samsung;
➁ Intel and Samsung’s high-risk bets on GAA, BSPD, and high-NA EUV technologies failed to surpass TSMC, leaving the latter as the sole trusted choice for cutting-edge foundry services;
➂ TSMC’s execution excellence has led to a de facto monopoly, raising industry concerns about reduced competition despite its reputation for fairness and responsibility.
- EnSilica opens Cambridge hub, adds engineers
➀ EnSilica, a mixed-signal ASIC specialist, established a new engineering hub in Cambridge and recruited six engineers (including four PhD holders), expanding its global workforce to 190;
➁ The expansion strengthens its mmWave/RF IC design capabilities to meet rising customer demand in satellite and communications markets;
➂ Supported by UK Space Agency funding and contract wins, the move aims to attract talent and capitalize on growth opportunities.
- Reuters: Solar inverters with undocumented cellular interfaces
➀ Solar inverters and energy storage batteries contain undocumented cellular communication interfaces, potentially enabling covert remote access;
➀ Reuters reports unidentified manufacturers, with concerns these interfaces could bypass security firewalls in critical power infrastructure;
➂ The discovery highlights cybersecurity risks but lacks specifics on exploit incidents or responsible parties.
- TSMC dazzles in Amsterdam
➀ TSMC showcased its advanced semiconductor technologies at the 2025 Europe Symposium, highlighting N3 nodes' high-volume production with variants for CPUs, cost-effective products, and automotive applications;
➁ Unveiled next-gen N2 and A16/A14 processes with performance/efficiency improvements, and introduced CFET transistor designs achieving double density;
➂ Demonstrated 3D Fabric innovations (SoIC/CoWoS), wafer-scale AI systems (SoW-X), and specialized automotive/IoT solutions including RRAM/MRAM and N4C RF for emerging wireless standards.
- TSMC to open European Design Centre (EUDC) in Q3
➀ TSMC will establish its European Design Centre (EUDC) in Munich in Q3 2025 to support European customers in designing high-performance, energy-efficient chips for automotive, AI, IoT, and industrial applications;
➁ The center aims to drive process technology development, foster expertise in automotive and non-volatile memory (e.g., RRAM/MRAM), and collaborate with global design teams;
➂ The EUDC will join TSMC's global network, enhancing chip design innovation and strengthening industry partnerships across key sectors.