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May 28
- EV bloodbath looms in China
➀ BYD slashed prices of its Seagull and Seal 07 DM-i models by 34% and $7,400 respectively, sparking a fierce price war in China's automotive sector;
➁ Rivals like Geely and Great Wall Motor retaliated with price cuts, potentially forcing over 100 smaller competitors out of the market;
➂ BYD's aggressive domestic pricing strategy, coupled with plans to expand overseas sales to 800,000 units, could disrupt global markets despite EU tariffs on Chinese EVs.
- ESA, CTO plan space-based 5G mmWave connectivity tests
➀ The European Space Agency (ESA) and Constellation Technologies & Operations (CTO) are collaborating on testing 5G mmWave connectivity in low Earth orbit using a pathfinder satellite set for launch in June 2025;
➁ The experiments aim to validate interoperability between space and terrestrial networks, enabling cost-effective hybrid connectivity solutions;
➂ The initiative aligns with ESA's strategy to strengthen European sovereignty in space technology and advance 3GPP-compliant Non-Terrestrial Networks (NTN).
- Top Ten (less 5) AR/VR Headset Vendors
➀ The article highlights the market shares of the top five AR/VR headset vendors in 2025, according to IDC data;
➀ Meta dominates the market with an overwhelming 74.6% share, followed by Apple (5.2%), Sony (4.3%), ByteDance (4.1%), and XREAL (3.3%);
➂ The piece also lists recommended articles on supply chain trends, engineer wealth, and unconventional tech ideas.
May 27
- Nvidia 800Vdc data centre
➀ NVIDIA collaborates with Texas Instruments, Infineon, STMicroelectronics, and others to advance 800Vdc power architecture for AI data centers;
➁ 800Vdc distribution aims to improve power density by 85% and efficiency via dc-dc conversion, supporting future 1MW AI server racks;
➂ The project involves power component leaders like Delta, Schneider Electric, and Navitas to optimize energy infrastructure.
- Dyson launches Pencilback Fluffycones
➀ Dyson launched the Pencilback Fluffycones, the industry's slimmest cordless vacuum cleaner, featuring a 38mm diameter and 1.8kg weight;
➁ It includes a 360-degree rotating brush to prevent hair tangling, edge-cleaning design, and green LED illumination for dust detection;
➂ Powered by a 28mm Hyperdimium motor spinning at 140,000 RPM, offering powerful suction and compact performance.
- Foxconn said to be bidding for Singapore’s UTAC to expand OSAT capability
➀ Foxconn is reportedly bidding to acquire Singapore-based semiconductor test and assembly company UTAC, owned by China's Wise Road Capital, for up to $3 billion;
➁ UTAC operates facilities in Singapore, China, Indonesia, and Thailand, with annual EBITDA estimated at $300 million;
➂ Foxconn is expanding globally, including a $433 million India JV with HCL Technologies and discussions for a €250 million packaging plant in France with Radiall and Thales.
- Boxing Robots
➀ Unitree Robotics showcased its humanoid G1 robots at the China Media Group World Robot Competition in Hangzhou, where they engaged in boxing matches;
➁ The G1 model stands 4'3", weighs 35kg, offers a 2-hour battery life, and costs over $16k;
➂ Founded in 2016 by Wang Xingxing, Unitree also produces affordable robotic dogs like the XDog, priced at $1,600.
- MOV Adopts Solid State Device Strategy
➀ MO Valve Company shifts focus to industrial solid-state devices up to 6000 Mc/s, prioritizing communication bandwidth over high-power applications;
➁ An export division is established, with microwave equipment attracting attention in Paris, aiming for a 40% export share including indirect quotas;
➂ The company abandons domestic market products (e.g., color TVs) and concentrates on industrial valves, thyratrons, and cathode ray tubes, affirming valves' continued relevance.
- £2.5m towards UK’s CHERI-secured MCU
➀ UK start-up SCI Semiconductor raised £2.5 million to develop a CHERI-based secure microcontroller aimed at preventing memory-related cyber attacks;
➁ The funding, supported by NPIF II and angel investors, will expand its engineering team in Sheffield and advance its 32-bit RISC-V core with hardware-enforced memory safety;
➂ The first CHERI-enabled IC is set for release in 2025, with Google Research as an early customer, promising compliance with stringent cybersecurity regulations.
May 26
- EV Foreign Market Penetration
➀ Most EVs in China, North America, the EU, and APAC are produced domestically, though North America and the EU see increasing foreign competition;
➁ Tesla and Ford expanded EU-based EV production in 2024, while some European companies faced stagnant domestic output;
➂ U.S. EV production declined by 7%, offset by growth in Mexico (U.S.-led), while China exports EVs and others rely on imports.
- Glass microfibres in textiles use acoustic waves to measure touch, pressure and movement
➀ ETH Zurich researchers developed smart textiles (SonoTextiles) using glass microfibers to conduct acoustic waves instead of electronics for touch and motion sensing;
➁ Changes in acoustic wave frequencies (around 100 kHz) indicate movement, pressure, or touch, enabling low-computing-power data processing;
➂ Woven glass fibers with transmitters and receivers detect disruptions caused by body movements or breathing, expanding wearable tech applications.
- Q1 NEV sales up 39% y-oy
➀ Q1 2025 global NEV sales surged 39% YoY to 4.02 million units, with BEVs growing 45% (2.67 million units) and PHEVs up 28% (1.35 million units).
➁ BYD led BEV sales with 15.4% market share, surpassing Tesla (12.6%), while Xiaomi debuted at 8th place. Geely saw a 443% YoY spike in BEV sales, and Volkswagen rose 41% among non-Chinese brands.
➂ Despite growth, some Chinese brands like AITO and Lynk & Co faced declines. TrendForce forecasts 2025 NEV sales to reach 19.47 million units, up 19.6% YoY.
- Q1 Mobile Core Market Up 32% YoY
➀ Q1 2025 Mobile Core Network (MCN) market surged 32% YoY, led by China's 122% growth and 12% growth in non-China regions.
➀ Growth drivers include 5G Standalone (SA) network expansion, replacement of VNFs with CNFs, and subscriber migration from 4G to 5G, with ZTE benefiting from major projects in China.
➂ Dell’Oro forecasts 5G MCN market growth of 15% YoY in 2025, with Huawei, ZTE, Ericsson, and Nokia leading vendor rankings globally and regionally.
- LG demos IoT-NTN vehicle bringing emergency calls to streets of Paris
➀ LG demonstrated its IoT-NTN technology in Paris, featuring AI-powered voice compression for seamless switching between terrestrial and satellite networks.
➁ The system enables real-time emergency voice calls via a single button, enhancing safety and connectivity in remote or disaster-affected areas.
➂ IoT-NTN supports applications like autonomous driving and integrates with 5GAA's C-V2X initiatives, with satellite D2D convergence under 3GPP standards.
- Ed Goes For Reconfigurables
➀ Ed proposes a £20 million UK government prize for developing reconfigurable AI chip prototypes to address AI progress bottlenecks;
➁ The UK leverages Arm’s low-power design expertise, university photonics, packaging technologies, and phase-change materials research;
➂ HMG plans funding for a collaborative research hub, imec access, and manufacturing partnerships, with Ed positioning himself in profit-generating oversight roles.
May 23
- Most Read – GaN micro-LEDs, Rivian contract, Nvidia’s Blackwell Ultra
➀ Nvidia announced the Grace Blackwell Ultra AI chip (GB300) shipping in Q3 and a 4x performance boost in its RTX Pro Server for AI models;
➁ Nvidia and Infineon collaborated on centralized 800V HVDC power architecture for AI data centers to optimize space and efficiency;
➂ Wolfspeed faces bankruptcy due to $6.5B debt and loss of key clients like Tesla and Volkswagen, reducing its SiC market share from 32% to 19%.
- Imec and MIT join forces for non-invasive diagnostic devices
➀ Imec and MIT collaborate on nanoelectronics-based solutions for minimally invasive diagnostic devices to advance personalized medicine;
➁ The partnership combines MIT's expertise in healthcare microsystems and imec's semiconductor technology leadership, aiming to develop clinical and home-use monitoring devices;
➂ AI-integrated data from these devices will generate digital biological profiles to empower disease diagnosis, therapy, and prevention.
- Wolverhampton University satellites to tackle UK water leakage
➀ Wolverhampton University leads the 'Space Eye' project, funded by £1.3m from Ofwat, to deploy six LEO microsatellites for detecting water leaks in the UK;
➁ The project utilizes satellite technology (SAR, L-band radar) and machine learning to improve detection efficiency and reduce costs compared to traditional methods;
➂ Collaboration with Quub involves 3D-printed satellites and Raspberry Pi for testing, aiming for scalable and cost-effective water infrastructure monitoring.
- Infineon shipping MCU for HMI
➀ Infineon launches PSOC 4100T Plus, an Arm Cortex-M0+ MCU integrating Multi-Sense technology for HMI applications, with 128K Flash and 32K SRAM;
➁ The MCU supports capacitive/inductive sensing, ML-based liquid level detection, and hover touch, enabling versatile roles as a standalone controller or an HMI interface chip;
➂ Targets user-friendly interfaces for industrial and consumer systems through advanced sensing and system control capabilities.
- US and EU buy less from China
❶ The US and EU are reducing imports from China, according to the Council on Foreign Relations;
❷ Vietnam, Malaysia, and Thailand are increasing exports but must import more from the US to mitigate reciprocal tariff impacts;
❸ Japan, with stronger negotiating power, is delaying trade negotiations and unlikely to reach a deal before July.
May 22
- Fable: Watch Out For Weird Stuff
➀ In 1938, a Dupont scientist researching refrigerants accidentally discovered a heat-resistant, chemically inert white powder when a gas was stored at dry ice temperatures;
➁ This material, now known as Teflon, is widely used in kitchens due to its unique properties;
➂ The story emphasizes the importance of investigating unexpected results, as they can lead to groundbreaking discoveries.
- Flurry of IoT wireless MCUs from Silicon Labs
➀ Silicon Labs launches 22nm wireless MCUs for IoT nodes, supporting Zigbee, Bluetooth, Matter-over-Thread, and multi-protocol operation for smart home and lighting applications;
➁ Two product lines: SixG301 (mains-powered) with up to 4MB flash/512KB RAM and security engines, and SixG302 (battery-powered) with 15µA/MHz active current for sensors;
➂ First samples (SiBG301 with Bluetooth) available now, battery-powered variants scheduled for 2026, emphasizing future-proof IoT design and Matter/Bluetooth compatibility.
- What caught your eye? (Excellion, AI ICs, Power op-amp, Nuclear batteries)
➀ Siemens Digital acquires Excellicon to strengthen EDA automation with timing and verification tools;
➁ IMEC proposes reconfigurable AI ICs for future applications;
➂ Analog Devices launches the ADHV4710 power op-amp with ±52V/100mA output and digital interface capabilities, while Zeno Power secures $50M for nuclear battery development in extreme environments.
- Intelsat completes vehicle satellite connectivity test
➀ Intelsat and Cubic³ successfully tested satellite-terrestrial network integration to deliver global always-on connectivity for vehicles, crucial for telematics and future autonomous driving;
➁ The trial combined Intelsat's FlexMove Fleet with Cubic³'s cloud platform, initially using GEO satellites for fleet management and later evolving to LEO constellations for high-bandwidth applications like HD mapping;
➂ Both companies emphasized software-defined vehicles as a priority, enabling manufacturers to meet connected mobility demands through seamless, global network coverage.
- Smaller industrial PC board for 14th gen Intel Core CPU
➀ Aaeon introduces the EPIC-RPS7, a compact 115x165mm industrial PC board supporting 14th gen Intel Core CPUs (up to 65W) and DDR5 memory for space-constrained smart manufacturing applications;
➁ The board features dual Ethernet ports (2.5Gbps and 1Gbps), USB 3.2/2.0, RS-232/422/485 interfaces, and supports up to three displays via DP, VGA, and LVDS;
➂ Designed for 0-60°C operation, it includes M.2 slots for NVMe storage and Wi-Fi modules, with power input options of 12V/22A or 19-24V.
- Gadget Book: Our Robotics Future
➀ Introduces the book 'Our Robotics Future' exploring automation, robotics and AI's transformative impact;
➁ Examines implications for businesses, workers and consumers in an automated world;
➂ Positioned as a guide to understand technological shifts driven by emerging technologies
- Sponsored Content: Storage Meets AI – Longsys’ Comprehensive Innovation Journey at COMPUTEX 2025
➀ Longsys showcased cutting-edge storage solutions at COMPUTEX 2025, targeting AI PCs and servers with products like the 8TB QLC PCIe SSD and industrial-grade BGA SSD;
➁ The company introduced its full-stack AI storage ecosystem, including QLC eMMC for edge AI and enterprise solutions like MRDIMM and Gen4 eSSD to address AI cluster bottlenecks;
➂ Longsys emphasized its PTM business model, offering end-to-end storage foundry services with firmware customization, rigorous testing, and dedicated production lines for diverse industrial applications.
- Siemens Digital buys Excellicon
➀ Siemens Digital Industries Software announces acquisition of Excellicon, a specialist in timing constraints software for chip design;
➁ The deal aims to enhance power, performance, and area (PPA) optimization in Siemens' EDA tools, accelerate design closure, and improve workflow efficiency;
➂ Excellicon's timing constraint management technology will integrate with Siemens' Questa, Tessent, and other platforms to strengthen verification and implementation processes.
May 21
- Intel looking to sell Networking and Edge Group
➀ Intel is exploring the sale or partnership of its Network and Edge Group (NEX) to refocus on PC and datacenter strategies, following previous divestments like Altera and Fab 34;
➁ NEX revenue fell to $5.8B in 2023 (from $8.4B in 2022) amid strong Broadcom competition, signaling a shift away from non-core businesses;
➂ Intel holds $50B debt and $21B cash, with CEO Lip-Bu Tan prioritizing core products under ongoing financial restructuring.
- Nvidia and Infineon to establish new architecture for power chips in AI datacentres
➀ Nvidia and Infineon collaborate to develop a centralized 800V HVDC power architecture for AI data centers, aiming to replace decentralized AC/DC systems and reduce energy losses;
➀ The new approach minimizes power conversion stages, improves efficiency, and supports higher power densities (projected over 1MW per rack by 2030), critical for large-scale AI workloads involving 100,000+ GPUs;
➂ Centralized HVDC enhances scalability, reliability, and sustainability while meeting the performance demands of next-gen AI infrastructure.