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  • Startup reported to have raised $100m to challenge ASML

    ➀ Substrate, a Peter Thiel-backed startup, raised $100 million to compete with ASML in lithography tools using X-Ray technology;

    ➁ Its proprietary particle accelerator-based X-Ray lithography claims to produce wafers at a fraction of ASML's EUV cost, achieving 2nm resolution;

    ➂ The team includes experts from TSMC, Applied Materials, and U.S. National Labs, with validation from defense and intelligence-linked investors like In-Q-Tel.

    ASMLSubstratesemiconductor
  • POLYN taking orders for neuromorphic analogue processor

    ➀ POLYN Technology has validated its Neuromorphic Analogue Signal Processing (NASP) chip, which performs AI inference in the analog domain with microwatt-level power consumption, significantly lower than digital processors;

    ➁ The NASP platform processes sensor signals in their native analog form, targeting always-on edge devices for applications like wearables, automotive sensing, and robotics;

    ➂ The first chip features a Voice Activity Detection (VAD) core, with future plans for speaker recognition and voice extraction, and evaluation kits are now available for ultra-low-power voice control development.

    AI chipsemiconductorEdge devices
  • Nordic Semi supports Bluetooth Channel Sounding

    ➀ Nordic Semiconductor launched an open-source Android app (nRF Toolbox) to support Bluetooth Channel Sounding, integrated with its nRF54L Series SoCs;

    ➁ The solution demonstrates interoperability with Google Pixel 10 smartphones, achieving ±1m accuracy within 20m range for applications like asset tracking and indoor positioning;

    ➂ Nordic played a key role in developing the Bluetooth LE standard, leveraging its expertise to drive adoption in healthcare, retail, and industrial sectors.

    semiconductorSoftwareAndroid
  • UCL opens London’s Space Enterprise Lab in IDEALondon

    ➀ University College London (UCL) has launched the Space Enterprise Lab (SEL) in IDEALondon, collaborating with the Satellite Applications Catapult (SAC), UK Space Agency (UKSA), and Space South Central to strengthen the UK's space innovation ecosystem;

    ➁ The lab is part of a national network of 15 SELs, offering resources and a collaborative environment for space sector startups and entrepreneurs;

    ➂ From November 2025 to March 2026, monthly events in Edinburgh, Leeds, and IDEALondon will support early-stage space ventures through networking and co-working opportunities.

    UCLSatellite Applications CatapultUK Space Agency
  • Top Ten (less 5) Smartphone Vendors In Q2

    ➀ Samsung led global smartphone shipments in Q2 2025 with 58 million units and 19.7% market share, followed by Apple (15.7%) and Xiaomi (14.4%);

    ➁ vivo and Transsion ranked fourth and fifth, with Transsion experiencing a 1.7% YoY decline;

    ➂ Total shipments increased 1% YoY to 295.2 million units, while 'Others' category declined by 3.1%.

    semiconductorSmartphoneIDC

October 28

  • Qualcomm launches accelerators for inference

    ➀ Qualcomm launched AI inference accelerator cards AI200 and AI250, targeting generative AI workloads like LLM/LMM with high performance and cost efficiency at rack scale;

    ➁ AI200 emphasizes LPDDR memory capacity (768GB per card) for low TCO, while AI250 adopts near-memory computing to boost bandwidth 10x and reduce power;

    ➂ Both feature liquid cooling, PCIe/Ethernet scalability, security protections, and a 160kW power design, supported by an optimized AI software stack for seamless deployment, with commercial availability in 2026 and 2027.

    QualcommAI inferenceNVIDIA
  • Samsung slashes 30% off HBM price to gain share

    ➀ Samsung reduced the price of its 12-layer HBM3E by 30% (from $300 to $200 per unit) to challenge Hynix's dominant market share (60-70%), while Samsung and Micron hold 20-30% and 15-20%, respectively;

    ➁ HBM4, set for Nvidia's Rubin accelerator in Q4 2026, is under evaluation by Nvidia, with Samsung leveraging its advanced 10nm-class 1c DRAM process to compete against Hynix's 1b process;

    ➂ Chinese firm ChangXin is entering the HBM market, having reportedly submitted an HBM3 test chip to Huawei.

    SamsungSK HynixHBM
  • Mouser signs Northern Technologies

    ➀ Mouser signs a global distribution agreement with Northern Technologies, a division of EDAC Group specializing in data communication shielding products;

    ➀ The agreement enables Mouser to stock a variety of Northern Technologies connectors, including D-subminiature solder cup connectors, dust covers, and crimp connectors, featuring high-density designs, durable materials (steel, copper alloy), and robust electrical specifications (e.g., 3A current, 250V AC voltage);

    ➃ Products emphasize protection against environmental contaminants, minimal signal loss, and compatibility across temperature ranges (-55°C to 105°C).

    MouserNorthern Technologiessemiconductor
  • Airbus, Leonardo, Thales unite for new European space company

    ➀ Airbus, Leonardo, and Thales have signed an MoU to establish a joint space company, pooling resources in satellite manufacturing, space systems, and services to strengthen Europe’s competitiveness in the global space market.

    ➁ The new entity, targeting operational status by 2027, aims to bolster European autonomy in critical space infrastructure, including telecoms, navigation, and Earth observation, while supporting national security initiatives.

    ➂ The combined company will employ approximately 25,000 people with an annual turnover of €6.5 billion, owned 35% by Airbus and 32.5% each by Leonardo and Thales, under a balanced governance structure.

    AirbusLeonardoThales

October 27

  • Mercedes-Benz unveils solar panel paint job on steer-by-wire vehicle

    ➀ Mercedes-Benz introduced the Vision Iconic concept car featuring steer-by-wire technology and Solar Paint, a photovoltaic coating that harvests energy to extend driving range by up to 7,450 miles annually;

    ➁ The vehicle aims for Level 4 autonomous driving and uses artificial neural networks to enhance safety systems, potentially reducing data processing energy by 90%;

    ➂ The design includes a futuristic Art Deco-inspired interior with a blend of analog and digital elements, emphasizing comfort and luxury.

    Mercedes-BenzautomotiveAI
  • Nisshinbo JFET input op-amp

    ➀ Nisshinbo Micro Devices launched the MUSES8921, a JFET input dual op-amp for high-fidelity audio applications in home, professional, and automotive systems;

    ➁ Built on its predecessor MUSES8920/A, the chip features ultra-low noise (8.0 nV/√Hz), minimal distortion (0.0004%), and a high slew rate (25 V/µs) for precise audio reproduction;

    ➂ Designed with optimized circuit layout and flexible voltage support (±3.5 V to ±17 V), it comes in compact packages (EMP-8-AN, DFN4035-8-GR) for space-constrained applications.

    semiconductorAnalog Bitsautomotive
  • 20% growth for private wireless this year; none for public wireless

    ➀ Private wireless RAN revenues surged with 20% growth in 2025, while public wireless remained flat;

    ➁ Huawei, Nokia, and Ericsson dominated private wireless RAN revenue in 1H25, with China leading regionally but non-China markets accelerating faster;

    ➂ Private RAN is projected to account for 5-10% of total RAN by 2029, contrasting with a 2% annual decline in public RAN.

    HuaweiNokiaEricsson
  • Alice & Bob instal quantum chip fabrication equipment

    ➀ Alice & Bob, alongside PLASSYS-BESTEK and the French defense innovation agency (AID), delivered the SQUID-6 UHV quantum chip fabrication tool for the ULTRACAT project;

    ➁ The equipment supports a new Paris lab to prototype cat-qubit chips, aiming to accelerate fault-tolerant quantum processor development;

    ➂ The project enhances Josephson junction fabrication technology, backed by French defense funding to boost Europe’s quantum sovereignty.

    Alice & BobPLASSYS-BESTEKsemiconductor

October 24

  • Tesla’s Profits Take A Dive

    ➀ Tesla's Q3 2025 profits dropped 37% YoY to $1.37 billion, continuing a year-long decline;

    ➁ The company cited U.S. tariffs and restructuring costs as key factors, with cumulative Jan-Sept profits also down 37% compared to 2024;

    ➂ Analysts anticipate a tougher Q4, predicting slowed sales growth and noting Tesla's loss of EV market leadership to BYD.

    automotivesemiconductor

October 23

  • 25,000 pixel/inch 25frame/s reflective micro colour display

    ➀ A Swedish research team developed a reflective micro-display with 25,000 pixels per inch (25,000 dpi), the smallest pixels to date, using metamaterial nano-structures and a three-level geometric hierarchy to achieve cyan, magenta, and yellow sub-pixels;

    ➁ The display uses tungsten trioxide nano-discs and lithium-ion electrolyte switching (±4V) for color control, enabling 40ms response time, though it currently lacks per-pixel addressing;

    ➂ The proof-of-concept demonstrated a 1.9mm-tall reproduction of Gustav Klimt's "The Kiss" using 560nm-sized pixels, showcasing human-eye-level resolution potential for future VR/AR or ultra-compact displays.

    Metamaterialmicro-displaysemiconductor
  • Fable: The Contraption Which Made History

    ➀ The article recounts a fable about a historic 1876 contraption (likely Alexander Graham Bell's first telephone) and its replica;

    ➁ The moral emphasizes that early versions of groundbreaking innovations often lack aesthetic appeal;

    ➂ It reflects on the significance of foundational technological advancements despite their initial imperfections.

    semiconductorInnovationHistory
  • French data centre AI inference chip ‘in production’

    ➀ French company Vsora announced the production of its Jotunn8 AI inference chip, targeting data centers with claims of energy efficiency and high performance (3,200 Tflop);

    ➁ The company emphasizes Europe's technological competitiveness but lacks details on floating-point operation type and power consumption benchmarks;

    ➂ Full-scale production is scheduled for Q1 2026, backed by $46 million in recent funding.

    AI chipHPCIntegrated Circuits
  • Innospace space startup gets KASA approval for first LEO launch

    ➀ South Korean space startup Innospace received the first private commercial launch permit from KASA for its 'Spaceward' mission, deploying satellites from Brazil, India, and South Korea into LEO via the HANBIT-Nano rocket;

    ➁ The launch is scheduled between October 28 and November 28 at Brazil’s Alcântara Space Center, where Innospace built its own platform and previously conducted a sub-orbital test in 2023;

    ➂ This milestone marks Innospace’s entry into the commercial satellite launch market, supported by South Korean authorities for safety and technical oversight.

    South KoreaSpacesemiconductor
  • What caught your eye? (HBM market, Eye Implant, Space Shield)

    ➀ Saras Micro Devices introduced a 3D vertical power delivery system to reduce energy loss and save board space;

    ➁ China plans significant investments in High Bandwidth Memory (HBM) to bolster its AI industry;

    ➂ The European Commission proposed a 'space shield' defense initiative as part of its 2030 roadmap.

    HBMChinaSpace
  • Red Semi launches Ordo1

    ➀ RED Semiconductor launched Ordo1, an AI and flow control accelerator IP core for RISC-V processors, targeting energy-efficient edge AI applications;

    ➁ The IP core claims 500% acceleration in matrix-heavy workloads and over 90% power reduction compared to standard RISC-V, while requiring 100 times less code;

    ➂ Backed by partnerships with Aion Silicon and Codasip, plus Seed+ funding, RED joined RISC-V International to align with open standards and expand commercialization.

    RISC-VAIsemiconductor
  • Imec opens Heilbronn hub

    ➀ Imec inaugurated its new hub in Heilbronn, Germany, focusing on advancing chiplet-based architectures for the automotive industry through collaboration with German industry and research partners;

    ➁ The hub is a key partner in the CHASSIS project, aiming to develop modular hardware for software-defined vehicles and enhance Europe’s automotive competitiveness;

    ➂ Imec signed an MoU with the Technical University of Munich to foster knowledge sharing and advanced chip design training, strengthening Baden-Württemberg’s semiconductor ecosystem.

    IMECchipletautomotive
  • Open Cosmos completes MANTIS mission

    ➀ Open Cosmos completed the two-year MANTIS mission, utilizing an Earth Observation satellite equipped with a high-resolution camera and AI processor to deliver real-time environmental data;

    ➁ The mission captured over 10,000 orbits, providing actionable insights for energy, mining, and environmental sectors while advancing AI integration in space technology;

    ➂ The satellite will safely de-orbit without leaving debris, aligning with sustainability goals and setting a precedent for cleaner space missions.

    AIEnvironmental ProtectionOpen Cosmos
  • JEDEC standard targets LPDRAM modules for AI data centres

    ➀ JEDEC is finalizing the JESD328 standard (SOCAMM2) for low-profile LPDRAM modules tailored for AI data centers, targeting high-bandwidth and energy efficiency;

    ➁ The LPDDR5/5X-based modules support up to 9.6 Gb/s per pin, reduce cooling/energy demands, and integrate an SPD device for enterprise deployment;

    ➂ The compact design aims to meet the scalability and performance requirements of AI training and inference servers in high-density data centers.

    AIDRAMsemiconductor
  • The Parliamentary Gender Balance

    ➀ Only four countries (Andorra, Mexico, Bolivia, UAE) have near 50-50 gender balance in their lower parliamentary houses, while Rwanda, Cuba, and Nicaragua have higher female representation;

    ➁ Europe shows disparities: Sweden, Finland, and Iceland lead with ~45% women MPs, while Hungary (15.2%) and Bulgaria (21.3%) lag;

    ➂ Globally, Nigeria (4.2%), Japan (15.7%), and India (13.8%) struggle with low female parliamentary participation, though India plans to increase representation to 33% post-2030 census.

    DemocracyGender ParityGovernment

October 22

  • Dracula raises €30m

    ➀ Dracula Technologies secures €30M Series A funding backed by French State and industrial partners to scale production of ambient light-powered IoT solutions;

    ➁ Plans to quadruple roll-to-roll photovoltaic module capacity to 600M cm²/year and expand global manufacturing;

    ➂ Targets battery replacement in smart buildings/asset tracking, achieving 95% production yield for sustainable energy harvesting.

    Dracula TechnologiesIoTSustainability

October 21

  • TSMC to break ground on 1.4nm fab on Nov 5th

    ➀ TSMC will begin constructing its 1.4nm fab in Taichung on November 5th, with a $49 billion investment, targeting mass production by H2 2028 and generating up to $15.9 billion in annual revenue;

    ➁ Due to strong demand for 1.4nm chips (priced at $45k per wafer), TSMC will build four 1.4nm fabs simultaneously, revising initial plans for two 1.4nm and two 1nm fabs;

    ➂ The move aims to solidify TSMC's process leadership amid competition from Intel's 18A and Samsung's 2nm advancements, with TSMC opting against high-NA EUV tools for cost and maturity reasons.

    TSMCIntelSamsung
  • HyImpulse secures €30m funding for hybrid propulsion

    ➀ HyImpulse Technologies secured €30 million in Series A funding, including €15 million in equity, bringing total capital raised to €74 million since 2018;

    ➁ Funds will accelerate the development of its SL1 orbital rocket (capable of carrying 600kg payloads) and expand production capacities, targeting a first orbital launch in 2027;

    ➂ The SL1 uses hybrid engines with paraffin and liquid oxygen for cost efficiency and safety, featuring a new turbopump system and serial production of hardware.

    HyImpulseCampus FoundersSpace Technology
  • Then As Now

    ➀ The article parallels the semiconductor industry's speculative boom 64 years ago with today's AI industry, where unproven companies and financial operators drive stock surges before tangible product outputs;

    ➀ Sidney Siegel's 1961 critique highlights immature management and financial exploitation, mirroring current concerns about the fusion of tech and finance;

    ➂ The historical analogy warns of recurring risks in emerging technology sectors fueled by investor hype rather than operational substance.

    semiconductorAIFinancial

October 20

  • Molex to acquire Smiths Interconnect

    ➀ Molex announces acquisition of Smiths Interconnect, following its purchase of AirBorn in 2024, to strengthen its aerospace/defense and industrial market presence;

    ➁ Smiths Interconnect provides advanced electronic and RF products for aerospace, defense, and semiconductor test sectors, with operations across 12 countries;

    ➂ The £1.3bn deal aligns with Smiths Group's strategic shift toward industrial engineering and is expected to close by mid-2026 pending regulatory approval.

    MolexSmiths Interconnectinterconnect
  • Arm’s auto chiplet standard

    ➀ Arm contributes its vendor-neutral Foundation Chiplet System Architecture (FCSA) to the Open Compute Project to establish universal standards for automotive chiplet integration;

    ➁ FCSA aims to support datacentre-class performance for vehicle compute systems like ADAS and is designed as ISA-neutral to ensure openness across architectures;

    ➂ Arm collaborates with BMW, imec, and LG Electronics to advance FCSA adoption, leveraging prior ecosystem-building experience from AMBA and SOAFEE initiatives.

    ARMautomotivechiplet