➀ AMD 对其当前和未来的技术领域地位表示信心；

➁ AMD 表示其 AI 努力是“首要战略重点”；

➂ AMD 在上一季度实现了创纪录的服务器和 PC 处理器销售额。

➀ Dr. Jingyuan Xu from Karlsruhe Institute of Technology (KIT) was awarded the 'For Women in Science' prize for her research on eco-friendly cooling technologies using the elastocaloric effect, eliminating climate-damaging refrigerants;

➁ Her work spans applications from micro-scale electronics cooling to large systems like air conditioners, addressing 20% of global electricity consumption from conventional cooling methods;

➂ The award, partnered by L’Oréal and UNESCO since 1998, highlights the critical role of women in science and technological innovation for a sustainable future.

➀ The UK and US announced a $42 billion 'Tech Prosperity Deal' with Nvidia deploying 120,000 GPUs to support AI and quantum computing initiatives;

➁ STMicroelectronics reached agreements to avoid layoffs at its Agrate site in Italy and unveiled a $60 million investment in a Panel-Level-Packaging (PLP) production line in France;

➂ China launched an anti-dumping probe targeting US analog ICs using 40nm and above process technologies.

➀ Microchip introduces a reference design using dsPIC33 DSCs for advanced sensor interfacing, integrating DSP engines and safety mechanisms for automotive/industrial systems;

➀ The design supports ISO 26262/IEC 61508 compliance with FMEDA reports, safety libraries, and diagnostic tools to streamline development;

➀ Includes hardware/software implementation examples, co-operative schedulers, and safety diagnostics to accelerate functional safety-focused designs.

➀ Vishay Intertechnology introduces industry-first automotive-grade Y1-rated ceramic capacitors in SMD packages for EVs, combining safety certification with surface-mount design;

➁ Capacitors offer 500 VAC (Y1) and 1500 VDC ratings, capacitance up to 4.7 nF, and AEC-Q200 qualification for critical EV systems like chargers and inverters;

➂ Compact SMD format enables automated assembly, reduces PCB footprint, and meets stringent automotive humidity/thermal reliability requirements with IEC60384-14 compliance.

➀ Apple discussed establishing a folding iPhone test production line in Taiwan, with mass production planned in India to boost market expansion;

➁ Apple's anticipated entry into the folding phone market by late 2026 is projected to increase global adoption from 1.6% to over 3%, driven by its brand influence;

➂ Challenges include relocating Chinese engineers from India due to government recalls, while Taiwanese suppliers secure land for a pilot line requiring ~1,000 operators.

➀ The Q2 enterprise WLAN market grew 13.2% YoY to $2.6 billion, driven by Wi-Fi 6E/7 adoption, which expanded bandwidth in the 6 GHz band;

➁ Wi-Fi 7 accounted for 21.2% of dependent AP revenues (up from 11.8% last quarter), while regional growth varied (Americas +17%, China -6.6%);

➂ Cisco led with 37.8% market share, followed by HPE Aruba, Ubiquiti, Huawei, and Juniper, with HPE finalizing its Juniper acquisition in July 2025.

➀ PI introduces the A-361 air-bearing XY-rotation stage, a compact 3-axis nanopositioning platform with a 39.5 mm profile, 200 mm motion diameter, 5 mm X/Y travel, and 2° rotational motion;

➁ Utilizes frictionless air bearings and voice-coil direct drives for high stability, maintenance-free operation, and a vacuum chuck for delicate substrates like wafers;

➂ Designed for semiconductor, photonics, and µLED manufacturing applications, supporting cleanroom environments and integration with multi-axis systems for precision alignment tasks.

➀ Microchip introduces DualPack 3 (DP3) IGBT7 power modules with 15–20% lower switching/conduction losses and enhanced thermal endurance (up to 175°C) for industrial, renewable energy, and e-mobility applications;

➁ The compact modules reduce system complexity, offer high current ratings (300A–900A), and align with standard EconoDUAL™ designs for supply chain flexibility;

➂ Targets motor drives, data centers, EVs, and agricultural systems by addressing challenges like dv/dt stress and efficiency demands in power electronics.

➀ The QSolid project, led by Forschungszentrum Jülich and Fraunhofer IZM-ASSID, aims to develop a German quantum computer with superconducting quantum chips and reduced error rates, utilizing an interposer to optimize qubit-electronics connections;

➁ A mid-term prototype with 10 qubits and integrated software was launched in 2025, with plans to scale performance by 2026 through advanced processor designs;

➂ The interposer supports over 10,000 high-density connections, thermal decoupling of components, and ongoing scalability tests, backed by €76.3 million in government funding to strengthen Germany’s quantum research sovereignty.

➀ The Fraunhofer IZM-ASSID, part of the QSolid project with 24 German institutions, is developing a quantum computer using superconducting qubits to reduce error rates, employing an interposer to optimize connections between qubits and control electronics;

➁ The 20x15mm interposer enables over 10,000 ultra-thin wirings and thermally decouples the quantum chip, with ongoing tests to scale its size for higher wiring densities;

➂ Funded by €76.3 million from the German government, QSolid aims to strengthen Germany’s quantum computing competitiveness, targeting industrial applications in chemistry, materials science, and healthcare by 2026.

➀ A research consortium led by the University of Duisburg-Essen (UDE), TU Ilmenau, and eemagine Medical Imaging Solutions GmbH won second place in the DLR Challenge Industry for their innovative dry EEG system, designed to monitor astronauts' mental health and aid neurological diagnostics.

➁ The EEG technology uses novel dry electrode sensors, tested successfully in parabolic flights, to enable real-time stress management and address mental health challenges in extreme environments like space missions or Antarctic research stations.

➂ The consortium aims to advance neurodiagnostics for long-term space missions and clinical neurology, emphasizing user-friendly design and automated mental-state recognition for broader applications in healthcare and aerospace.

➀ China's Cyberspace Administration instructs domestic tech companies to avoid purchasing Nvidia's H20 GPUs and RTX Pro 6000D AI chips, restricted under U.S. export rules;

➁ Despite this, China still seeks Nvidia's high-end chips, but its officials are angered by U.S. Commerce Secretary Howard Lutnick's remarks about selling only lower-tier chips to China;

➂ Nvidia CEO Jensen Huang expressed disappointment in U.S.-China tensions and emphasized the strategic importance of maintaining U.S. chip technology as the global standard.

➀ SMIC is testing a domestically developed immersion DUV lithography tool by Shanghai-based Yuliangsheng, aiming for production readiness in at least two years;

➁ Yuliangsheng, a subsidiary of Shenzhen's Si Carrier, is also working on an EUV machine codenamed 'Mount Everest';

➂ China’s DUV efforts include SMEE’s 28nm-capable system and existing ASML machines purchased before U.S. export restrictions.

➀ Microelectronics focuses on designing and fabricating miniature electronic components and integrated circuits (ICs) enabling modern systems like AI accelerators, EVs, and IoT devices;

➁ Key processes include photolithography, materials innovation (Si, GaN, SiC), and trends like heterogeneous integration and advanced packaging to overcome Moore's Law limitations;

➂ Industry challenges include rising fab costs, supply-chain resilience, and talent gaps, with future advancements expected in chiplet ecosystems and wide-bandgap semiconductor scaling.

➀ The article compares energy generation costs per MWh across various sources, highlighting gas ($30-$75/MWh for existing plants, up to $110 with construction), coal ($70-$170), and nuclear ($140-$220);

➁ Renewable sources like onshore wind ($40-$86) and utility-scale solar ($78) are more cost-effective, while offshore wind ($70-$157) and nuclear projects like Vogtle 3-4 ($169-$228) face higher costs;

➂ Single-cycle gas plants remain expensive but critical for peak demand due to quick activation capabilities.

➀ Physical AI focuses on enabling intelligent systems to interact with dynamic real-world environments through advanced sensors, multi-physics principles, and simulation tools;

➁ Physics-based simulation is critical for testing sensor performance under diverse conditions and generating high-fidelity synthetic data for AI training;

➂ Traditional linear engineering processes are insufficient, requiring integrated multi-domain collaboration (hardware, software, sensors) and EDA-powered solutions to meet modern development demands.

➀ The research project "MotorInspector" by IPH and MFP aims to automate air gap measurement in electric motors to enhance efficiency, longevity, and production costs;

➁ Focused on axial-flux motors (disk rotors), which are critical for e-mobility, the project integrates sensor-based measurement and robotic automation for quality control;

➂ Collaborating with industry experts, the team seeks practical insights to refine the automated system, targeting implementation in automotive and industrial motor production by 2027.

➀ Taiwan Expo 2025 highlighted Taiwan's leadership in electronics innovation through its Taiwan Excellence Pavilion, showcasing cutting-edge products like AI-powered laptops, high-speed SSDs, and advanced conferencing tools;

➀ Key exhibitors included AVer, IPEVO, MSI, Team Group, and Transcend, emphasizing smart living solutions such as the MSI Raider 18 HX gaming laptop and Transcend ESD310 portable SSD;

➂ The event underscored Taiwan's commitment to R&D, quality, and collaboration, positioning itself as a global hub for transformative electronics and digital connectivity.

➀ ST reaches agreement to avoid layoffs at its Agrate site in Italy, abandoning initial plans for 1,200 redundancies in the country;

➁ The decision follows negotiations with Italian unions and government, with no structural changes planned at other Italian sites;

➂ ST attributes challenges to slow EV market adoption impacting its SiC business but eyes Agrate expansion by 2027 amid improved market conditions.