➀ The Phison E31T SSD meets high expectations with excellent overall performance, high power efficiency, and PCIe 5.0 bandwidth. ➁ The controller offers improvements over previous generations with a new LDPC error correction and a move to TSMC's 7nm process node. ➂ BiCS8 flash technology is introduced, promising higher performance and power efficiency.

➀ The Dimensity 9400 becomes the first SoC to surpass 3 million points in AnTuTu benchmarks; ➁ It achieves a score of 3,007,853 on the Vivo X200 Pro, making it 47 percent faster than the Snapdragon 8 Gen 3; ➂ The GPU score sees a significant boost, with the SoC featuring ARM's newest Immortalis-G925 MP12 GPU; ➃ MediaTek's new chip is expected to be mass produced on TSMC's second-generation 3nm process, enhancing its efficiency.

➀ The Intel Xeon 6900P series, with 128 cores and 12 memory channels, marks Intel's return to server CPU leadership after trailing AMD for seven years; ➁ The series features new process technology and accelerators, aiming to compete with AMD's top-end parts; ➂ Intel's design strategy includes integrating memory controllers into compute tiles for better performance.

➀ The Kingston NV3 is a budget-friendly SSD with decent power efficiency and cooling, but its performance is inconsistent. ➁ Kingston's NV3 targets the budget market with QLC NAND and updated controllers, aiming to improve on the NV2. ➂ The NV3 uses the SMI SM2268XT2 or Phison E27T controller and offers BiCS6 TLC and QLC flash options, aiming for a balance between cost and performance.

➀ AMD's Ryzen 9000 CPUs experience a 10% frequency drop when executing AVX-512 instructions, unlike Intel's CPUs which typically suffer from more substantial clock speed drops; ➁ AMD's implementation on the Zen 5 architecture is efficient but at the cost of die size; ➂ The mobile parts of AMD use a double-pumped AVX-256 approach to execute AVX-512 instructions, which allows for more cores in the processors.

➀ Leaked benchmark results show a significant multi-core performance boost for the Intel Core Ultra 5 245K; ➁ The CPU scores 850.6 points in single-core testing and 10,907.1 points in multi-core testing; ➂ Despite not having hyperthreading, the chip performs well in multi-core tests, reaching about 90% of the performance of the higher-tier Intel Core i7-14700K.

➀ AMD introduces AFMF 2, an improved frame generation technology; ➁ VGM allows users to convert up to 75% of system RAM into VRAM; ➂ Performance can increase by up to 78% with AFMF 2 and VGM.

➀ Guanxun's revenue reached 2.815 billion RMB in the first half of 2023 and 3.11 billion RMB in the first half of 2024, with a year-on-year increase of 10.48%; ➁ Data and access revenue was 1.49 billion RMB, up 12.8%;➂ Transmission business line revenue was 1.575 billion RMB, nearly the same as last year, with a 0.5% increase; ➃ The total market value from Q3 2023 to Q1 2024 was 13.076 billion, up 5% year-on-year; ➄ AI market, which is part of the datacom market, saw its share increase from 46.1% in Q1 2023 to 53.7% in Q1 2024; ➅ The telecommunication market share decreased from 40.6% in Q1 202 to 35.1% in Q1 2024; ➆ The global access optical module market, including 5G and PON modules, has over 60% of the market in China, with the three major Chinese operators' capital expenditure in Q1 2024 down 5.53% year-on-year and 9.49% compared to Q1 2023.

➀ An extensive benchmark of GPUs from Nvidia, AMD, and Intel over the past ten years; ➁ Performance hierarchy based on benchmarks at 1080p ultra and 1440p ultra resolutions; ➂ Analysis of ray tracing performance and the impact of DLSS and FSR on gaming.

➀ AMD's Z2 Extreme processor is the successor to the Z1 Extreme, powering current flagship gaming handhelds; ➁ The Z2 Extreme is expected to offer better efficiency, battery life, and performance; ➂ AMD's Fluid Motion Frames 2 aims to improve performance and battery life; ➃ The Z2 Extreme could significantly improve battery life, making future handhelds more attractive to mobile gamers.

➀ The Zen 5 architecture is immune to the Inception vulnerability; ➁ No performance regressions from Inception mitigation on Zen 5; ➂ Zen 3 and Zen 4 require software mitigations for Inception.

➀ Researchers at Martin Luther University Halle-Wittenberg have developed a new gel to enhance the safety and performance of lithium-ion batteries. ➁ The gel prevents electrolyte leakage and improves battery lifespan and efficiency. ➂ Initial tests show increased stability and potential for easier recycling, though more long-term studies are needed before industrial-scale production.

➀ AMD is rumored to increase the TDP of Ryzen 7 9700X and Ryzen 5 9600X to 105W. ➁ This move aims to enhance multi-core performance and competitiveness against Intel's 14th Gen CPUs. ➂ The increased TDP would also align with previous Ryzen models, potentially improving performance without significant spec regressions.

1. The Intel Core Ultra 9 QS, running at 250W, showed a 17.5% performance improvement over the Core i9-14900K in the Cinebench R23 nT test but averaged a 4% uplift across other benchmarks. 2. The QS version demonstrated a 4.3% performance boost over Intel's current flagship CPU, with significant improvements in Cinebench R23 and Geekbench. 3. The Core Ultra 9 QS outperformed the Ryzen 9 9950X by 2% at 160W but lagged by 6.5% at 230W.

1. The Ryzen AI 9 HX 370 achieved 2010 points in single-core and 23302 points in multi-core Cinebench R23 tests. 2. AMD claims the Ryzen AI 300 series will outperform Intel's Core Ultra 9 185H by 20% in single-core and 40% in multi-core performance. 3. The HX 370 surpasses the Core Ultra 9 185H by approximately 16% in single-core and 36% in multi-core performance.

1. The upcoming AMD Ryzen 9 9950X CPU is reported to be 22% faster than its predecessor, the Ryzen 9 7950X, in Blender benchmarks at 230W PPT. 2. Igor_Kavinski, an AnandTech forum member, has shared performance data of the Ryzen 9 9950X, noting that it achieved up to 5.62GHz clock speeds and remained below 62ºC in temperature. 3. The Ryzen 9000 series is set to launch on July 31st, with rumors suggesting it will be priced similarly to the Ryzen 9 7950X.

1. Corning introduces Polylink plastic connectors; 2. These connectors maintain performance standards; 3. They reduce costs and the number of insertions.

1. Introduction to High Bandwidth Memory (HBM); 2. Key features of HBM: high memory bandwidth, low power consumption, large memory capacity, and fast transfer rates; 3. Importance of understanding HBM characteristics for appreciating its impact on technology.