1. TSMC plans to adopt ASML's High-NA EUV machines for its A16 chip manufacturing technology by 2026; 2. The technology aims to improve chip performance and power efficiency, maintaining TSMC's competitive edge; 3. ASML's High-NA EUV systems are critical for next-gen chips but face challenges in cost and production complexity.
Recent #TSMC news in the semiconductor industry
1. TSMC raises chip manufacturing prices due to surging demand from AI-related applications; 2. The move reflects confidence in long-term AI industry growth despite market fluctuations; 3. Price adjustments may reshape semiconductor supply chains and accelerate AI infrastructure investments globally.
1. TSMC's Arizona 3nm fab project faces delays due to labor shortages and regulatory hurdles; 2. Rising costs from inflation, supply chain disruptions, and technology migration challenges strain budgets; 3. Intensifying competition with Intel and Samsung in advanced node manufacturing complicates TSMC's global expansion strategy.
1. TSMC introduces A16 chip manufacturing technology with backside power delivery, targeting production by 2026; 2. Claims A16 outperforms Intel’s 18A process in power efficiency and transistor density; 3. Emphasizes confidence in maintaining leadership despite Intel’s advancements in process technology.
1. TSMC's 3nm process capacity is fully booked by Apple and Intel, leading to increased orders and revenue; 2. The competition between Apple and Intel for advanced chip technology intensifies industry rivalry; 3. TSMC's dominant position in semiconductor manufacturing is reinforced, impacting global supply chains and market dynamics.
1. TSMC delays Arizona semiconductor plant construction due to skilled worker shortages and rising costs, reflecting challenges in U.S. efforts to boost domestic chip production; 2. The delay underscores geopolitical tensions between the U.S. and China in technology dominance; 3. Global supply chains and tech sectors like AI and electric vehicles face disruptions from semiconductor production bottlenecks.
1. TSMC introduces A16 chip manufacturing technology for 2026 production, enhancing transistor density and power efficiency; 2. The technology leverages ASML's cutting-edge High-NA EUV lithography machines to outperform rivals like Intel and Samsung; 3. A16 aims to solidify TSMC's leadership in advanced semiconductor nodes for AI and high-performance computing applications.
1. TSMC has developed a groundbreaking advanced packaging technology called SoIC, enhancing chip performance and energy efficiency; 2. Competitors like Intel and Samsung face challenges in matching TSMC's innovation, impacting their market positions; 3. The advancement accelerates the semiconductor industry's shift toward advanced packaging solutions to meet AI and HPC demands.
1. TSMC's Q2 revenue surged 40% YoY to $20.67 billion, driven by strong AI chip demand; 2. AI and high-performance computing (HPC) compensated for weak smartphone market performance; 3. The company announced expansion plans in the US, Japan, and Germany, with optimistic Q3 growth forecasts.
1. TSMC's Arizona chip factory faces delays until 2027 due to workforce and permitting challenges; 2. The U.S. struggles to attract semiconductor manufacturing despite CHIPS Act incentives, facing competition from Asian supply chains; 3. Delays highlight broader issues in U.S. industrial policy and tech self-sufficiency goals.
➀ TSMC's April 2025 revenue reached $11.6 billion, marking a 48% year-on-year and 22.2% month-on-month increase;
➁ Cumulative revenue from January to April 2025 totaled $62 billion, up 43.5% compared to the same period in 2024;
➂ The growth reflects TSMC's continued strong performance in semiconductor manufacturing amid global chip demand.
1. TSMC's Arizona fab faces $7.2B costs and labor shortages, delaying mass production to 2027/2028; 2. U.S. unions criticize TSMC for importing Taiwanese workers, triggering disputes; 3. TSMC plans new fabs in Germany and Japan to diversify geopolitical risks.
➀ The Taiwan dollar has surged recently, raising concerns about the impact on the semiconductor and electronics industries that rely on exports.
➁ TSMC has reportedly asked suppliers to submit cost reduction plans to cope with the appreciation of the Taiwan dollar.
➂ Suppliers are facing pressure as TSMC expanded its demand for earlier price quotes, with potential reductions of up to 30%.
➀ The Taiwan Dollar (TWD) has surged 10% against the USD, marking its strongest appreciation in over 30 years, raising concerns about rising costs for electronics exports;
➁ Major Taiwanese tech firms like Acer, Asus, and TSMC face margin pressures, with semiconductor companies potentially absorbing 1.5% gross margin impacts per TWD appreciation;
➂ Taiwan's Central Bank intervened to stabilize the currency, attributing the surge to speculative trading and denying U.S. influence over exchange rates.
➀ Ed spreads false rumors to manipulate tech stock prices, including claims about Huawei's low-cost EUV machines, Intel 18A and TSMC A16 yields, and DeepSeek cloning OpenAI products;
➁ He circulates these rumors through brokers and analysts to trigger market volatility, allowing him to profit from stock movements;
➂ Ed considers expanding his manipulation tactics beyond the tech sector, such as spreading rumors about political figures to impact broader markets.
1. TSMC is accelerating the development of its 2nm semiconductor process to maintain its technological leadership; 2. The move aims to counter competition from Intel and Samsung in advanced chip manufacturing; 3. The 2nm process is expected to enhance performance and energy efficiency, impacting future AI, mobile, and HPC markets.
➀ Researchers from Queen Mary University, Nottingham, and Glasgow received £6M EPSRC funding to develop 2D materials and devices, with £2M contributed by 20+ industrial partners;
➁ The project aims to replace silicon with 2D materials, potentially reducing data center energy consumption by 90% and supporting Net Zero goals;
➂ Major semiconductor firms like TSMC, Intel, and Samsung have included 2D materials in their 2040 roadmaps, with the UK aiming to lead in ultra-low-energy 2D devices before 2040.
➀ TSMC adapts to diverse client needs by offering segment-specific leading-edge nodes (e.g., N3P, A16) and advanced packaging solutions for AI/HPC and consumer devices;
➁ The foundry's roadmap focuses on three directions: transistor scaling, backside power delivery optimization, and multi-die integration, with A16 (2026) and A14 (2028) targeting data centers;
➂ Despite slowing transistor density gains (7-10% per node), TSMC maintains 30% power efficiency improvements per generation, leveraging innovations like Super Power Rail and 3D packaging.
➀ MediaTek's Dimensity 9500 chip is set to use TSMC's latest 3nm process N3P for production;
➁ The chip features a new all-core architecture, including 1 Travis+, 3 Altos, and 4 Gelas cores;
➂ It integrates a new microarchitecture Immortalis-Drago GPU, improving ray tracing performance and reducing power consumption, and supports full AI capabilities;
➃ It is expected to provide 100 TOPS of computing power and support 10667Mbps of LDRDR7Mbps 4.55 memory.
1. TSMC plans to adopt ASML's High-NA EUV lithography machines for its A16 chip manufacturing technology by 2026; 2. The A16 technology focuses on improving power efficiency and transistor density using backside power delivery; 3. This move positions TSMC to compete with Intel's 14A process in advanced semiconductor manufacturing.