05/01/2025, 06:34 AM UTC
聯發科天璣9500晶片曝光！採台積電N3P製程 全大核心架構MediaTek Dimensity 9500 Chip Unveiled! Adopting TSMC's N3P Process, All Big Core Architecture
➀ 联发科的天玑9500芯片将采用台积电最新的3nm制程N3P进行生产；
➁ 芯片采用新的全大核架构，包括1个Travis+、3个Altos和4个Gelas核心；
➂ 它集成了新的微架构Immortalis-Drago GPU，提升了光线追踪性能并降低功耗，并支持全AI功能；
➃ 预计可提供100TOPS的算力，并支持10667Mbps的LDRDR7Mbps 4.55内存。
➀ MediaTek's Dimensity 9500 chip is set to use TSMC's latest 3nm process N3P for production;
➁ The chip features a new all-core architecture, including 1 Travis+, 3 Altos, and 4 Gelas cores;
➂ It integrates a new microarchitecture Immortalis-Drago GPU, improving ray tracing performance and reducing power consumption, and supports full AI capabilities;
➃ It is expected to provide 100 TOPS of computing power and support 10667Mbps of LDRDR7Mbps 4.55 memory.
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