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seekingalpha

04/27/2025, 04:05 AM UTC

台积电A16技术将于2026年采用ASML高数值孔径EUV光刻机Lam Research Q3: NAND Upgrade Cycle Drives Growth; Downgrade To 'Hold'

1、台积电计划于2026年在其A16芯片制造技术中采用ASML的高数值孔径EUV光刻机；2、A16技术通过背面供电设计提升能效与晶体管密度；3、此举将使台积电在先进制程领域与英特尔14A工艺展开竞争。

1. TSMC plans to adopt ASML's High-NA EUV lithography machines for its A16 chip manufacturing technology by 2026; 2. The A16 technology focuses on improving power efficiency and transistor density using backside power delivery; 3. This move positions TSMC to compete with Intel's 14A process in advanced semiconductor manufacturing.

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