SemiVoice

seekingalpha

05/18/2025, 11:30 AM UTC

台积电宣称新芯片制造技术将超越英特尔18A制程2 Dividend Stocks I'm Wildly Bullish On

1、台积电发布采用背面供电技术的A16芯片制造技术，计划2026年投产；2、宣称A16在能效和晶体管密度上优于英特尔的18A制程；3、强调对保持技术领先的信心，尽管英特尔在制程领域取得进展。

1. TSMC introduces A16 chip manufacturing technology with backside power delivery, targeting production by 2026; 2. Claims A16 outperforms Intel’s 18A process in power efficiency and transistor density; 3. Emphasizes confidence in maintaining leadership despite Intel’s advancements in process technology.

---

本文由大语言模型（LLM）生成，旨在为读者提供半导体新闻内容的知识扩展（Beta）。