05/20/2025, 11:21 AM UTC
台积电新芯片制造技术将采用ASML高数值孔径EUV光刻机Are The UK And EU Getting Back Together?
1、台积电计划于2026年在其A16芯片制造技术中采用ASML的高数值孔径EUV光刻机；2、该技术旨在提升芯片性能和能效，保持台积电的竞争优势；3、ASML的高数值孔径EUV设备对下一代芯片至关重要，但面临成本和生产复杂性的挑战。1. TSMC plans to adopt ASML's High-NA EUV machines for its A16 chip manufacturing technology by 2026; 2. The technology aims to improve chip performance and power efficiency, maintaining TSMC's competitive edge; 3. ASML's High-NA EUV systems are critical for next-gen chips but face challenges in cost and production complexity.---
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