➀ Researchers developed a stretchable thermoelectric elastomer that converts body heat into electricity, enabling self-powered wearables and medical implants;

➀ The rubber-like material maintains high flexibility (up to 850% strain) and electrical conductivity through a polymer-N-DMBI composite design;

➂ Potential applications include health monitors, smart textiles, and implantable devices that harvest continuous energy from skin temperature gradients.

➀ India's electronics sector faces a critical transition from assembly-led manufacturing to design-led innovation, driven by strategic policies like PLI and DLI but hampered by talent gaps and slow industry-academia collaboration;

➁ Government initiatives (e.g., $7.5 billion chip fab proposals, ISM mission) aim to boost semiconductor production and R&D, yet indigenous IP creation lags despite global supply chain realignment;

➂ Education reforms and ecosystem-building are imperative to transform engineers from task executors to innovators, fostering homegrown brands and reducing reliance on imported components.

➀ The article lists leading Indian and global microscope suppliers for electronics quality control, including contact details and brands;

➁ It details microscope types (e.g., stereo, SEM, digital), key selection features (magnification, lighting), and technological advancements like AI-assisted inspection and 4K imaging;

➂ IPC standards for quality assurance and inspection procedures in semiconductor and PCB manufacturing are also highlighted.

➀ ETH Zürich students created a rotating multi-metal 3D printer that processes multiple metals simultaneously, drastically reducing production time;

➀ The machine, designed for aerospace and industrial applications (e.g., rocket nozzles, turbines), uses a rotating platform for continuous printing and precise gas flow control;

➂ ETH filed a patent for this innovation, which aims to scale for larger components and broader use in fields like e-mobility and aviation.

➀ Exploration of energy-efficient solid-state cooling technologies for thermal management;

➁ Highlighting a novel approach to STEM education aimed at making learning more engaging;

➂ Introduction of radiation-tolerant power devices designed for NewSpace and low Earth orbit satellite (LEOSat) applications.

➀ Fraunhofer ISI and IZM researchers forecast resource demand for 34 emerging technologies (e.g., electric vehicles, AI, data centers) by 2045, identifying critical materials like lithium and cobalt;

➁ Data centers and AI infrastructure are highlighted as major resource consumers, with exponential growth in data traffic posing supply chain risks;

➂ The study aims to inform Germany’s national resource strategy to mitigate supply bottlenecks and maintain industrial competitiveness amid geopolitical and environmental challenges

➀ Researchers at European XFEL demonstrated ultrafast control of ferroelectric material polarization using light pulses, decoupling it from lattice distortion for the first time;

➁ The breakthrough, achieved via high-energy laser and X-ray analysis, enables polarization changes in under a trillionth of a second, driven by photoexcited electrons;

➂ This paves the way for light-controlled, energy-efficient electronics with applications in data processing, sensing, and next-gen memory technologies.

➀ Fraunhofer IMM and Ki'tech collaborate to develop a disposable microfluidic patch for at-home potassium monitoring via interstitial fluid analysis;

➁ The solution targets dialysis patients to prevent hyperkalemia risks, offering real-time potassium level tracking via a smartphone app and wireless data transmission;

➂ Clinical trials are planned to validate the device, aiming to reduce hospital visits and empower patients with autonomous health management.

➀ Fraunhofer IDMT developed a car prototype with advanced acoustic sensors to enhance road safety for autonomous/semi-autonomous vehicles, enabling detection of sounds like sirens and children’s voices;

➁ The system uses AI algorithms for acoustic event recognition, integrates weather-resistant microphones, and offers driver monitoring via EEG/radar sensors and personalized in-car sound experiences;

➂ Funded by German institutions, the technology aims to improve autonomous driving by combining audio analysis with visual systems and will debut at IAA MOBILITY 2025.

➀ Q2 NAND revenue of the top five suppliers surged 22% QoQ to $14.67 billion, driven by price recovery and market demand;

➁ Samsung led with $5.2 billion revenue (up 23.8% QoQ) and 32.9% market share, followed by SK Hynix ($3.34 billion, up 52.5% QoQ) and Kioxia ($2.14 billion);

➂ Micron and SanDisk also saw growth, reflecting broader industry recovery in NAND memory.

➀ In 2008, Pulse-Link showcased early commercial progress in UWB technology, shipping initial products and reference designs for wireless HDMI and co-ax applications;

➁ The company's UWB tech achieved 890Mbits/sec throughput with JPEG2000 compression, addressing most HDMI needs despite lower rates than full 10.2Gbits/sec HDMI;

➂ Strong market interest emerged, with 80 reference designs sold post-CES, highlighting UWB's potential in high-speed data transmission.

➀ Intel received $5.7 billion from the U.S. government in exchange for a 10% stake to prevent the sale of its chip fab business;

➁ Struggling against TSMC and Samsung, Intel's foundry division faced a $13 billion loss in 2024, with potential plans to abandon 14A process development;

➂ The deal includes provisions to discourage majority stake sales, while SoftBank invests $2 billion, signaling confidence in government-backed Intel's stability.

➀ Researchers achieved record-high electronic quality in graphene using "proximity screening" with hexagonal boron nitride (hBN) layers, reducing charge fluctuations and achieving carrier mobility up to 5.7×10⁷ cm²/Vs;

➀ The ultrathin hBN-graphene heterostructure suppressed noise and enabled quantum phenomena like the quantum Hall effect, with potential applications in high-speed transistors and quantum technologies;

➂ The scalable fabrication method paves the way for disorder-free 2D material devices compatible with existing semiconductor processes.

➀ The U.S. Chips Act faces backlash as companies like TSMC threaten to reject subsidies if required to offer equity to the government;

➁ Chris Allexandre appointed as Navitas Semiconductor’s new CEO, succeeding founder Gene Sheridan;

➂ Qualcomm launches the Dragonwing Q-6690, the first mobile processor with integrated UHF RFID, and Prophesee introduces its GenX320 Starter Kit for Raspberry Pi 5, enabling neuromorphic vision applications.

➀ Infineon Technologies launched PSoC Control C3 Performance Line MCUs with Post-Quantum Cryptography compliance and PSA Level 3 certification, addressing quantum-era security threats;

➁ The MCUs integrate LMS for quantum-resistant firmware verification and hardware-accelerated SHA-2, while delivering enhanced real-time control for industrial applications like motor control and EV charging;

➂ Engineering samples will be available in late 2025, with mass production planned for 2026, offering hybrid ECC+PQC signing and scalability for power conversion and motor control systems.

➀ Researchers from Skoltech have published a monograph on "Unsourced Random Access," targeting efficient communication for millions of IoT devices in 5G Advanced/6G networks;

➁ The proposed method allows devices to connect without pre-coordination or identification, reducing delays and improving energy efficiency;

➂ The monograph integrates theoretical frameworks with practical implementations, supported by collaborations with MIT and other institutions under the Russian Science Foundation.

➀ Predicting the semiconductor industry's future remains highly uncertain, as seen in NVIDIA outpacing Intel in revenue and market cap despite past expectations;

➁ Industry dynamics hinge on technological shifts (e.g., CMOS adoption) and strategic bets (e.g., IBM's 8088 choice), with misaligned trends leading to failures;

➂ Success requires balancing investments, management, and engineering while navigating unpredictable market demands—making 'good guessing' a crucial skill.

➀ Fraunhofer FEP's Design-PV project developed decorative films using roll-to-roll nanoimprint lithography, enabling solar modules to blend seamlessly into building facades while retaining up to 80% efficiency of traditional modules.

➁ Key challenges included improving adhesion of films on ETFE substrates, addressed via a plasma process to enhance surface roughness for reliable bonding.

➂ Future steps include testing additional designs, assessing long-term durability, and presenting the technology at Radtech Europe Conference 2025.

➀ Fraunhofer FEP advances building-integrated photovoltaics (BIPV) using Nano-Imprint Lithography, enabling seamless solar module integration into facades without compromising aesthetics or efficiency.

➀ Decorative films on ETFE substrates achieve up to 80% efficiency of standard modules, with plasma treatments enhancing adhesion and weather resistance.

➂ Future steps include testing additional designs, colors, and long-term durability to boost BIPV adoption in architecture.

➀ The EU-funded Ambient-6G project (€8.4 million) aims to develop sustainable, battery-free IoT devices using ambient radio waves and backscatter communication, eliminating the need for disposable batteries.

➀ The technology leverages passive backscatter techniques, where IoT devices reflect and modify radio signals to transmit data, drastically reducing energy consumption.

➂ Challenges include improving signal processing for weak long-distance communication, with applications in retail (e.g., battery-free price tags) and logistics (real-time tracking).